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131.
Thermal barrier coatings (TBC) are widely used to prevent transient high temperature attack and allow components high durability. Due to strong inhomogeneous material properties the TBC failure often initiates near the interface between the brittle oxide layer and the ductile substrate. A reliable prediction of the TBC failure requires detailed information about the crack tip field and the consequent fracture criteria. In the present paper both cohesive model and gradient plasticity are used to simulate the failure process and to study interdependence of the interface stress distribution with the specific fracture energies. Computations confirm that combination of the two models is able to simulate different failure mechanisms in the TBC system. The computational model has the potential to give a realistic prediction of the crack propagation process. 相似文献
132.
一种新型的多功能照相胶片影像质量评价方法 总被引:1,自引:0,他引:1
本设计了一种新型的多功能照相胶片感光性能和影像质量评价方法。这种方法的主要特点的快速、方便并有满足 实用要求的精确度。该方法仅使用一个测试标板,就可以很容易地测定出照相胶片的感光性能、分辨率、均方根粒度和密度振幅响应(DAR)值等多种表征影像质量的参数。本简要介绍该方法并给出试验结果及其与传统测试方法的比较和讨论意见。 相似文献
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P. G. Muzykov Y. I. Khlebnikov S. V. Regula Y. Gao T. S. Sudarshan 《Journal of Electronic Materials》2003,32(6):505-510
To establish fast, nondestructive, and inexpensive methods for resistivity measurements of SiC wafers, different resistivity-measurement
techniques were tested for characterization of semi-insulating SiC wafers, namely, the four-point probe method with removable
graphite contacts, the van der Pauw method with annealed metal and diffused contacts, the current-voltage (I-V) technique,
and the contactless resistivity-measurement method. Comparison of different techniques is presented. The resistivity values
of the semi-insulating SiC wafer measured using different techniques agree fairly well. As a result, application of removable
graphite contacts is proposed for fast and nondestructive resistivity measurement of SiC wafers using the four-point probe
method. High-temperature van der Pauw and room-temperature Hall characterization for the tested semi-insulating SiC wafer
was also obtained and reported in this work. 相似文献
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A. Kaveh V. Kalatjari 《International journal for numerical methods in engineering》2003,58(5):771-791
In this article size/topology optimization of trusses is performed using a genetic algorithm (GA), the force method and some concepts of graph theory. One of the main difficulties with optimization with a GA is that the parameters involved are not completely known and the number of operations needed is often quite high. Application of some concepts of the force method, together with theory of graphs, make the generation of a suitable initial population well‐matched with critical paths for the transformation of internal forces feasible. In the process of optimization generated topologically unstable trusses are identified without any matrix manipulation and highly penalized. Identifying a suitable range for the cross‐section of each member for the ground structure in the list of profiles, the length of the substrings representing the cross‐sectional design variables are reduced. Using a contraction algorithm, the length of the strings is further reduced and a GA is performed in a smaller domain of design space. The above process is accompanied by efficient methods for selection, and by using a suitable penalty function in order to reduce the number of numerical operations and to increase the speed of the optimization toward a global optimum. The efficiency of the present method is illustrated using some examples, and compared to those of previous studies. Copyright © 2003 John Wiley & Sons, Ltd. 相似文献
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