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在厌氧条件下研究了西南地区一种典型土壤微生物芽孢杆菌Bacillus sp.dwc-2对模拟地下水中U(Ⅵ)的还原行为,重点考察了时间、无机阴离子、腐殖酸(HA)及富里酸(FA)对还原的影响,并利用TEM、EDS、SAED和XPS对还原后的样品进行了表征。结果表明:在pH=7.0、cNaHCO3=5 mmol/L和T=303 K条件下,Bacillus sp.dwc-2对U(Ⅵ)的还原率随时间的增加而增加,24 h内最大还原率为12.2%,此后则随时间的增加逐渐降低;HA和FA对U(Ⅵ)的微生物还原行为有一定影响,其中HA和FA浓度为25 mg/L时,U(Ⅵ)的还原在24 h最明显,其还原率分别为14.2%和16.2%,但随着HA和FA浓度的继续增加,因在U(Ⅵ)离子与HA、FA形成的配合物表面形成致密的腐殖层,抑制了电子的转移,阻止了U(Ⅵ)的还原。此外,研究表明HCO3-也会抑制U(Ⅵ)的还原。TEM-SAED和XPS分析证实了还原过程中U(Ⅳ)的存在。上述结果可为真实环境中微生物还原U(Ⅵ)提供基础数据和参考。 相似文献
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Jie-Long He An-Te Chen Jyong-Huei Lee Shih-Kang Fan 《International journal of molecular sciences》2015,16(9):22319-22332
The basic structural and functional unit of a living organism is a single cell. To understand the variability and to improve the biomedical requirement of a single cell, its analysis has become a key technique in biological and biomedical research. With a physical boundary of microchannels and microstructures, single cells are efficiently captured and analyzed, whereas electric forces sort and position single cells. Various microfluidic techniques have been exploited to manipulate single cells through hydrodynamic and electric forces. Digital microfluidics (DMF), the manipulation of individual droplets holding minute reagents and cells of interest by electric forces, has received more attention recently. Because of ease of fabrication, compactness and prospective automation, DMF has become a powerful approach for biological application. We review recent developments of various microfluidic chips for analysis of a single cell and for efficient genetic screening. In addition, perspectives to develop analysis of single cells based on DMF and emerging functionality with high throughput are discussed. 相似文献
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Xiaoyan Qiu Yongqiang Zhang Haitao Wu Rui Yang Jun Yang Rongjuan Liu Yong Liu Zhiping Zhou Tongfan Hao Yijing Nie 《Polymer International》2019,68(2):218-224
The crystallization of capped ultrathin polymer films is closely dependent on film thickness and interfacial interaction. Using dynamic Monte Carlo simulations, the crystallization behaviors of polymer films confined between two substrates were investigated. The crystallization rate of confined polymers is reduced with high interfacial interactions. Above a critical strength of interfacial interaction, polymer crystallization in the thin film is inhibited within the simulation time scales. An increase in film thickness leads to a rise in critical interfacial interaction. In thicker films, the chains have more space to change conformation to form crystal stems. In addition, there are fewer absorbed segments in confined chains for the thicker films, and thus the chains have stronger ability to adjust their conformation. Therefore an increase in film thickness can cause a reduction in the entropic barrier required for the formation of crystals and thus an increase in the critical interfacial interaction. © 2018 Society of Chemical Industry 相似文献
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Chenxu Liu Shuguang Zhang Ruonan Ji Peng Wang Jin Zhang Yu Tian Yonggang Meng Yedong He 《Ceramics International》2019,45(4):4747-4755
Semiconductor particles doped Al2O3 coatings were prepared by cathode plasma electrolytic deposition in Al(NO3)3 electrolyte dispersed with SiC micro- and nano-particles (average particle sizes of 0.5–1.7?µm and 40?nm respectively). The effects of the concentrations and particle sizes of the SiC on the microstructures and tribological performances of the composite coatings were studied. In comparison with the case of dispersing with SiC microparticles, the dispersion of SiC nanoparticles in the coatings was more uniform. When the concentration of SiC nanoparticles was 5?g/L, the surface roughness of the composite coating was reduced by 63%, compared with that of the unmodified coating. Friction results demonstrated that the addition of 5?g/L SiC nanoparticles reduced the friction coefficient from 0.60 to 0.38 and decreased the wear volume under dry friction. The current density and bath voltage were measured to analyze the effects of SiC particles on the deposition process. The results showed that the SiC particles could alter the electrical behavior of the coatings during the deposition process, weaken the bombardment of the plasma, and improve the structures of the coatings. 相似文献