基于TD-HSDPA系统DRX周期与VoIP性能的研究

针对终端省电问题,首先对承载VoIP业务的终端省电原理进行了介绍;基于上述省电方式,然后给出了基于TD-HSDPA系统不连续接收(DRX)周期和VoIP业务的建模和性能分析;最后对终端不同移动速度下DRX周期以及相关定时器对基于TD-HSDPA系统下终端的VoIP业务性能的影响和省电情况进行了仿真.研究表明,在快速移动时,较短的定时器会对VoIP的业务性能产生影响,长定时器会获得更多省电的机会,特别在单纯VoIP通信环境下,业务的运行性能可以通过使用较长的定时器来得到缓解.     

ZK60镁合金高应变速率压缩变形的流变行为及显徽组织

在250-400℃的温度范围和0.1-50 s^-1的应变速率范围内对ZK60合金进行压缩变形,对其流变行为和显微组织进行研究。结果表明,在低应变速率（0.1-1 s^-1）下压缩变形时,再结晶主要发生在初始晶界上;在高应变速率（10-50 s^-1）下压缩变形时,再结晶同时在初始晶界和孪晶上发生。合金在应变速率10-50 s^-1和温度250-350℃的变形条件下获得均匀、细小的再结晶组织。因此,合金的最佳热加工工艺范围为应变速率10-50 s^-1、变形温度250-350℃。高应变速率压缩变形条件下的孪生诱发动态再结晶过程分三步,首先,高位错密度孪晶分割初始晶粒;然后,孪晶内的位错发生重排形成亚晶;最后,随着应变的增加而形成再结晶晶粒。     

AZ31镁合金多阶段超塑性变形

开展了多阶段变形的方法对AZ3 1镁合金超塑性性能提升的研究。结果表明 :第一阶段动态再结晶的最佳条件是温度 3 0 0℃、应变速率 1× 10 - 3s- 1 、此条件下变形量为 5 0 %的时候 ,晶粒尺寸约为 10 μm ;在第二阶段 ,实验温度为40 0℃以及应变速率为 10 - 3s- 1 的变形条件下 ,获得最大延伸率 2 82 .1%。     

TD-LTE系统DRX机制的分析与设计

为了降低移动终端的功率消耗,并且进一步支持多种业务和大量数据的传输,在长期演进(TD-LTE)系统中引入了非连续接收省电机制(DRX)。通过各种定时器的操作详尽分析了DRX机制的基本原理,设计出一种自适应DRX机制的具体实现方案。仿真结果表明,此机制在减少功率消耗方面有很大的改进,同时保证用户的良好体验。     

The effects of deformation variables on hot workability of austenitic stainless steel

The torsion tests of 304 stainless steel were performed in the temperature range of 900~1100°C and strain rate range of 5.0 × 10^-2~5.0 × 10°/sec to study the high temperature softening behavior. The flow curves and microstructures showed the behavior of dynamic recrystallization (DRX). The dependence of temperature(T) and the stain rate(ɛ) on the flow stress was expressed by the hyperbolic sine law, ɛ=2.75 × 10 (sinh 0.076σ)^5.26 exp(-379000 J/mol/RT). The dynamically recrystallized grain size(d_DRX) was related to the value of the Zener-Hollomon parameter Z. Under the Z value of 10¹⁷, it was found that the grain size ranged from 10 to 20 μm. The relationship between the dynamically recrystallized grain size and Z parameter was found as follows: d_DRX=l 39.48-7.33 log Z and the calculated grain sizes were well matched with the experimental values. To determine the optimum condition of plastic deformation, the deformation map was made from the efficiency of power dissipation. The maximum efficiency was 0.41 at the condition of 1100°C, 0.5/sec, 100%.     

Mg-1Zn-1Gd合金在等径角挤压下的晶粒细化机理及织构演变

研究等径角挤压(ECAP)对Mg-1Zn-1GD合金组织、织构和动态再结晶行为的影响,结果表明,在350℃等径角挤压后,试样的显微组织由细小的再结晶晶粒组成,基体中有大量均匀分布的等轴晶。8道次获得平均晶粒尺寸为3.6m的均匀超细晶粒结构。不连续动态再结晶(DDRX)和连续动态再结晶(CDRX)导致晶粒细化。利用电子背散射衍射技术对织构进行了分析。结果表明,经过4次ECAP后,形成了较强的基础纹理(多重随机分布~19.76)。随着挤压道次的增加,挤压合金板材基面上的晶粒主要沿挤压方向拉长,取向分布由集中状态向分散状态转变。织构减弱,最大值为15.66。最后表明织构与Mg-1Zn-1GD合金的平面各向异性有关.     

