High‐efficiency transmission‐line inverse Class F power amplifiers for 2‐GHz WCDMA systems

In this article, a novel load‐network solution to implement the transmission‐line inverse Class F power amplifiers for base station WCDMA applications is presented. The theoretical analysis is based on an analytical derivation of the optimum load‐network parameters to control the second and third harmonics at the device output, including the device output parasitic shunt capacitance and series inductance. The transmission‐line inverse Class F LDMOSFET and GaN HEMT power amplifiers using NXP BLF6G22LS‐75 and CREE CGH27060F devices, respectively, were designed and measured. The high‐performance results with the drain efficiency of 70.2% and power gain of 18.0 dB for a 60‐W LDMOSFET power amplifier and with the drain efficiency of 82.3% and power gain of 14.3 dB for a 50‐W GaN HEMT power amplifier were achieved at an operating frequency of 2.14 GHz. © 2011 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2011.     

C波段GaN HEMT功率放大器设计

该文介绍了一款应用于38 GHz的大功率超宽带功率放大器。电路设计中采用了键合线连接裸片与微带电路,并对该部分单独进行电磁场仿真。采用渐变微带线的方法实现了宽带匹配,通过HFSS与ADS的联合仿真优化设计,完成了大功率宽频带的功率放大器设计和仿真过程,仿真结果表明在频率38 GHz范围内增益（8．5＆#177;1） dB,1 dB压缩点输出功率为48 dBm最大饱和功率为49．5 dBm。     

Traps centers and deep defects contribution in current instabilities for AlGaN/GaN HEMT's on silicon and sapphire substrates

AlGaN/GaN high electron mobility transistors (HEMTs) with Si and Al₂O₃ substrates reveals anomalies on I_ds-V_ds-T and I_gs-V_gs-T characteristics (degradation in drain current, kink effect, barrier height fluctuations, etc.). Stress and random telegraph signal (RTS) measurements prove the presence of trap centers responsible for drain current degradation. An explanation of the trapping mechanism responsible for current instabilities is proposed. Deep defects analysis performed by capacitance transient spectroscopy (C-DLTS), frequency dispersion of the output conductance (G_ds(f)), respectively, on gate/source and drain/source contacts and RTS prove the presence of deep defects localized, respectively, in the gate and in the channel regions. Defects detected by C-DLTS and G_ds(f) are strongly correlated, respectively, to barrier height inhomogeneities and kink anomalies. Gate current analysis confirms the presence of (G-R) centers acting like traps at the interface GaN/AlGaN. Finally, the localization of these traps defects is proposed.     

Numerical Explanation of Slow Transients in an AlGaN/GaN HEMT

观察了AlGaN/GaN HEMT器件在短期应力后不同栅偏置下的一组漏极电流瞬态,发现瞬态的时间常数随栅偏压变化很小,据此判断这组瞬态由电子陷阱的释放引起.为了验证这个判断,采用数值仿真手段计算了上述瞬态.分别考虑了在器件中不同空间位置的电子陷阱,分析了应力和瞬态中相应的陷阱行为,对比和解释了仿真曲线与测量结果的异同.基于上述讨论,提出测量的瞬态可能是表面深陷阱和GaN层体陷阱的综合作用的结果.     

Ultraviolet photoresponse of ZnO nanostructured AlGaN/GaN HEMTs

We present the first active visible blind ultraviolet (UV) photodetector based on zinc oxide (ZnO) nanostructured AlGaN/GaN high electron mobility transistors (HEMTs). The ZnO nanorods (NRs) are selectively grown on the gate area by using hydrothermal method. It is shown that ZnO nanorod (NR)-gated UV detectors exhibit much superior performance in terms of response speed and recovery time to those of seed-layer-gated detectors. It is also found that the best response speed (~10 and~190 ms) and responsivity (~1.1×10⁵ A/W) were observed from detectors of the shortest gate length of 2 µm among our NR-gated devices of three different gate dimensions, and this responsivity is about one order higher than the best performance of ZnO NR-based UV detectors reported to date.     

