化学镀法制备镀银云母

采用敏化–活化两步法对云母粉进行预处理后再化学镀银。研究了镀液p H、银含量和云母粉与Ag NO3质量比对镀银云母粉导电性的影响。通过红外光谱仪和X射线衍射仪表征了镀银云母粉的组织结构。通过表面形貌分析,研究了粗化预处理对云母粉化学镀银效果的影响。结果表明,粗化可提高粉体表面的粗糙度,使后续银镀层更致密。当Ag NO3投加量为15 g/L,云母粉与Ag NO3质量比为2.5∶1,p H为12时,银沉积率最高,镀银云母粉的表面形貌和导电性最好(体积电阻率约0.088?·cm)。化学镀银云母粉有望替代部分银粉作为导电填料,并在涂料或塑料等高分子材料中应用。     

基于选择性湿法粗化方法制作n型欧姆接触的垂直结构发光二极管的电学性能研究

低阻和高稳定性的氮极性面N型欧姆接触对于GaN基垂直结构发光二极管尤为重要。研究发现,相对于未湿法粗化N型GaN面,湿法粗化N型GaN面的欧姆接触电阻较大,且最终制成的发光二极管具有较高的开启电压和较低的反向漏电。本文提出了一种选择性湿法粗化方法制作氮极性面N型GaN欧姆接触,基于此方法最终制成的垂直结构发光二极管具有更低的开启电压和反向漏电,并且输出光功率略有提升。进一步的老化实验表明该法制作的欧姆接触具有良好的稳定性。     

Selective dissolution of brass in salt water

The selective dissolution of brass was studied using potentiodynamic polarization, coloumetric analysis and electrochemical impedance spectroscopy (EIS). Using coloumetric analysis, the partial currents i _Zn and i _Cu were measured under various potentials and chloride concentrations. Chloride ions promote the dissolution of Zn and Cu and hence increase the rate of dissolution of the alloy. At active potentials, zinc dissolves preferentially leaving the alloy surface enriched in copper. Under this condition, the polarization resistance of the interface and its double layer capacity increase with the time and extent of dissolution of the alloy. As the chloride concentration increases and/or the potential shifts in the noble direction, the rate of copper dissolution increases so that simultaneous dissolution of both components is observed. This increase in the rate of copper dissolution is enhanced by the higher stability of the copper chloride complex (CuCl₂ ^–) compared to zinc chloride (ZnCl₂).     

Silica under very large positive and negative pressures: Molecular dynamics simulations on parallel computers

A highly efficient multiresolution algorithm has been developed to carry out large-scale molecular dynamics (MD) simulations for systems with long-range Coulomb and three-body covalent interactions. The algorithm combines the reduced cell and fast multipole methods and multiple time-step approach. Pressure-induced structural transformation, loss of intermediate range order, and dynamcal correlations in SiO₂, glass are investigated with the moleculardynamics method. At twice the normal density, the Si-O bond length increases, the Si O coordination changes from 4 to 6, and the O-Si-O band-angle changes from 109 to 90°. This is a tetrahedral-to-octahedral transformation, which was reported by Meade, Hemley, and Mao. Results for phonon density of states also reveal significant changes at high pressures. The multiresolution MD approach has been used to investigate the structural properties and mechanical failure in microporous silica. Structural correlations are characterized by the fractal dimension, internal surface area, and pore surface-tovolume ratio. Critical behavior at fracture is analyzed in terms of pore percolation, and kinetic roughening of fractured surface is also investigated.Paper presented at the Twelfth Symposium on Thermophysical Properties, June 19–24, 1994, Boulder, Colorado, U.S.A.     

