DP980+Z烘烤硬化值与退火温度的关系

摘要：为了研究退火温度对镀锌DP980+Z烘烤硬化值的影响，退火温度控制在760～820℃之间，系统分析退火温度对烘烤硬化值的影响。通过准静态拉伸试验机测量烘烤硬化值及抗拉强度，采用lepara试剂对组织中的马氏体进行着色，利用金相显微镜及图像处理软件测量马氏体的体积分数；采用扫描电镜观察DP980+Z的双相组织特点，并且将组织图片通过CAD转化成有限元图进行网格划分，建立代表性体积单元（RVE），通过有限元分析铁素体、马氏体强度对烘烤硬化值的影响。在同样的变形量情况下，DP980+Z的原始屈服强度越高，烘烤硬化值越高。     

碎软煤层条带瓦斯地面高效抽采技术研究

为了提高碎软煤层条带瓦斯抽采效率和效果,基于目前地面瓦斯抽采主要采用垂直井或从式井的方式抽采效果差、效率低的现状,通过理论和实验分析论证了穿岩层压裂改造煤储层的可行性,提出了在目标煤层顶板岩层中钻水平井,并通过垂直向下射孔以及采用泵送桥塞分段进行压裂的方式进行地面瓦斯抽采。试验结果表明:顶板分段压裂水平井单井产量高、高稳产期更长、产量衰减更慢;有效水平井段控制区域内瓦斯下降均匀,更有利于进行条带瓦斯抽采;相同投资条件下,采用水平井的方式瓦斯抽采效率和投入产出比更高。     

硅渣和玻璃粉直接烧结制备多孔材料的气孔结构与力学性能

以硅渣和玻璃粉为原料,采用粉体直接烧结法制备多孔材料,研究了烧结温度(700~900℃)、烧结时间(15~120min)和升温速率(10~100℃·min^-1)对多孔材料表观密度、气孔率、物相组成、抗压强度的影响。结果表明:气孔结构均匀性随烧结温度的升高而降低;表观密度随烧结温度的升高先减小后增大,随保温时间的延长而增大,随升温速率的增大而减小,气孔率的变化趋势与表观密度的相反;多孔材料的主要物相为玻璃相和硅、SiC、SiO2、Ca2Al2SiO7等结晶相,且结晶度随烧结温度的升高而降低;抗压强度随烧结温度的升高呈先增大后减小的趋势;当烧结温度为750℃,升温速率为30℃·min^-1,烧结时间为30 min时,多孔材料的主晶相为硅和Ca2Al2SiO7,抗压强度最大(1.60MPa),表观密度为0.43g·cm^-3,气孔率为80%。     

Liquid phase sintering and characterization of SiC ceramics

The present study focuses on the sintering of silicon carbide-based ceramics (SiC) by liquid phase sintering (LPS) followed by characterization of the produced ceramics. AlN/Re₂O₃ mixtures were used as additives in the LPS process. In the first step, the LPS-SiC materials were produced in a graphite resistance furnace in the form of discs at different temperatures. The conditions with the best results regarding real density and relative density were taken as reference for sintering in the form of prismatic bars. In the second step, these samples were evaluated regarding fracture toughness (K_IC), by the Single Edge V Notch Beam – SEVNB – method, and flexural strength. K_IC behavior was evaluated according to the depth and curvature radius of the notches. Reliable K_IC values were presented when the ceramic displayed a small curvature radius at the notch tip. When the radius was large, it did not maintain the square root singularity of the notch tip. Tests were carried out to determine K_IC values in atmospheric air and water. K_IC results were lower in water than air, with a decrease ranging between 2.56% and 11.26%. The observations indicated a direct grain size correlation between K_IC values and fracture strength of the SiC ceramics.     

高精度多环片自动装配控制技术

为了实现对微小环片零件的自动化装配,搭建了自动装配系统.通过4根直线导向轴与4个直线轴承来提高系统的导向精度和刚度.采用直线导轨进行各装配作业模块之间的切换,保证了微小环片零件的自动装配与取出.在环片的装配方向上,螺旋升降机和光栅尺实现环片的位置精度控制.在Lab VIEW编程环境中,采用分层软件架构和模块化控制思想,避免了不必要的数据循环检测与丢失,能够达到环片组件的装配精度要求.控制系统分为系统初始化模块、参数设置模块、装配模块和取出模块,自动装配系统通过各个模块间的相互交流配合完成装配任务.采用本文中自动装配系统装配环片的实验结果表明,环片零件装配的最大位置误差为26μm,垂直度误差为17μm,平均装配时间为75 s/片,可满足环片组件所需的精度要求.     

