基于CAN总线的嵌入式智能防褥疮气垫床的设计

针对家庭护理问题,设计并实现了基于CAN总线的嵌入式智能防褥疮气垫床.阐述了该智能气垫床的硬件系统设计,软件系统设计及实现方法.气垫床控制模块由AT90CAN128单片机、气垫床、压力传感器、气泵和电磁阀门等构成.采用S3C2440作为主控制模块,以WindowsCE操作系统为核心开发的人机交互界面(HMI)通过CAN总线实时传递各个功能模块命令,能够实现气垫床的预定功能,给出了实验实测数据,并且能够实现即插即用的模块化设计.     

在CodeWarrior编译环境下运行μC／OS—Ⅲ

μC／OS-Ⅱ是面向8／16位及低端32位单片机应用的RTOS,而新近推出的μC／OS-Ⅲ则面向高性能32位单片机,如ARMCortex等。以Cortex—M4为内核的Kinetis系列单片机,不仅用于全国大学生飞思卡尔杯智能车竞赛,也用于诸多大学的嵌入式系统教学,官方提供的开发环境是CodeWarrior。本文介绍如何利用CodeWarrior开发环境,将μC／OS-Ⅲ在Kinetis单片机上运行起来,以便将μC／OS-Ⅲ引入教学、科研与应用。     

以ARM为核心的嵌入式体感遥控器设计

介绍一种以ARM为核心的嵌入式服务机器人体感遥控器的设计。硬件上,本遥控器采用具有ARM Cortex—M3内核的STM32F103C8T6作为核心处理器,选用ST公司的iNEMO惯性导航模块进行手部姿态的识别,同时还具有LCD显示模块、无线收发模块和电源模块;软件上,采用嵌入式操作系统μC／OS—Ⅱ实现多任务的调度和外围设备的管理。经实验验证,本遥控器具有高稳定性、高实时性、高可靠性、低误码率等优点。     

智能家居系统中的短信收发程序设计

针对智能家居系统中安防报警信息实时收发及家电远程控制的需求,提出使用3G模块收发短信的方法,并设计了实现短信同时收发功能的软件架构。实验结果表明,该方法简单实用,能够满足智能家居系统的要求。     

通用可靠的串口/以太网网关设计

介绍了一种串口/以太网嵌入式网关的设计方案,详细讨论了串口可靠通信的实现方法,并在开源操作系统RT-Thread和微处理器S3C2440开发板的软硬件平台上实现。网关实际应用于一个无线传感器网络项目,实验表明该网关能实现可靠的数据通信。     

基于微电压调节的太阳能充放电系统设计

基于微电压调节的太阳能充放电系统,是以微控制器LPC1114为核心的太阳能电池板充放电电路,是实现高效率的智能充放电设计方案。微电压调节理论整合了经典电压回授法和多种太阳能最大功率点追踪思想,利用简单合理的DC／DC平衡技术,充分考虑系统功耗等问题,以简单的电路设计和创新的软件思想实现更高效率的太阳能系统。随着能源危机的加剧,高效率、低成本的太阳能系统备受社会关注,其在民用、交通等领域的运用也更加重要。     

An improved bacterial foraging algorithm for combined static/dynamic environmental economic dispatch

Economic dispatch is carried out at the energy control center to find out the optimal output of thermal generating units such that power balance criterion is met, unit operating limits are satisfied and the fuel cost is minimized. With growing environmental awareness and strict government regulations throughout the world, it has become essential to optimize not only the total fuel cost but also the harmful emissions, both, under static as well as dynamic conditions. The static environment economic dispatch finds the optimal output of generating units for a fixed load demand at a given time, while the dynamic environmental economic dispatch schedules the output of online generators with changing power demands over a certain time period (normally one day) so as to minimize these two conflicting objectives, simultaneously. In this paper, the price penalty factor approach is employed for simultaneous minimization of cost and emission. The generator ramp rate constraints, non-convex and discontinuous nature of cost function and the large number of generators in practical power plants, make this problem very difficult to solve. Here, a fuzzy ranking approach is employed to identify the solution which offers the best compromise between cost and emission objectives.     

自适应变步长最大风能捕获算法

风能具有随机性、不稳定性的特点,为了提高风力发电系统中风能的利用效率,在比较各种最大风能捕获算法的基础上,分析了爬山搜索法和叶尖速比法的不足,提出了自适应变步长搜索算法来捕获最大风能.通过改进爬山搜索法的变步长策略,明显加快了搜索速度,通过引入初始估计叶尖速比值,大大缩小了搜索范围.该算法不需要实时检测准确风速,不依赖风力机最佳功率曲线,有效地降低了成本,提高风力发电的效率.文中重点分析了算法的自适应性和变步长策略,仿真结果表明,该算法能够使风力机更快速到达最大功率点,动态响应快,收敛性好.     

A copper/polyimide Metal-base packaging technology

A unique substrate MCPM (Mitsubishi Copper Polyimide Metal-base) technology has been developed by applying our basic copper/polyimide technology.¹ This new substrate technology MCPM is suited for a high-density, multi-layer, multi-chip, high-power module/package, such as used for a computer. The new MCPM was processed using a copper metal base (110 × 110 mm), full copper system (all layers) with 50-μm fine lines. As for pad metallizations for the IC assembly, we evaluated both Ni/Au for chip and wire ICs and solder for TAB ICs. The total number of assembled ICs is 25. To improve the thermal dispersion, copper thermal vias are simultaneously formed by electro-plating. This thermal via is located between the IC chip and copper metal base, and promotes heat dispersion. We employed one large thermal via (4.5 mm^?) and four small vias (1.0 mm^?) for each IC pad. The effect of thermal vias and/or base metal is simulated by a computer analysis and compared with an alumina base substrate. The results show that the thermal vias are effective at lowering the temperature difference between the IC and base substrate, and also lowering the temperature rise of the IC chip. We also evaluated the substrate’s reliability by adhesion test, pressure cooker test, etc.     

A functional programming approach to the specification and verification of concurrent systems

Networks of communicating processes can be viewed as networks of stream transformers and programmed in a lazy functional language. Thus the correctness of concurrent systems can be reduced to the correctness of functional programs. In this paper such correctness is proved formally in the-calculus extended with recursion equations for functional programs. The-calculus is chosen since it allows the definition of properties by least fixed points (induction) as well as by greatest fixed points (coinduction), and since greatest fixed points are useful for formalising properties, such as fairness, of infinitely proceeding programs. Moreover, non-deterministic processes are represented as incompletely specified deterministic processes, that is, as properties of stream transformers. This method is illustrated by proving the correctness of the alternating bit protocol.