High Thermal Conductivity Polymer Composites Fabrication through Conventional and 3D Printing Processes: State-of-the-Art and Future Trends

The lifespan and the performance of flexible electronic devices and components are affected by the large accumulation of heat, and this problem must be addressed by thermally conductive polymer composite films. Therefore, the need for the development of high thermal conductivity nanocomposites has a strong role in various applications. In this article, the effect of different particle reinforcements such as single and hybrid form, coated and uncoated particles, and chemically treated particles on the thermal conductivity of various polymers are reviewed and the mechanism behind the improvement of the required properties are discussed. Furthermore, the role of manufacturing processes such as injection molding, compression molding, and 3D printing techniques in the production of high thermal conductivity polymer composites is detailed. Finally, the potential for future research is discussed, which can help researchers to work on the thermal properties enhancement for polymeric materials.     

Sintering kinetics and properties of NiFe2O4-based ceramics inert anodes doped with TiN nanoparticles

Sintering kinetics of NiFe₂O₄-based ceramics inert anodes for aluminum electrolysis doped 7 wt% TiN nanoparticles were conducted to investigate densification and grain growth behaviors. The linear shrinkage increased gradually with the increasing sintering temperature between 1000 and 1450°C, whereas the linear shrinkage rate exhibited a broad peak. The maximum linear shrinkage rate was obtained at 1189.4°C, and the highest densification rate was achieved at the relative density of 75.20%. Based on the pressureless sintering kinetics window, the sintering process was divided into the initial stage, the intermediate stage, and the final stage. The grain growth exponent reduced with increased sintering temperature, whereas the grain growth activation energy decreased by increasing sintering temperature and shortening dwelling time. The grain growth was mainly controlled by atomic diffusion. NiFe₂O₄-based ceramics possessed high-temperature semiconductor essential characteristics. The electrical conductivity of NiFe₂O₄-based ceramics first increased and then decreased with increasing sintering temperature, reached their maximum value (960°C) of 33.45 S/cm under 1300°C, mainly attributed to the relatively dense and uniform microstructure. The thermal shock resistance of NiFe₂O₄-based ceramic was improved by a stronger grain boundary bonding strength and lower coefficient of linear thermal expansion.     

The capillary and thermal performance of the porous silicon nitride ceramics with nearly spherical pore structure

The capillary and thermal performance of porous Si₃N₄ ceramics with nearly spherical pore structure has been investigated by altering the addition and diameter of pore-forming agent polymethyl methacrylate (PMMA) in this work. An exponential model is used to evaluate the liquid uptake capacity of porous Si₃N₄ ceramics. Porous Si₃N₄ ceramics fabricated by 5 μm PMMA with 40 wt.% addition possess the lowest capillary time constant and show the best capillary performance owing to the perfect balance between friction resistance and capillary force. The thermal conductivity of porous Si₃N₄ ceramics is significantly impacted by their porosity. Alexander model with an exponent of .96 is suitable for predicting the thermal conductivity of porous Si₃N₄ ceramics due to its R-squared up to .99. Moreover, with the addition and diameter of PMMA decrease, the flexural strength of porous Si₃N₄ ceramics increases. These results support the application of porous Si₃N₄ ceramics in the field of mass and heat transfer.     

电导率传感器的理论关系式

导出了无电极式Ｙ－１型电导率传感器在线性条件下的理论关系式，为选择传感器结构参数提供依据。     

Thermophysical properties of medium grain rough rice (<Emphasis Type="Italic">LIDO cultivar</Emphasis>) at medium and low temperatures

Bulk density, specific heat capacity, bulk thermal conductivity and bulk thermal diffusivity of medium-grain rough rice (LIDO cultivar) have been studied. Specific heat was determined by DSC, thermal conductivity by the probe method and bulk thermal conductivity indirectly from bulk density, specific heat capacity and bulk thermal conductivity. All the thermal properties have been determined at different moisture contents and temperatures used during cooling and storage operations and the effect of these variables has been investigated. It has been shown that moisture content has the greatest effect on specific heat and bulk thermal conductivity. Temperature also affected these thermal properties, but to a smaller extent. Mathematical expressions have been developed to determine each of these thermophysical properties as a function of moisture content and temperature.List of Abbreviations and Symbols C_p Specific heat capacity (kJ/kg °C) - k Bulk thermal conductivity (W/m °C) - T Temperature (ºC) - W Moisture content (%, d.b.) - Bulk thermal diffusivity (m²/s) - Bulk density (kg/m³)     