Durable,Sensitive, and Wide‐Range Wearable Pressure Sensors Based on Wavy‐Structured Flexible Conductive Composite Film

Flexible pressure sensors have potential applications in human motion monitoring and electronic skins. To satisfy the practical applications, pressure sensors with a high sensitivity, a low detection limit, a broad response range, and an excellent stability are highly needed. Here, a piezoresistive pressure sensor based on wavy‐structured single‐walled carbon nanotube/graphite flake/thermoplastic polyurethane (SWCNT/GF/TPU) composite film is fabricated by a prestretching process. Due to the random wavy structure, high conductivity, and good flexibility, the prepared sensor displays a low detection limit of 2 Pa, a wide sensing range of 0–60 kPa, and a high sensitivity of 5.49 kPa^?1 for 0–50 Pa. Furthermore, the sensor shows a remarkable repeatability of over 1.1 × 10⁴, 9.0 × 10³, and 2.0 × 10³ pressure loading/unloading cycles at 50 Pa, 500 Pa, and 30 kPa, respectively, and a fast responsibility of 100–150 ms of loading response time and 400–600 ms of relaxation time. Therefore, the pressure sensor is successfully adopted to monitor both the large‐scale human activities (e.g., walk and jump) and the small‐scale signals (e.g., wrist pulse). Furthermore, a sensor array is assembled to map the weight and shape of an object, indicating its various potential applications including human–machine interactions, human health monitoring, and other wearable electronics.     

某轻型载货车储气罐支架振动断裂分析与优化

为了有效解决某轻型载货车储气罐支架的断裂故障,首先基于建立的储气罐支架有限元模型进行振动特性分析,分析结果表明其前三阶固有频率接均处于发动机激励频率范围之外,不会产生共振。其次测试各种道路的时域载荷,测试结果表明其中角度搓板路的激励频率与储气罐支架第一阶固有频率相接近,从而引起共振,不满足振动特性要求。然后对其进行振动强度分析,分析结果表明其应力水平不达标,其最大应力点与开裂处一致。再对其进行振动疲劳寿命预测分析,分析结果表明其疲劳寿命也不达标,其危险点也与失效位置相同。再采用集成平台对储气罐支架的结构进行优化设计,优化之后其模态频率、振动强度和振动疲劳均符合性能要求,并且其重量也有所减轻,总体优化效果较佳。最后整车试验结果表明优化之后储气罐支架的振动大幅度降低,并且没有发生失效。     

一种军棋机器博弈的多棋子协同博弈方法

针对在军棋博弈不完全信息对弈中，面对棋子不同价值、不同位置、不同搭配所产生的不同棋力，传统的单子意图搜索算法，不能满足棋子之间的协同性与沟通性，同时也缺乏对敌方的引诱与欺骗等高级对抗能力。本文提出一种结合UCT搜索策略的高价值棋子博弈方法，实现高价值棋子协同博弈的策略。实战经验表明:高价值多棋子军棋协同博弈策略优于单棋子军棋博弈策略。     

吴庄铁矿盘区间柱回采优化研究

基于吴庄铁矿盘间柱宽度不确定性、两侧均为充填体且高度大的现状，为安全高效回采盘区间柱，制定了盘区间柱两侧采场充填体取芯设计方案，并对充填体进行制样，进行了实验室试块抗压强度试验。试验结果表明：一步骤采场（矿柱）充填体强度整体符合设计强度要求，二步采场充填体强度整体偏低，盘区间柱宽度较设计变化较大，宽度极其不规整，整体呈上窄下宽的规律。鉴于盘区间柱宽度不规则、二步骤采场充填体强度低于预期、采场高度大和盘区间柱回采时不能大面积暴露的特点，采用留设一定厚度间柱和采用较小采场长度的措施进行回采方案制定，制定了小采场分段空场嗣后充填法回采方案。该方案的制定和实施，对于其他类似地下矿山三步骤间柱回采工程具有借鉴意义。     

High-Tg porous polyimide films with low dielectric constant derived from spiro-(adamantane-2,9′(2′,7′-diamino)-fluorene)

Porous polyimide (PI) films with low dielectric constants and excellent thermal properties have been a pressing demand for the next generation of high-performance, miniature, and ultrathin microelectronic devices. A series of novel porous PI films containing fluorenyl-adamantane groups were prepared successfully via thermolysis of poly(ethylene glycol) (PEG) added in the PI matrix. The cross-sectional morphologies of porous PI films showed closed pores with diameters ranging from 135 to 158 nm, which were uniform and regular in shape without interconnectivity. These porous PI films exhibited excellent thermal properties with a glass-transition temperature at 376 °C whereas the 5% weight loss temperature in air excess of 405 °C due to enhanced rigidity afforded by fluorenyl-adamantane groups. Accompanied by thermolysis content of PEG increasing from 0 to 20 wt %, the density of porous PI films decreased, and the corresponding porosity grew significantly from 0 to 11.48%. Depending on porosity, the dielectric constant and dielectric loss of porous PI films significantly declined from 2.89 to 2.37 and from 0.050 to 0.021, respectively. These excellent properties benefit the as-prepared porous PI films for application as interlayer dielectrics, integrated circuit chips, or multichip modules in microelectronic fields. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47313.