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1.
The enhancement of the thermal conductivity, keeping the electrical insulation, of epoxy thermosets through the addition of pristine and oxidized carbon nanotubes (CNTs) and microplatelets of boron nitride (BN) was studied. Two different epoxy resins were selected: a cycloaliphatic (ECC) epoxy resin and a glycidylic (DGEBA) epoxy resin. The characteristics of the composites prepared were evaluated and compared in terms of thermal, thermomechanical, rheological and electrical properties. Two different dispersion methods were used in the addition of pristine and oxidized CNTs depending on the type of epoxy resin used. Slight changes in the kinetics of the curing reaction were observed in the presence of the fillers. The addition of pristine CNTs led to a greater enhancement of the mechanical properties of the ECC composite whereas the oxidized CNTs presented a greater effect in the DGEBA matrix. The addition of CNTs alone led to a marked decrease of the electrical resistivity of the composites. Nevertheless, in the presence of BN, which is an electrically insulating material, it was possible to increase the proportion of pristine CNTs to 0.25 wt% in the formulation without deterioration of the electrical resistivity. A small but significant synergic effect was determined when both fillers were added together. Improvements of about 750% and 400% in thermal conductivity were obtained in comparison to the neat epoxy matrix for the ECC and DGEBA composites, respectively. © 2019 Society of Chemical Industry  相似文献   
2.
We have investigated the characteristics of radiated electromagnetic (EM) waves from positive and negative partial discharges (PD) in epoxy resin and cross‐linked polyethylene. We found that there is a correlation among the EM level from PD, the positive PD current, and electrical trees. Therefore, the growth of an electrical tree produces a lot of positive PD. We have also investigated the characteristics of the frequency region of EM waves from PD in air, insulating oil, and liquid epoxy in addition to the above insulators. EM waves were detected in the frequency region of 40 MHz to 300 MHz from positive and negative PD in epoxy resin and cross‐linked polyethylene. EM waves were also detected in the frequency region of 40 MHz to 150 MHz from positive and negative PD in air. In the case of insulating oil and liquid epoxy, EM waves were detected in the frequency regions of 40 MHz to 150 MHz from positive PD, and 40 MHz to 250 MHz from negative PD. The frequency region differed depending on the material and the discharge polarity. Our investigation indicates that the cause is differences in electric field strength at the time of PD occurrence.  相似文献   
3.
含磷固化剂及固化环氧树脂的合成及表征   总被引:1,自引:1,他引:0  
以4,4′-二氨基二苯基甲烷(DDM)、苯甲醛和亚磷酸二乙酯为原料,合成了两种含磷固化剂PM1和PM2,用红外光谱、核磁共振氢谱对PM1和PM2的结构进行了表征。用DDM,PM1,PM2分别固化双酚A型(DGEBA)环氧树脂,得到DGEBA-DDM,DGEBA-PM1,DGEBA-PM2树脂,采用示差扫描量热法、热重分析(TGA)和极限氧指数(LO I)对DGEBA-DDM,DGEBA-PM1,DGEBA-PM2树脂的玻璃化转变温度(Tg)、反应活性、热稳定性和阻燃性能进行了表征。实验结果表明,PM2的反应活性比PM1低;DGEBA-DDM,DGEBA-PM1,DGEBA-PM2树脂的Tg分别为178,112,145℃;TGA结果表明,700℃时DGEBA-PM1和DGEBA-PM2树脂的成炭率分别为29%和35%,而700℃时DGEBA-DDM树脂的成炭率只有19%;DGEBA-PM1和DGEBA-PM2树脂的LO I值由DGEBA-DDM树脂的24%分别增至30%和35%,且阻燃性能大幅度提高。  相似文献   
4.
Epoxy novolac/anhydride cure kinetics has been studied by differential scanning calorimetry under isothermal conditions. The system used in this study was an epoxy novolac resin (DEN431), with nadic methyl anhydride as hardener and benzyldimethylamine as accelerator. Kinetic parameters including the reaction order, activation energy and kinetic rate constants, were investigated. The cure reaction was described with the catalyst concentration, and a normalized kinetic model developed for it. It is shown that the cure reaction is dependent on the cure temperature and catalyst concentration, and that it proceeds through an autocatalytic kinetic mechanism. The curing kinetic constants and the cure activation energies were obtained using the Arrhenius kinetic model. A suggested kinetic model with a diffusion term was successfully used to describe and predict the cure kinetics of epoxy novolac resin compositions as a function of the catalyst content and temperature. Copyright © 2003 Society of Chemical Industry  相似文献   
5.