Effect of Initial Grain Size on the Hot Deformation Behavior and Microstructural Evolution of Pure Copper

The influences of initial grain size (IGS) with 20 µm and 50 µm on the hot flow behavior and microstructural changes of pure copper were investigated using hot compression tests at a temperature range of 623-1073 K and strain rate range of 0.001-0.1 s^-1. The effects of critical stress and corresponding critical strain were studied based on the internal and external processing parameters. The critical stress and strain decreased with increasing temperature and decreasing strain rate. The investigation results of the microstructure and true strain-stress diagrams showed that dynamic recovery, dynamic recrystallization (DRX), and twinning mechanisms were caused during the hot deformation of pure copper. Microstructure evolution indicated some DRXed fine-grain took place around grain boundary of hot deformed samples with IGS of 20 µm whereas DRXed fine-grain took place in interior grains for samples with larger IGS. The results also showed that grain growth is also dependent on IGS as the grain growth rate for samples with the larger IGS is greater than the smaller IGS. The critical strain rate and the temperature were obtained at 0.01 s^-1 and 973 K, respectively, for the sudden change in the grain growth rate. Also, twinning highly depended on IGS which almost did not happen in fine grain size while the volume fraction of twinning increased with increasing grain size.     

Ti2448合金高温变形行为及组织演变机制的转变

研究了多功能亚稳β型Ti2448（Ti 24Nb-4zr-8Sn,质量分数,%）合金在β单相区的高温变形行为.结果表明.在低应变速率(≤0.1 s^-1和高应变速率(≥1 s^-1)条件下,真应力和应变速率的双对数关系可以通过2个线性关系分别表征,平均应变速率敏感值（mavg）分别为0.265和0.032,这不同于常规β钛合金随着应变速率的增大而逐渐降低的应变硬化规律,即Sigmoidal曲线特征.微观组织演化和动力学分析显示,这种特殊的双线性关系与高应变速率导致的局域化非均匀塑性变形行为和动态再结晶（DRX）相关联.尽管动态回复（DRV）是该合金高温塑性变形的主要组织演变机制,高应变速率使得组织演变从DRV向DRX转变,并在交错的变形带内形成小于3μm的细晶组织.因此,高应变速率条件下的DRX是实现Ti2448合金高温变形过程中细化组织的主要机制.     

GH625合金的动态再结晶行为研究

采用Gleeble-3800热模拟试验机研究了GH625合金在变形温度为950～1150℃,应变速率为0.001～5s-1条件下的热变形特性,并用OM和TEM分析了变形条件对微观结构的影响。结果表明:当应变量很小时,该合金没有发生再结晶,直到应变量达到0.1时才开始有再结晶晶粒析出。随着变形温度的升高,再结晶晶粒尺寸增大,位错密度降低;当温度较低时显微结构中可以观察到孪晶。当变形温度一定时,随应变速率的增大,再结晶的形核率增大且晶粒变小,位错密度变大;而当应变速率较低时,再结晶进行得比较充分,晶粒尺寸较大。根据实测的应力-应变曲线,获得了该合金发生动态再结晶的临界应变εc和峰值应变εp与Z参数之间的关系:εc=2.0×10-3.Z0.12385,lnεp=-6.02285+0.12385lnZ。此外,还采用定量金相法计算出了合金的动态再结晶体积分数,并建立了该合金动态再结晶的动力学模型:Xd=1-exp[-0.5634(ε/εp-0.79)1.313]。     

基于LTE的移动物联网通信新技术发展综述

据统计,到2025年,全球物联网的终端连接将达到50亿以上,这显然是一个颠覆性的机会。在此背景下,满足物联网广覆盖、大容量、低功耗和低成本等特定需求的新型LPWA低功耗广域覆盖通信技术应运而生,包括两种基于LTE的移动通信新技术:Cat-NB1和Cat-M1。对上述两种技术的演进和关键技术进行了分析和比较,并深入研究了两者用到的核心低功耗技术和应用,最后分析了基于LTE的移动物联网通信新技术的实现策略,并对其应用和发展进行了展望。