应用于大功率MMIC开关的AlGaN背势垒GaN HEMT

报道了应用于大功率开关的AlGaN背势垒0.25μm GaN HEMT。通过引入AlGaN背势垒,MOCVD淀积在3英寸SiC衬底上的AlGaN/GaN异质结材料缓冲层的击穿电压获得了大幅度的提升,相比于普通GaN缓冲层和掺Fe GaN缓冲层击穿电压提升幅度分别为4倍和2倍。采用具有AlGaN背势垒AlGaN/GaN 外延材料研制的GaN HEMT开关管在源漏间距为2μm、2.5μm、3μm、3.5μm和4μm时,估算得到的关态功率承受能力分别为25.0W、46.2W、64.0W、79.2W和88.4W。基于源漏间距为2.5μm的GaN HEMT开关管设计了DC-12GHz的单刀双掷MMIC开关。该开关采用了反射式串-并-并结构,整个带内插入损耗最大1.0dB、隔离度最小30dB,10GHz下连续波测试得到其功率承受能力达44.1dBm。     

Design and simulation of a novel GaN based resonant tunneling high electron mobility transistor on a silicon substrate

For the first time, we have introduced a novel GaN based resonant tunneling high electron mobility transistor (RTHEMT) on a silicon substrate. A monolithically integrated GaN based inverted high electron mobility transistor (HEMT) and a resonant tunneling diode (RTD) are designed and simulated using the ATLAS simulator and MATLAB in this study. The 10% Al composition in the barrier layer of the GaN based RTD structure provides a peak-to-valley current ratio of 2.66 which controls the GaN based HEMT performance. Thus the results indicate an improvement in the current-voltage characteristics of the RTHEMT by controlling the gate voltage in this structure. The introduction of silicon as a substrate is a unique step taken by us for this type of RTHEMT structure.     

AlGaN/GaN HEMT场板结构对与表面态相关的延迟特性的影响

为了研究AlGaN/GaN HEMT器件中场板结构对电流崩塌效应影响的物理机理,我们运用数值模拟的方法研究了场板结构和与表面态相关的栅延迟现象之间的关系。模拟显示场板结构可以显著地抑制电流崩塌效应的强度,但是对延迟时间没有影响。场板结构可以增大AlGaN表面附近的空穴积累,导致表面态的离化率增大从而抑制器件的电流崩塌。     

Optimized power simulation of AlGaN/GaN HEMT for continuous wave and pulse applications

An optimized modeling method of 8 × 100 μm AlGaN/GaN-based high electron mobility transistor (HEMT) for accurate continuous wave (CW) and pulsed power simulations is proposed. Since the self-heating effect can occur during the continuous operation, the power gain from the continuous operation significantly decreases when compared to a pulsed power operation. This paper extracts power performances of different device models from different quiescent biases of pulsed current-voltage (I-V) measurements and compared them in order to determine the most suitable device model for CW and pulse RF microwave power amplifier design. The simulated output power and gain results of the models at V_gs = -3.5 V, V_ds = 30 V with a frequency of 9.6 GHz are presented.     

AlGaN/GaN HEMT结构热时间常数谱提取方法的研究

利用电学法对AlGaN/GaN 高电子迁移率晶体管(HEMTs)有源区瞬态温升进行测量.利用非参数拟合算法—局部加权回归散点平滑法(LOWESS)对原始测量数据进行平滑去噪处理,进而得到热时间常数谱,分析AlGaN/GaN HEMTs热传导路径物理结构。与传统平滑去噪方法—多阶指数拟合相比,通过LOWESS算法得到的热时间常数谱更丰富,得到RC网络更多,进而热传导路径结构分析更精细。结果表明,LOWESS非参数拟合算法能够更好的去除测量数据噪声,保留原始离散数据细微的变化趋势。通过该方法所提取的热时间常数谱能描述AlGaN/GaN HEMTs有源区温度细微变化,帮助研究人员精确分析热传导路径层次构成。