新型壳聚糖/纳米二氧化硅杂化材料的制备与性能   总被引:10,自引:5,他引:5  
在纳米S iO2颗粒表面引入羟丙基氯活性基团,得到功能化S iO2颗粒,再将羟丙基氯化的S iO2颗粒交联固定在壳聚糖上,制备了一种新型的壳聚糖/纳米S iO2杂化材料(简称杂化材料);通过傅里叶变换红外光谱、透射电镜、扫描电镜方法对杂化材料进行表征,采用热重(TG)分析研究杂化材料的热性能;考察了杂化材料的沉降速率和对金属离子Ca2+和M g2+的吸附能力。电镜分析结果表明,杂化材料微粒为纳米尺度的无机S iO2加强化的微粒,S iO2颗粒分散在材料中,形成均匀的表面;TG分析结果表明,杂化材料的热性能有所提高;沉降实验测得壳聚糖和杂化材料作为吸附剂的沉降时间分别为130.3,68.5s,表明杂化材料的沉降速率比壳聚糖的沉降速率快了近一倍;杂化材料对金属离子Ca2+和M g2+的吸附量分别可达到0.289 3,1.445 6mm ol/g。  相似文献   
6.
T-ZnO晶须增强环氧树脂复合材料的力学行为   总被引:10,自引:0,他引:10  
研究了以四脚状氧化锌(T-ZnO)晶须为增强剂,环氧树脂复合材料的力学行为。结果表明,由具有三维空间结构的T-ZnO晶须为增强剂所制备的环氧树脂复合材料具有各向同性的力学性能,T-ZnO晶须填加质量分数为6%时,就可使材料的力学性能改善;拉伸强度提高到169%,拉伸功几乎提高了100%,冲击强度提高到300%,抗弯的断裂功提高到158%,而压缩强度略有下降。  相似文献   
7.
本文回顾了PCB制造常用的环氧树脂及其增强材料的性能和用途。同时,还介绍了代用树脂材料和代用增强材料的最新进展,如改性环氧树脂、无卤树脂、Thermount、PTFE、氰酸酯等,并就其性能进行了探讨。  相似文献   
8.
环境友好阻燃环氧树脂覆铜板研究进展   总被引:15,自引:0,他引:15  
论述了环境友好阻燃环氧树脂覆铜板研究开发的意义。提出通过开发并使用含氮、磷或硅的非卤阻燃型环氧树脂,含磷、氮或磷-氮的功能性阻燃固化剂和在体系中添加有机磷阻燃剂、氢氧化铝等无机阻燃剂等途径来开发环境友好阻燃环氧树脂覆铜板。并对我国在今后该领域的研究作了展望。  相似文献   
9.
水溶性丙烯酸涂料的环氧树脂改性   总被引:2,自引:0,他引:2  
本实验论述了水溶性丙烯酸钢铁底漆涂料制备、性能以及用环氧树脂对其进行改性。原水溶性丙烯酸钢铁底漆涂料在进行耐盐雾测定试验时仅为 72h ,未通过国家规定标准。本实验的目的在于 ,以丙烯酸树脂为主要成膜物质 ,加入其他的辅助成膜物质 ,如环氧树脂来改善其抗盐雾、抗腐蚀、耐候等性能。结果表明 ,一定温度下在水溶性丙烯酸钢铁底漆涂料中加入 1/ 7的环氧树脂后 ,经测定其耐盐雾性可达 10 6h ,达到了国家的规定标准  相似文献   
10.
Increased wetting of the coupling agent/epoxy resin interface was observed when γ-glycidoxypropyltrimethoxysilane, polyfunctional aminosilane and γ-aminopropyltriethoxysilane were applied respectively from methyllethylketone, dimethylformamide and water on woven glass cloths which had been cleaned at 300°C. However, when factory-applied coupling agents were burnt off the woven cloths and fresh coupling agents re-applied, it was found that the nature of the factory-applied coupling agent influenced subsequent wetting. Thinner glass fibres showed a greater improvement in wetting rate than thicker fibres in those solvents identified to be good for improved wettability, irrespective of the heat-cleaning temperature.  相似文献   
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