Formation and electronic structure of interface

In the present work the formation of the interface between polycrystalline silver and thin films of titanium oxide was studied with photoelectron spectroscopy (XPS, UPS) and time-of-flight secondary ion mass spectrometry (TOF-SIMS). Titanium oxide was deposited stepwise on 100 nm thick silver films by reactive magnetron sputtering allowing to study the evolution of the interface formation process. The process involves two steps: formation of thin layer of silver oxide and subsequent growth of the TiO₂ film. For better understanding of the silver oxidation process, pure silver films were exposed to a low temperature Ar/O plasma for different time intervals providing a possibility to investigate early stages of the oxide film growth.     

离子束辅助沉积制备高功率激光薄膜的研究

综述了离子束辅助沉积技术在高功率激光薄膜制备中的应用研究进展.指出该技术在制备高激光损伤阈值的薄膜中存在的问题,即出现过高的堆积密度,会给薄膜带来杂质缺陷、化学计量比缺陷、损伤缺陷、晶界缺陷,制备薄膜的残余应力存在着压应力增加的趋势,会改变薄膜的晶体结构等.并指出了该研究领域的研究方向.     

Electrochemical C-V Characteristics and Photoluminescence of a-C∶N Films

Amorphous carbon (a-C) films and amorphous carbon films incorporating with the nitrogen (a-C∶N) were deposited on silicon substrates in a radio-frequency driven plasma enhanced chemical vapour deposition system, while the surface electrical properties of films were investigated by electrochemical capacitance-voltage measurements. It was examined the effect of the interface defects on the properties and deduced that the conducting type of a-C∶N films was n-type. Subsequently, a comparative studies of a-C and a-C∶N films were performed by photoluminescence spectra depending on the temperature. With the decrease of the temperature, the main band with peak energy of 2.48 eV in the a-C∶N films was more intense compared with the other three bands caused by amorphous C in the a-C films.     

Plasma spraying of nanostructured partially yttria stabilized zirconia powders

Nanosized partially yttria stabilized zirconia particles, prepared using a co-precipitation method, were reprocessed into agglomerate powders using two methods for plasma spraying. The first method was to make micrometer-sized agglomerates directly following the grinding of the calcined yttria–zirconia agglomerates. The second method was to reconstitute the nanosized particles into micrometer agglomerates using spray drying. The deposition efficiency, porosity, microhardness and average grain size of the deposits made from these two reprocessed powders were studied. Distinct results related to the process parameters were obtained for the two types of powders. The second type of powder was more suitable for plasma spraying than the first one. Using the second type of powder, some unique results distinguished from those of the conventional partially yttria stabilized zirconia powders were observed and an optimized coating with a porosity of 3.8%, Hv_0.3 of 953 and mainly consisting of 1–3 μm columnar grains in the columnar direction and smaller than 100 nm in their cross-sections was achieved.     

化学气相沉积铜薄膜研究进展

本文综术了集成电路工艺的Cu布线中Cu薄膜化学气相沉积(CVD)的研究背景,详细介绍了CVD生长Cu金属薄膜的国内外研究进展及CVD对前趋物的要求,并对前趋物的一些物理、化学性质进行了总结,最后,对薄膜沉积的计算机摸拟作了简要介绍。     

喷射沉积SiCP/Al复合材料及6066铝合金热挤压工艺的研究

作者应用喷射共沉积工艺制备 6 0 6 6 / Si Cp复合材料和 6 0 6 6铝合金锭坯 ,在不同的挤压比、挤压温度下挤压成　　型 ,用金相显微镜观察材料的显微组织 ,并测试了材料的力学性能。结果表明 :Si C/ Al复合材料喷射沉积状态的组织很疏松 ,存在许多的间隙 ,其密度约为理论密度的 86 % ,Si C颗粒在复合材料中分布不均匀 ,喷射沉积铝合金基体的致密度可达 90 % ;挤压过程使 Al/ Si Cp复合材料的大多数空隙消失 ,致密程度随挤压比的增大而增大 ,挤压比超过 14 .7后不会明显变化 ,而铝合金基体的致密程度与挤压比的变化关系不明显 ;挤压温度对材料的致密程度影响不大 ;Al/ Si Cp复合材料性能在挤压比超过 14 .7后变化不大 ;铝合金的性能不受挤压比变化的影响 ;而挤压温度过高使材料性能下降     

掺Nd纳米ZnO薄膜特性研究

研究了用真空蒸发法在玻璃衬底上制备稀土掺杂纳米ZnO薄膜结构、导电性及光透射性能。结果显示 ,在 5 0 0℃氧化、热处理稀土元素Nd掺杂后能够明显改善纳米ZnO薄膜的结构特性 ,薄膜的晶粒尺寸随掺杂含量的增加而减小。掺Nd使ZnO薄膜的电性能有所改善但使纳米ZnO薄膜的光透射性有所降低。     

Characterization of EBPVD micro-layer composites and simulation of its internal stress state

Based on the basic operating principal and the technology characteristic of electron beam physical vapor deposition(EBPVD) technique, EBPVD was used to prepare the micro-layer composites. The effect on the substrate preheating temperature was taken into accounts and the finite element analysis package ANSYS was used to simulate the internal stress field and the potential displacement changing tendency. The results show that one of the most important quality factors on the judgment of micro-layer composites is the adhesion between the substrate and the deposition layers as well as among the different deposition layers. Besides the existance of temperature gradient through the thickness of layers, the main reason for the internal stress in micro-layer composites is the mismatch of various properties of the layer and the substrate of different thermal expansions and crystal lattice types. With the increase of substrate preheating temperature, the inter-laminar shear stress also takes on a tendency of increase but the axial residual stress decrease.     

Effect of type of processing on the microstructural features and mechanical properties of Al-Cu/SiC metal matrix composites

In this study, an aluminum based metallic matrix (Al-2wt.% Cu) was reinforced with SiC particulates using a conventional casting technique and a new disintegrated melt deposition technique. Microstructural characterization studies conducted on the samples taken from disintegrated melt deposition technique revealed a more uniform distribution of SiC particulates and good interfacial integrity between SiC particulates and metallic matrix when compared to the conventionally cast composite samples. Results of ambient temperature mechanical tests demonstrate an increase in 0.2% YS and ultimate tensile strength of samples taken from disintegrated melt deposition technique when compared with the unreinforced and conventionally cast composite samples. The results of microstructural characterization and mechanical testing were finally rationalized in terms of the nature of processing technique employed to reinforce Al-2wt.% Cu metallic matrix with SiC particulates.     

溅射——气体——聚集共沉积法制备金属／金属（介质）复合团簇镶嵌薄膜

提出了溅射－气体－聚集共沉积制备金属／金属（介质）复合团簇镶嵌薄膜的新方法，并利用该方法成功地在方华膜衬底上制备了系列Ｆｅ／Ａｇ及ＣａＦ２复合团簇镶嵌薄膜样品。透射电镜分析结果表明，样品中Ｆｅ（Ｃｕ）团簇都较好地镶嵌于Ａｇ（ＣａＦ２）基质中，其结构为两种材料的多晶共存形态。进一步分析发现，与块材相比，Ｆｅ／Ａｇ样品中Ｆｅ团簇晶格常数呈现出不同程度的收缩，而Ｃｕ／ＣａＦ２样品中Ｃｕ团簇晶格常数则呈现出不同程度的膨胀。运用附加压力的模型对该现象进行了解释。