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61.
Byun  S. Laskar  J. 《Electronics letters》2007,43(5):35-36
A digitally tuned Gm-C filter with a VDD/temperature-compensating digital-to-analogue converter (DAC) is presented. By using the proposed DAC, the bandwidth sensitivities to VDD and temperature variations of a Gm-C filter can be decreased without repeated frequency tuning. The measured bandwidth sensitivities are as low as 1.2%/100degC and 1.7%/V for temperature and VDD, respectively  相似文献   
62.
BA*: an online complete coverage algorithm for cleaning robots   总被引:1,自引:0,他引:1  
This paper presents a novel approach to solve the online complete coverage task of autonomous cleaning robots in unknown workspaces based on the boustrophedon motions and the A* search algorithm (BA*). In this approach, the robot performs a single boustrophedon motion to cover an unvisited region until it reaches a critical point. To continue covering the next unvisited region, the robot wisely detects backtracking points based on its accumulated knowledge, determines the best backtracking point as the starting point of the next boustrophedon motion, and applies an intelligent backtracking mechanism based on the proposed A* search with smoothed path on tiling so as to reach the starting point with the shortest collision-free path. The robot achieves complete coverage when no backtracking point is detected. Computer simulations and experiments in real workspaces prove that our proposed BA* is efficient for the complete coverage task of cleaning robots.  相似文献   
63.
Vowel onset point (VOP) is the instant of time at which the vowel region starts in a speech signal. The VOPs are used as anchor points to design various speech based systems. Different algorithms exist in the literature to identify the occurrences of vowels in continuous spoken utterances. The algorithm based on combined evidences derived from source excitation, spectral peaks and modulation spectrum have been used as a baseline system for the present study. The baseline system provides a satisfactory level of performance under clean data condition. However under noisy data condition the performance of the previous system may be improved further by additional pre-processing of the raw speech data and post-processing the detected VOPs. In this paper we propose to use the speech enhancement techniques as pre-processing module to remove the noise from the speech data under different noisy conditions. The pre-processed speech data is then passed through the baseline system to detect the VOPs. It has been observed that there exist several spurious VOPs at the output of the baseline system. We propose to use a post-processing module based on average signal-to-noise ratio and information derived from the glottal closure instant to remove the spurious VOPs. The experiments were carried out on clean, artificially injected noisy, and data collected from the practical noisy environments. The results suggest that the proposed system using pre-processing and post-processing modules is robust and shows an improvement of 28–35 % over the existing baseline system by removing the spurious VOPs under different noisy conditions.  相似文献   
64.
We report measurement of thermal diffusivity of solid samples by using a continuous heat source and infrared thermal imaging. In this technique, a continuous heat source is used for heating the front surface of solid specimen and a thermal camera for detecting the time dependent temperature variations at the rear surface. The advantage of this technique is that it does not require an expensive thermal camera with high acquisition rate or transient heat sources like laser or flash lamp. The time dependent heat equation is solved analytically for the given experimental boundary conditions. The incorporation of heat loss correction in the solution of heat equation provides the values of thermal diffusivity for aluminum, copper and brass, in good agreement with the literature values.  相似文献   
65.
This letter presents a complementary metal oxide semiconductor (CMOS) voltage-controlled oscillator (VCO) with a high-Q inductor in a wafer-level package for the LC-resonator. The on-chip inductor is implemented using the redistribution metal layer of the wafer-level package (WLP), and therefore it is called a WLP inductor. Using the thick passivation and copper metallization, the WLP inductor has high quality-factor (Q-factor). A 2-nH inductor exhibits a Q-factor of 8 at 2 GHz. The center frequency of the VCO is 2.16 GHz with a tuning range of 385 MHz (18%). The minimum phase noise is measured to be -120.2 dBc/Hz at an offset frequency of 600 kHz. The dc power consumed by the VCO-core is 1.87 mW with a supply voltage of 1.7 V and a current of 1.1 mA. The output power with a 50-/spl Omega/ load is -12.5/spl plusmn/1.3 dBm throughout the whole tuning range. From the best of our knowledge, compared with recently published 2-GHz-band 0.35 /spl mu/m CMOS VCOs in the literature, the VCO in this work shows the lowest power consumption and the best figure-of-merit.  相似文献   
66.
