Ceramic and Glass-Ceramic Packaging in the 1990s

A broad overview of packaging involving interconnecting, powering, protecting, and cooling semiconductor chips to meet a variety of computer system needs is presented. The general requirements for ceramics in terms of their thermal, mechanical, electrical, and dimensional control requirements are presented, both for high-performance and low-performance applications. Glass-ceramics are identified as the best candidates for high-performance systems, and aluminum nitride, alumina, or mullite are identified for low-performance systems. Glass-ceramic/copper substrate technology is discussed as an example of high-performance ceramic packaging for use in 1990s. Lower-dielectric-constant ceramics such as composites of silica, borosilicate, and cordierite, with or without polymers and porosity, are projected as potential ceramic substrate materials by the year 2000.     

分子组装抗菌技术在塑料包装材料领域的应用

研究了分子组装抗菌化技术对材料多种性能的影响，发现用分子组装抗菌化技术制得的聚丙烯材料有高效广谱，稳定耐久的抗菌防霉作用，还有优良的使用安全性，属安全无毒、无刺激性材料。同时，利用该技术制备的抗菌母粒对材料的其它性能有不同程度的改进，它在体系中可起到成核剂的作用，在一定程度上改善了材料的力学性能，还可显著提高材料的表面极性，改善其抗静电性能，使表面电阻率下降5－6个数量级，因而在塑料抗菌包装薄膜，食品箱及医药包装等领域有极为广泛的应用前景。     

电子封装用环氧树脂的增韧和提高耐热性研究

用α,ω 二氯聚二甲基硅氧烷(DPS)或α 氯聚二甲基硅氧烷(CPS)来改性普通双酚A环氧树脂(BPAER)和四溴双酚A环氧树脂(TBBPAER),目标是制备出一系列可用于电子封装的高韧性高耐热性的环氧基料。通过对固化物的冲击强度、拉伸强度、断裂伸长率和玻璃化转变温度(Tg)以及断裂面形态的测定,探讨了改性方法、有机硅组成与含量等对材料性能的影响。结果表明,当m(BPAER)∶m(DPS)=100∶10时,树脂固化物的冲击强度达到30 5kJ/m2,拉伸强度达46 95MPa,断裂伸长率达到60 23%,Tg达到141 3℃;分别比未改性BPAER提高了19 7kJ/m2,1 69MPa,54 29%以及5 9℃。而当m(TBBPAER)∶m(CPS)=100∶10时,固化物的冲击强度达到17 2kJ/m2,拉伸强度达39 89MPa,断裂伸长率达到5 60%,Tg达到147 0℃;分别比未改性TBBPAER提高了12 8kJ/m2,28 26MPa,4 29%以及7 9℃。     

Advanced underfill for high thermal reliability

The key to the success of flip‐chip technology lies in the availability of sucessful underfill materials. However, the reliability of flip‐chip technology using current underfill materials is generally found to be lower than that of conventional wire‐bond connection packaging materials such as epoxy molding compound (EMC) because of the high coefficients of thermal expansion (CTE) and moisture absorption of cured underfill material. In this study desbimide (DBMI), which has a low melting point (about 80°C), was used in the underfill materials as a cohardener. As a result, DBMI‐added underfill can show excellent thermal reliability, which is due to the superior properties of the CTE, the elastic modulus, and water resistance. When the properties of a 2 wt % DBMI‐added underfill were compared with those of a typical underfill (epoxy/anhydride), the CTE value was reduced to less than one‐half at the solder reflow temperature (about 200°C), the elastic modulus was reduced to less than one‐half in the temperature region below the glass‐transition temperature, and the water resistance was improved twofold. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 2617–2624, 2002     

晋中民俗文化对当地食品包装设计的影响

承载着千年文化的山西晋中,有着独特的地域民俗文化,在当今如何把当地传统民俗文化内涵运用在食品包装设计当中成为一种趋势,越来越多的设计师和消费者深刻的认识到本土民俗文化元素对食品包装设计内涵的重要性,因此在现代食品包装设计中合理的融入民俗文化元素,从而使食品包装设计显示出独特、深厚并富有魅力的乡土风情和地域性文化内涵。     

交互式教学实践在设计教学中的应用研究

交互式实践教学模式是指在设计教学过程中,不仅考虑教学媒介与学习者之间的双向信息流动,也考虑设计教学中内容与实践的结合以及学生在课堂上的有效思考和设计实践能力。文章以包装设计课程为例,探讨交互式教学实践模式设计艺术课程教学改革的可能性。     

浅论陶瓷包装的促销作用

简单的阐述了包装的含义、历史上的陶瓷包装;并从包装装潢的促销作用、引导消费过程入手,具体叙述了陶瓷包装在陶瓷销售中的促销作用。最后简述了我国与世界包装的差距,总结陶瓷包装的发展。     

油气集输过程中的防静电措施

油气集输泵站是收集、储存和外输油品的重要场所,是协调原油收集、处理和外输的纽带。油气集输中的各个环节都会产生静电,而由静电积累引起的放电是造成爆炸和火灾等事故的主要原因。分析了在油气集输过程中产生静电的原因及造成的危害,提出了具体的防静电措施,对防止火灾爆炸事故的发生,保护国家及油区人民生命财产的安全具有十分重要的意义。     

典型添加元素对Sn-Zn系钎料性能的影响

Sn-Zn钎料被认为是传统Sn-Pb共晶钎料的最佳替代合金之一,它以低廉的成本、较好的力学性能以及其共晶成分与Sn-37Pb钎料熔点相近等优点引起了人们的广泛关注,但其润湿性、抗氧化性、抗腐蚀性不够理想.阐述了Bi、A1、In、Ag、Cu及稀土元素(RE)等典型添加元素对Sn-Zn钎料各种性能的影响,以期为Sn-Zn钎...     

原花青素/醋酸纤维素可降解包装薄膜的结构与抗氧化性能

将原花青素(PC)添加到醋酸纤维素(CA)制膜溶液中,制得具有抗氧化性的可降解包装薄膜。通过红外光谱、X射线衍射和原子力显微镜对薄膜表面形貌、膜结构和结晶情况进行表征。以新鲜猪油为内装物、采用油脂氧化稳定性的检测方法Schaal烤箱法,测试薄膜在不同PC添加量时的抗氧化性。结果表明:当添加质量分数为2%PC时,薄膜的抗氧化性最佳,其对油脂的抑制率达到了37.65%,可在常温下延长油脂保质期两个多月。