机加工孔套管抗挤压强度有限元分析

套管屈服强度直接影响套管抗挤压性能，套管在加工孔过程中可能诱发孔眼附近材料发生金属相变，导致套管屈服强度不再均匀分布，进而影响套管抗挤压强度。在相同工况下，对比了P110完整套管和机加工孔套管的抗挤压强度，以此为参照组分析了相变区域面积和相变区域屈服强度对机加工孔套管抗挤压强度的影响。结果表明，机加工孔会改变材料屈服强度，进而影响套管抗挤压性能。随金属相变区域屈服强度减小，机加工孔套管抗挤压强度减弱；当金属相变区域屈服强度增大时，机加工孔套管抗挤压强度增强。且机加工孔套管相变区域面积对机加工孔套管抗挤压强度的影响随相变区域屈服强度增加而逐渐削弱。     

DP980+Z烘烤硬化值与退火温度的关系

摘要：为了研究退火温度对镀锌DP980+Z烘烤硬化值的影响，退火温度控制在760～820℃之间，系统分析退火温度对烘烤硬化值的影响。通过准静态拉伸试验机测量烘烤硬化值及抗拉强度，采用lepara试剂对组织中的马氏体进行着色，利用金相显微镜及图像处理软件测量马氏体的体积分数；采用扫描电镜观察DP980+Z的双相组织特点，并且将组织图片通过CAD转化成有限元图进行网格划分，建立代表性体积单元（RVE），通过有限元分析铁素体、马氏体强度对烘烤硬化值的影响。在同样的变形量情况下，DP980+Z的原始屈服强度越高，烘烤硬化值越高。     

碎软煤层条带瓦斯地面高效抽采技术研究

为了提高碎软煤层条带瓦斯抽采效率和效果,基于目前地面瓦斯抽采主要采用垂直井或从式井的方式抽采效果差、效率低的现状,通过理论和实验分析论证了穿岩层压裂改造煤储层的可行性,提出了在目标煤层顶板岩层中钻水平井,并通过垂直向下射孔以及采用泵送桥塞分段进行压裂的方式进行地面瓦斯抽采。试验结果表明:顶板分段压裂水平井单井产量高、高稳产期更长、产量衰减更慢;有效水平井段控制区域内瓦斯下降均匀,更有利于进行条带瓦斯抽采;相同投资条件下,采用水平井的方式瓦斯抽采效率和投入产出比更高。     

大采高综放工作面强动压端头顶板控制技术

为了解决大采高综放工作面回风侧端头顶板控制问题,针对马道头矿8211工作面的地质情况,通过对回风顺槽超前注浆加固,提高超前支护范围和支护强度,并对回风侧端头三角区煤壁和顶板进行化学浆加固的技术方案,有效控制了顺槽超前区围岩变形和工作面回风侧端头三角区煤壁片帮,保证了工作面端头区顶板安全。     

硅渣和玻璃粉直接烧结制备多孔材料的气孔结构与力学性能

以硅渣和玻璃粉为原料,采用粉体直接烧结法制备多孔材料,研究了烧结温度(700~900℃)、烧结时间(15~120min)和升温速率(10~100℃·min^-1)对多孔材料表观密度、气孔率、物相组成、抗压强度的影响。结果表明:气孔结构均匀性随烧结温度的升高而降低;表观密度随烧结温度的升高先减小后增大,随保温时间的延长而增大,随升温速率的增大而减小,气孔率的变化趋势与表观密度的相反;多孔材料的主要物相为玻璃相和硅、SiC、SiO2、Ca2Al2SiO7等结晶相,且结晶度随烧结温度的升高而降低;抗压强度随烧结温度的升高呈先增大后减小的趋势;当烧结温度为750℃,升温速率为30℃·min^-1,烧结时间为30 min时,多孔材料的主晶相为硅和Ca2Al2SiO7,抗压强度最大(1.60MPa),表观密度为0.43g·cm^-3,气孔率为80%。     

《化学制药单元操控》工学结合课程的教学探索

《化学制药单元操控》是一门新开发的将情景教学、实验操作和仿真实训相结合的工学结合课程。其中,引入化工仿真教学这一新型的教学方式,即通过在非常逼真的操作环境中进行技能训练,使学生对实际生产装置有更加感性的了解和认识。本文对《化学制药单元操控》工学结合课程开发与实施应用过程进行分析和总结得到几点经验,同时分享对该门课程教学改革中的一些心得。     