SLA表面处理TiCu合金的抗菌性能研究

目的 对TiCu合金进行SLA表面粗糙化处理,探究具有粗糙表面的TiCu合金的抗菌性能。方法 用喷砂+酸蚀（SLA）的方法对TiCu合金表面进行粗糙化处理（SLA-TiCu）,并与经过相同处理的SLA-Ti进行对比研究。采用金黄色葡萄球菌作为实验菌株,通过平板菌落计数法计算杀菌率,采用活/死细菌染色实验观察表面细菌的粘附分布及生物被膜的形成情况,在透射电镜下观察细菌微观结构的变化,探究SLA-TiCu的抗菌作用及对细菌微观结构的影响。结果 SLA表面处理使TiCu合金具有微米-亚微米的复合双层孔洞结构表面,SLA-TiCu具有优异的抗菌性能,对表面粘附细菌的抗菌率为100%。染色结果表明,SLA-TiCu表面粘附的细菌中大量的是死细菌,没有形成生物被膜,而SLA-Ti表面已经形成细菌生物被膜。透射电镜观察表明,SLA-TiCu作用后的细菌出现了明显的细胞膜溶解现象,破损的细菌体内部出现透明和半透明的区域,细胞壁和细胞膜破损,细胞内的细胞质流出,在破损的细菌周围可以看到高电子密度的颗粒和沉淀。结论 SLA处理的TiCu合金具有优异的抗菌性能,更能有效发挥合金中Cu的杀菌作用,能够高效杀死表面粘附的细菌,从而抑制表面生物被膜的形成。因此,具有优异抗菌性能的SLA-TiCu具有极大潜力应用于牙种植体制造。     

湿法表面粗化提高倒装AlGaInP LED外量子效率

介绍了一种利用盐酸、磷酸混合液对不同Al组分(AlxGa1-x)0.5In0.5P的选择性腐蚀特性对倒装AlGaInP红光LED进行表面粗化的方法。通过向粗化层GaInP加入适量的Al,在Al组分为0.4时,利用体积比为1∶10的HCl∶H3PO4可以得到横向尺寸约为60nm,纵向尺寸约为150nm的最有利于出光的类三角圆锥型表面结构。器件测试结果表明,在20mA注入电流下,器件外量子效率比粗化前提高了80%。     

百色水利枢纽导流洞水工模型试验中加糙与上游水位校正计算

结合百色水利枢纽导流隧洞水工模型试验,介绍隧洞模型试验中,由于材料限制,模型糙率与原型糙率不相似时采取的处理措施和方法。     

ABS塑料电镀粗化溶液分析

准确掌握ABS塑料电镀粗化溶液中各成分的含量有利于粗化槽液的调整与维护,而传统的分析方法耗用时间长、准确度差。研究出一种高铬酸型粗化溶液中硫酸含量的分析方法。介绍了该方法的原理、分析步骤及计算方法。对该方法与传统方法(重量法)的;隹确度进行了比较。结果表明,该分析方法简单、快捷、准确度高,在实际生产中取得较好效果。     

Performance of ionic polymer-metal composite (IPMC) with different surface roughening methods

Based on permeation and double chemical reduction technology, this paper researches the manufacture of Pt-ionic polymer metal composites (IPMC) and the effect of three types of surface roughening methods on the manufacture and performance of IPMC. The roughening methods include manual polishing, sanding machine polishing, and plasma surface treatment. The appearance and scanning electron microscopy (SEM) features, electro-active deformation and surface resistance characteristics of these IPMC specimens were obtained and compared through specimen tests. The results of the tests indicate that surface roughening technology obviously influences the performance of IPMC. The uniformity and compactness of the metal deposited on the surface and inside the Nafion film are improved by improving surface roughening uniformity. However, the electro-active deformation capability and surface resistance of the specimens decrease at the same time. There is an approximate linear increase relationship between the driving voltage and the bending deformation of the IPMC specimen within a certain voltage range. Under the same specimen dimension, constraints, and driving voltage (3V), the maximum electro-active bending deformation angles of the specimens are about 60°, 45°, and 15° for manual polishing, sanding machine roughening, and plasma treatment, respectively.