The improved version of a broadband planar magic-T using microstrip-slotline transitions is presented. The design implements a small microstrip-slotline tee junction with minimum size slotline terminations to reduce radiation loss. A multisection impedance transformation network is used to increase the operating bandwidth and minimize the parasitic coupling around the microstrip-slotline tee junction. As a result, the improved magic-T has greater bandwidth and lower phase imbalance at the sum and difference ports than the earlier magic-T design. The experimental results show that the 10-GHz magic-T provides more than 70% of 1-dB operating bandwidth with the average in-band insertion loss of less than 0.6 dB. It also has phase and amplitude imbalance of less than plusmn1deg and plusmn0.25 dB, respectively.  相似文献   
67.
We present a new analytical direct parameter-extraction methodology for obtaining the small-signal equivalent circuit of HBTs. It is applied to cryogenically operated SiGe HBTs as a means to allow circuit design of SiGe HBT low-noise amplifiers for cooled radio astronomy applications. We split the transistor into an intrinsic transistor (IT) piece modeled as a Pi-topology, and the quasi-intrinsic transistor (QIT), obtained from the IT after that the base resistance (Rb) has been removed. The relations between Z-Y-parameters of the IT and QIT are then established, allowing us to propose a new methodology for determining Rb. The present extraction method differs from previous studies in that each of the model elements are obtained from exact equations that do not require any approximations, numerical optimization, or post-processing. The validity of this new extraction methodology is demonstrated by applying it to third-generation SiGe HBTs operating at liquid-nitrogen temperature (77 K) across the frequency range of 2-22 GHz.  相似文献   
68.
The unavailability of protein foods, particularly in the context of population growth, has been an important factor in the protein malnutrition encountered in developing countries. The fractionation, gel filtration and polyacrylamide gel electrophoresis (PAGE) of Ailanthus excelsa seed (a nontraditional source containing 15.81% protein) proteins were carried out in the present study, and their solubility profiles, surface topographies and amino acid compositions were evaluated. The globulin fraction dominated the seed protein composition, accounting for 51.31% (w/w) of the total soluble proteins in the seeds. Protein isolate and protein fractions of A. excelsa seeds showed similar topographical structures to those of other plant seed proteins. Analysis of the isolated proteins identified 17 amino acids, of which nine were essential. Gel filtration on Sephadex G-200 revealed the presence of seven components. PAGE detected different polypeptide bands in the range of 28.8−154.9 kDa in the protein isolate as well as in protein fractions for A. excelsa. The amino acid compositions, the solubility patterns and the high abundances of low molecular weight proteins indicate that the isolated seed protein of A. excelsa may be a potential food protein.  相似文献   
69.
This paper presents a neural network-based technique for modeling and analyzing the electrical performance of flip-chip transitions. A lumped element model using a simple pi equivalent circuit is used to characterize the electrical properties of the flip-chip bond. Statistical experimental design is used to extract the electrical parameters for flip-chip characterization from measurements and full-wave simulations up to 35 GHz. The extracted data is used to train back-propagation neural networks to obtain an accurate model of the pi equivalent circuit components and s-parameters as a function of layout parameters. The prediction error of the models is less than 5%. The models are used to obtain response surfaces for the entire range of variation of layout parameters. The neural network models are subsequently used to perform sensitivity analysis. All electrical parameters are shown to be sensitive to conductor overlap. The inductance and capacitance of the pi equivalent circuit are sensitive to the bump height. However, the return loss (S11) is insensitive to the change in bump height. The coplanar waveguide width has a significant impact on the s-parameters, as it affects the matching of flip-chip transitions  相似文献   
70.
Electronics packaging evolution involves system, technology, and material considerations. In this paper, we present a novel three-dimensional (3-D) integration approach for system-on-package (SOP)-based solutions for wireless communication applications. This concept is proposed for the 3-D integration of RF and millimeter (mm) wave embedded functions in front-end modules by means of stacking substrates using liquid crystal polymer (LCP) multilayer and /spl mu/BGA technologies. Characterization and modeling of high-Q RF inductors using LCP is described. A single-input-single-output (SISO) dual-band filter operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, two dual-polarization 2/spl times/1 antenna arrays operating at 14 and 35 GHz, and a WLAN IEEE 802.11a-compliant compact module (volume of 75/spl times/35/spl times/0.2 mm/sup 3/) have been fabricated on LCP substrate, showing the great potential of the SOP approach for 3-D-integrated RF and mm wave functions and modules.  相似文献   
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