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排序方式: 共有663条查询结果,搜索用时 31 毫秒
101.
This paper describes the method of built-in self-repairing of RAM on board,designs hardware circuit,and logic for the RAM's faults self-repairing system based on FPGA.The key technology is that it util... 相似文献
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103.
Leila Pakzad Farhad Ein-MozaffariSimant R. Upreti Ali Lohi 《Chemical Engineering Research and Design》2013
The design of the coaxial mixers depends on many interrelated parameters including the geometry and dimensions of the mixing vessel, the location and type of the impellers, speed ratio, impeller diameter, rotation mode, and fluid rheology. No study has been reported in the literature regarding the mixing performance of the coaxial mixers in the agitation of yield-pseudoplastic fluids. Thus, the main objective of this study was to evaluate the performance of a Scaba–anchor coaxial mixer (a novel configuration) in the mixing of xanthan gum solutions (yield-pseudoplastic fluids). The Herschel–Bulkley model was used to describe the rheological behavior of the xanthan gum solutions. To develop new correlations for the generalized Reynolds and power numbers of the coaxial mixers employed in the agitation of this class of non-Newtonian fluids, we utilized numerous experimental and computational fluid dynamics (CFD) data. The new correlations were tested successfully at different operating conditions (e.g. speed ratio, fluid rheology, and operation mode). 相似文献
104.
The propagation properties of the surface acoustic waves(SAWs) in a ZnO-SiO2-Si multilayered piezoelectric structure are calculated by using the recursive asymptotic method.The phase velocities and the electromechanical coupling coefficients for the Rayleigh wave and the Love wave in the different ZnO-SiO2-Si structures are calculated and analyzed.The Love mode wave is found to be predominantly generated since the c-axis of the ZnO film is generally perpendicular to the substrate.In order to prove the calculated results,a Love mode SAW device based on the ZnO-SiO2-Si multilayered structure is fabricated by micromachining,and its frequency responses are detected.The experimental results are found to be mainly consistent with the calculated ones,except for the slightly larger velocities induced by the residual stresses produced in the fabrication process of the films.The deviation of the experimental results from the calculated ones is reduced by thermal annealing. 相似文献
105.
Koukou Suu Takeshi Masuda Yutaka Nishioka Noriakitani 《Integrated ferroelectrics》2013,141(1-4):407-418
Abstract SrBi2Ta2O9 (SBT) thin films were deposited on 6-inch Pt/Ti/SiO2/Si substrates by rf magnetron sputtering using a 12-inch ceramic SBT single target. It is found that several sputtering parameters such as argon (Ar) pressure and rf power were very effective to control the Bi content of SBT thin films which is essential for obtaining good ferroelectric properties. 相似文献
106.
Francis G. Celii Mahesh Thakre Mark K. Gay Scott R. Summerfelt Sanjeev Aggarwal J. Scott Martin 《Integrated ferroelectrics》2013,141(1):269-277
We describe the etch processes used for integration of embedded ferroelectric random access memory (FRAM) within a standard CMOS logic flow. The ferroelectric module is inserted following front-end contact formation and prior to backend integration using only two additional mask levels: capacitor pattern and bi-level via pattern. The single-mask stack etch process employs a TiAlN hardmask to define Ir/IrOx/PZT/IrOx/Ir capacitors. Protective sidewalls can be formed using an etchback process. The bi-level via etch and subsequent metal fill processes complete the FRAM module formation. Functional 4 MB arrays embedded with 5 levels of Cu/FSG integration have been demonstrated. 相似文献
107.
Chris Ying Reggie Mananquil Ryan Patz Amitabh Sabharwal Ajay Kumar Francis Celii 《Integrated ferroelectrics》2013,141(1):325-332
The development of ferroelectric random access memories (FRAM) has been a sustained endeavor among semiconductor manufacturers over the past decade in response to the growing communications and consumer electronics demand for nonvolatile memories capable of high-speed/low-voltage operation. Process technology and materials performance improvements have refined cell structure, device density, operating voltage, endurance, and data retention. Similarly, advances are being made in etch technology to enable the patterning of true high-density, electrically sound FRAM capacitor arrays. This paper addresses enhancements in chamber design and etch chemistry that have significantly improved electrical performance of the capacitors and achieved sustained stability of the etch process. 相似文献
108.
Yiqing Ding Xin Liu Yinyin Lin Ting-ao Tang Bomy Chen 《Integrated ferroelectrics》2013,141(1):140-145
ABSTRACT A general HSPICE macromodel for the CuxO based resistive random access memory(ReRAM) cell is presented in this paper. It can simulate both the dc and transient behavior of ReRAM cells. The simulation results were compared with the experimental results and exhibited desirable accordance. 相似文献
109.
根据开放式系统的设计理念,开发了微型数控铣床的运动控制卡系统。首先,对运动控制卡的功能及硬件结构进行详细设计;然后,根据功能需求将控制卡分成DSP系统、主轴电动机控制系统、XYZ轴步进控制系统及双端口RAM通讯系统进行详细设计;最后,根据设计原理完成控制卡的PCB图和电路板的设计加工调试工作。该运动控制卡已在微型数控铣床开发平台上实验成功,其设计方法对今后运动控制系统的设计具有较高的参考价值。 相似文献
110.