Liquid phase sintering and characterization of SiC ceramics

The present study focuses on the sintering of silicon carbide-based ceramics (SiC) by liquid phase sintering (LPS) followed by characterization of the produced ceramics. AlN/Re₂O₃ mixtures were used as additives in the LPS process. In the first step, the LPS-SiC materials were produced in a graphite resistance furnace in the form of discs at different temperatures. The conditions with the best results regarding real density and relative density were taken as reference for sintering in the form of prismatic bars. In the second step, these samples were evaluated regarding fracture toughness (K_IC), by the Single Edge V Notch Beam – SEVNB – method, and flexural strength. K_IC behavior was evaluated according to the depth and curvature radius of the notches. Reliable K_IC values were presented when the ceramic displayed a small curvature radius at the notch tip. When the radius was large, it did not maintain the square root singularity of the notch tip. Tests were carried out to determine K_IC values in atmospheric air and water. K_IC results were lower in water than air, with a decrease ranging between 2.56% and 11.26%. The observations indicated a direct grain size correlation between K_IC values and fracture strength of the SiC ceramics.     

高精度多环片自动装配控制技术

为了实现对微小环片零件的自动化装配,搭建了自动装配系统.通过4根直线导向轴与4个直线轴承来提高系统的导向精度和刚度.采用直线导轨进行各装配作业模块之间的切换,保证了微小环片零件的自动装配与取出.在环片的装配方向上,螺旋升降机和光栅尺实现环片的位置精度控制.在Lab VIEW编程环境中,采用分层软件架构和模块化控制思想,避免了不必要的数据循环检测与丢失,能够达到环片组件的装配精度要求.控制系统分为系统初始化模块、参数设置模块、装配模块和取出模块,自动装配系统通过各个模块间的相互交流配合完成装配任务.采用本文中自动装配系统装配环片的实验结果表明,环片零件装配的最大位置误差为26μm,垂直度误差为17μm,平均装配时间为75 s/片,可满足环片组件所需的精度要求.     

Critical state model for structured soil

Structure is an evident determinant for macroscopic behaviors of soils. However, this is not taken into account in most constitutive models, as structure is a rather complex issue in models. For this, it is important to develop and implement simple models that can reflect this important aspect of soil behavior. This paper tried to model structured soils based on well-established concepts, such as critical state and sub-loading. Critical state is the core of the classic Cam Clay model. The sub-loading concept implies adoption of an inner (sub-loading) yield surface, according to specific hardening rules for some internal strain-like state variables. Nakai and co-workers proposed such internal variables for controlling density (ρ) and structure (ω), using a modified stress space, called t_ij. Herein, similar variables are used in the context of the better-known invariants (p and q) of the Cam Clay model. This change requires explicit adoption of a non-associated flow rule for the sub-loading surface. This is accomplished by modifying the dilatancy ratio of the Cam Clay model, as a function of the new internal variables. These modifications are described and implemented under three-dimensional (3D) conditions. The model is then applied to simulating laboratory tests under different stress paths and the results are compared to experiments reported for different types of structured soils. The good agreements show the capacity and potential of the proposed model.     

Durable,Sensitive, and Wide‐Range Wearable Pressure Sensors Based on Wavy‐Structured Flexible Conductive Composite Film

Flexible pressure sensors have potential applications in human motion monitoring and electronic skins. To satisfy the practical applications, pressure sensors with a high sensitivity, a low detection limit, a broad response range, and an excellent stability are highly needed. Here, a piezoresistive pressure sensor based on wavy‐structured single‐walled carbon nanotube/graphite flake/thermoplastic polyurethane (SWCNT/GF/TPU) composite film is fabricated by a prestretching process. Due to the random wavy structure, high conductivity, and good flexibility, the prepared sensor displays a low detection limit of 2 Pa, a wide sensing range of 0–60 kPa, and a high sensitivity of 5.49 kPa^?1 for 0–50 Pa. Furthermore, the sensor shows a remarkable repeatability of over 1.1 × 10⁴, 9.0 × 10³, and 2.0 × 10³ pressure loading/unloading cycles at 50 Pa, 500 Pa, and 30 kPa, respectively, and a fast responsibility of 100–150 ms of loading response time and 400–600 ms of relaxation time. Therefore, the pressure sensor is successfully adopted to monitor both the large‐scale human activities (e.g., walk and jump) and the small‐scale signals (e.g., wrist pulse). Furthermore, a sensor array is assembled to map the weight and shape of an object, indicating its various potential applications including human–machine interactions, human health monitoring, and other wearable electronics.