Thermal Conductivity of Pear, Sweet-cherry, Apricot, and Cherry-plum Juices as a Function of Temperature and Concentration

ABSTRACT:  The thermal conductivity of 4 fruit (pear, sweet-cherry, apricot, and cherry-plum) juices was measured with a coaxial-cylinder (steady-state) technique. Measurements were made, temperature range 20 to 120 °C, at concentrations between 12.2 and 50 °Brix. The uncertainty of the thermal conductivity measurements was estimated to be less than 2%. A semitheoretical method for the prediction of thermal conductivity of juices was proposed. It was found that the prediction Model IV,  λ ( T , x )/λ ( T ₀, x ) = ( T / T ₀) ⁿ   , where  λ  is the thermal conductivity, x is the concentration, and T is the temperature, developed in this work can be adopted with satisfaction. The thermal conductivity of juices can be predicted just by knowing the thermal conductivity  λ₀  at a reference temperature   T ₀  .     

Electrical conductivity: a new tool for the determination of high hydrostatic pressure-induced starch gelatinisation

The degree of gelatinisation and electrical conductivity of wheat starch and tapioca starch suspensions (5% w/w) were determined after a pressure treatment of up to 530 MPa. With increasing pressure at a constant treatment time the degree of gelatinisation increased resulting in a gelatinisation curve similar to that of thermal gelatinisation. A pressure increase also caused an increase in electrical conductivity. A good linear relationship between the degree of gelatinisation and the electrical conductivity for both starches investigated was found. Since electrical conductivity correlates well with the degree of gelatinisation of starches after pressure treatment it is applicable for the quick and simple determination of pressure-induced starch gelatinisation.     

不可逆电穿孔时组织电导率变化对电场和温度的影响

为了研究不可逆电穿孔过程中组织电导率对组织内电场分布及温度的影响,采用有限元分析软件COMSOL建立了小鼠肝脏的球形肿瘤及椭球形肿瘤的数值模型;通过改变组织的电导率,得到肿瘤及正常组织内不可逆电穿孔电场、温度的分布情况。结果表明:组织电导率随着穿孔过程的发展逐渐增大。组织电导率变化前后,2种肿瘤模型中的各项数据如下:1)不可逆电穿孔电场消融的肿瘤体积与肿瘤总体积之比分别从0.867 7升至0.927 0(球形肿瘤)以及从0.451 1升至0.772 1(椭球形肿瘤);2)不可逆电穿孔电场造成正常组织损伤的体积与肿瘤总体积之比分别从0.745 9降至0.678 2(球形肿瘤)以及从0.816 4降至0.603 6(椭球形肿瘤);3)温升1℃的正常组织的最大体积只有肿瘤体积的1.16%,说明正常组织的温升对组织整体温度变化的影响较小。因此,组织不可逆电穿孔过程中,增大电导率能在促进电脉冲对肿瘤的消融效果的同时减小其对正常组织的损伤,且脉冲作用造成的组织温升不会造成组织的热损伤。     

炭黑/交联聚乙烯纳米复合材料的空间电荷和电导特性

为研究添加炭黑(CB)对交联聚乙烯(XLPE)绝缘材料直流介电性能的影响,通过熔融共混制备了CB/XLPE纳米复合材料,在不同的恒定温度下分别测试了各试样的电导率与外施直流电场强度的关系,并利用电声脉冲法测量了各试样内的空间电荷分布状况。研究结果表明,添加少量炭黑即可使XLPE中的空间电荷量明显减少,当炭黑掺量为1 phr(指每100 g XLPE中添加1 g CB)时,复合材料抑制空间电荷的能力较强;XLPE在较低电场强度下就表现出电导非线性特性,且电导率受温度影响较大,最大变化量超过3个数量级;而CB/XLPE纳米复合材料在小于20 kV/mm的电场强度下电导率变化较小,且温度对其直流电导率的影响明显小于XLPE。炭黑能抑制XLPE中空间电荷累积和改善其直流电导特性的原因是增大了材料中的陷阱密度和陷阱深度。     

啤酒发酵过程电导率在线监测的初步研究

本实验对啤酒酵母发酵过程中电导率与还原糖进行了检测,结果发现:还原糖与电导率之间存在良好的数学关系,并且以此为依据初步建立了数学模型.通过100L小型发酵罐发酵实验进一步表明:将电导率应用于啤酒发酵过程在线监测是可行的,并且具有很好的应用前景.