一种新的VLSI功能噪声故障分析方法

将相邻线间的信号跳变方向考虑到噪声窗口模型中,提高计算同时跳变的干扰线在受扰线上引起的组合噪声脉冲结果的准确性;利用改进的噪声窗口模型,对受扰线的弱干扰线集合、强干扰线集合以及传播噪声同时进行分析,得到电路中精确的可实现有效噪声脉冲以及相应的有效干扰线集合。对10个MCNC基准电路进行实验,结果表明,该方法能够非常有效地滤除功能噪声分析过程中的虚假噪声故障。     

Bus encoder design for reduced crosstalk,power and area in coupled VLSI interconnects

This research work presents a novel circuit for simultaneous reduction of power, crosstalk and area using bus encoding technique in RC modeled VLSI interconnect. Bus-invert method is used to reduce inter-wire coupling, which is actually responsible for crosstalk, delay and power dissipation in coupled interconnects. The proposed method focuses on simplified and improved encoder circuit for 4, 8 and 16 coupled lines. In past, the researchers developed encoders that usually focused on minimizing power dissipation and/or crosstalk, thereby paying heavy penalty in terms of chip area. However, the proposed encoder and decoder while significantly reducing crosstalk demonstrates an overall reduction of power dissipation by 68.76% through drastically limiting switching activity. Furthermore, while reducing the complexity, chip area and transistor count of the circuit is reduced by more than 57%.     

系统芯片中AMBA总线串扰故障的自测试方法

系统芯片(SoC)技术的发展使得芯片内总线长度大大增加；芯片速度按照摩尔定律成倍提高(高达GHz)，总线间的串扰(Crosstalk)现象也日益严重，因此关于串扰的故障模型和自测试技术越来越受到关注。本文利用最大侵扰故障MAF(Maximal Aggressor Fault)模型，提出了一种SoC芯片中总线串扰故障的自测试方法。利用该方法，SoC芯片中地址、数据和控制总线的串扰故障均得到了测试，实验结果也表明其硬件开销较其它方案大大降低。     

Low dielectric constant materials and methods for interlayer dielectric films in ultralarge-scale integrated circuit multilevel interconnections

This paper reviews low dielectric constant materials for interlayer dielectric films in ultralarge-scale integrated circuit (ULSI) multilevel interconnections. The trends of ULSIs in the last decade were briefly described first. Then, the requirements for interlayer dielectric film properties and their formation techniques were explained. They are: (1) a low dielectric constant, (2) a surface planarity, (3) a gap-filling capability, and (4) a low residual stress. In contrast with the requirements, the interlayer dielectric films and related technologies developed in the last decade were reviewed. In the requirements, the low dielectric constant materials are strongly required because the device performance has been limited by signal propagation time and cross-talk in the multilevel interconnections. Furthermore, the low dielectric constant is also required for reduction of power consumption in ULSI operation. Finally, the low dielectric constant materials were summarized, and future trends of the low dielectric constant interlayer dielectric film technologies are discussed.     

Distributed Fabry——Perot Measurement System

The theoretic analysis indicates that if the lengths of the cascaded and paralleled Fabry-Perot sensors are properly selected, the crosstalk can be well restricted.And the experiment simulation results agree with that of the theoretic analysis.     

高速PCB串扰分析及其最小化

技术进步带来设计的挑战,在高速、高密度PCB设计中,串扰问题日益突出.本文就串扰原理和对信号完整性影响进行分析,并在此基础上提出了高速P C B设计中串扰最小化的方法.     

红外小光点扫描测试仪自动调焦实验研究

自动调焦是红外小光点扫描测试仪关键技术之一。文中综述了光学中常用的几种自动调焦方法，在红外小光声、扫描测试仪中采用了平滑法调焦，并结合系统实际对原平滑法硬件结构做了灵活应用，经实验验证正焦判别与理论一致，焦深附近调焦灵敏度值为0．01Vpp／μm，并比其它方法结构简单。     

Crosstalk bandwidth and stability analysis in graphene nanoribbon interconnects

Based on transmission line modeling (TLM), and using the Nichols chart, we present a bandwidth and stability analysis, together with step time responses, for coupled multilayer graphene nanoribbon (MLGNR) interconnects that is inquired for the first time. In this analysis, the dependence of the degree of crosstalk relative stability for coupled MLGNR interconnects comprising of both capacitive and mutual-inductive couplings between adjacent MLGNR has been acquired. The obtained results show that with increasing the length or decreasing the width of the MLGNRs, the stability in near-end output increases. While, any increase in the length or width of MLGNRs, decrease the stability of far-end output. Also, by increasing capacitive coupling or decreasing inductive coupling, the near-end output becomes more stable, and the far-end output becomes less stable. Moreover, any increase in the length or capacitive coupling, decreases the bandwidth, whereas any increase in the width or inductive coupling, increases the bandwidth. Finally, transient simulations with Advanced Design System (ADS) show that the model has an excellent accuracy.     

Adaptive Techniques for Joint Optimization of XTC and DFE Loop Gain in High‐Speed I/O

High‐speed I/O channels require adaptive techniques to optimize the settings for filter tap weights at decision feedback equalization (DFE) read channels to compensate for channel inter‐symbol interference (ISI) and crosstalk from multiple adjacent channels. Both ISI and crosstalk tend to vary with channel length, process, and temperature variations. Individually optimizing parameters such as those just mentioned leads to suboptimal solutions. We propose a joint optimization technique for crosstalk cancellation (XTC) at DFE to compensate for both ISI and XTC in high‐speed I/O channels. The technique is used to compensate for between 15.7 dB and 19.7 dB of channel loss combined with a variety of crosstalk strengths from 60 mV_p‐p to 180 mV_p‐p adaptively, where the transmit non‐return‐to‐zero signal amplitude is a constant 500 mV_p‐p.     

Temperature dependant crosstalk analysis in coupled single‐walled carbon nanotube (SWCNT) bundle interconnects

The temperature‐dependent, crosstalk‐induced, noise voltage waveform and its frequency spectrum, in capacitive coupled single‐walled carbon nanotube (SWCNT) bundle interconnects, at the far end of victim line, have been analyzed at 22‐nm technology node. A similar analysis is performed for copper interconnects and a comparison is made between the results of these two analyses. The SPICE simulation results reveal that at temperature variations ranging from 300 to 500 K, compared with conventional metal (copper) conductors, crosstalk noise voltage levels in CNT, at the far end of victim line, are significantly low. Simulated results further reveal that, with rise in interconnect temperatures, compared with copper interconnects, coupled interconnects of SWCNT bundle filter more noise frequency components. Based on these comparative results, an improved model for extracting inter‐bundle, real life, coupling capacitances between SWCNT bundles has been proposed. Copyright © 2014 John Wiley & Sons, Ltd.