Recent advances in isotropic conductive adhesives for electronics packaging applications

Isotropic conductive adhesives (ICAs) have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-bearing solders. Numerous studies have shown that ICAs possess many advantages over conventional soldering such as environmental friendliness, finer pitch printing, lower temperature processing and more flexible and simpler processing. However, complete replacement of soldering by ICAs is yet not possible owing to several limitations of ICAs which are mainly related to reliability aspects like limited impact resistance, unstable contact resistance, low adhesion and conductivity etc. Continued efforts for last 15 years have resulted in development of ICAs with improved properties. This review article is aimed at providing a better understanding of ICAs, their principles, performance and significant research and development work addressing the technological utility of ICAs.     

Synthesis and characterization of zeolite NaY from rice husk silica

Rice husk silica (RHS) in amorphous phase with 98% purity was prepared from a waste rice husk from rice milling by leaching with hydrochloric acid and calcination. The RHS was used effectively as a silica source for the synthesis of zeolite Y in sodium form (NaY). The zeolite in pure phase was obtained from a two-step synthetic route in which the starting gels were mixed, aged for 24 h at room temperature and crystallized for 24 h at 90 °C. The diameter of single crystal particles from a scanning electron microscope was approximately 1.0 μm, whereas the average particle diameter from laser diffraction particle size analyzer was approximately 10 μm because of the agglomeration of small crystals. Longer crystallization time in this route resulted in a mixed phase containing NaY and zeolite P in sodium form (NaP). In addition, a one-step synthetic route (no aging) was studied and the product was also a mixed phase zeolite.     

Mesh结构P/G布线网络层次化快速分析方法

本文提出了一个基于网络划分的P／G布线网络层次化快速分析方法。其中，对于子网运算，通过对Cholesky分解法三角化对称正定阵的图模型分析，并基于Mesh结构网络的自身特点，提出了一个基于图顶点排序的加速子网分析运算策略；并用基于MPI的并行结构实现了P／G布线网络分析的并行运算。     

内容寻址网络中内容的有效定位

P2P(Peer—to—Peer)的最基本的问题是如何高效地查找到存放文件的节点。本文提出在保持内容寻址网络(Content Addressable Network：CAN)现有特性的基础上建立一种更快捷有效的内容定位结构：基于快捷链接和最小距离的内容定位。本文首先介绍了内容寻址网络的基本工作原理，然后详细描述了基于快捷链接和最小距离进行内容定位的方法，并通过仿真证实了该方法很大程度上改善了CAN的性能。     

Mesh-Tree两级层次结构P/G网布线优化方法

本文采用Mesh-Tree两级层次结构作为P／G网布线拓扑结构，并提出了一个对于该结构的线宽优化方法，使超大型P／G网的布线优化速度大大提高。     

BPxN1-x薄膜的制备及磷元素对其光学能隙的影响

本文从应用出发，选择光学石英为衬底，采用热丝辅助射频化学气相沉积的方法沉积BPxN1—x薄膜，对样品进行了X射线衍射(XRD)、扫描电子显微镜(SEM)、紫外—可见等测试。XRD、SEM结果显示薄膜多晶态，表面形貌随时间变化，最终为胞状；紫外—可见光光谱结果显示BPxN1—x薄膜的紫外吸收边随沉积时间的加长、PH3流量的增加而向长波长方向移动。因此，该材料的光学能隙可以通过生长工艺适当调整。另外，BPxN1—x薄膜与液晶层能较好匹配等特性更使其适用于紫外空间光调制器。     

混酸PEG酯的合成及性能研究

用从大豆油脚水解制得的脂肪酸合成混酸聚乙二醇酯，通过测定酸值的方法确定了最佳反应时间为16h。与油酸聚乙二醇酯相比，混酸聚乙二醇酯具有更优良的乳化性、润湿性，可以替代油酸聚乙二醇酯用于纺织、农药和化妆品工业中。     

粉末材料中微夹杂缺陷的超声波检验

介绍了用超声波方法检测微夹杂缺陷的一些试验结果，比较了不同频率、不同试验方法检测能力的差异，并通过解剖试验对检出缺陷的性质、尺寸作了比较。     

压电复合材料PT－P（VDF／TeFE）的静水压压电性

用热轧辊机制备了压电复合材料ＰＴ－Ｐ（ＶＤＦ／ＴｅＦＥ），并利用ＬＣＲ电桥和Ｂｅｒｌｉｎｃｏｕｒｔ电路分别测量了其介电常数和压电常数，实验结果表明它具有良好的静水压压电特性。最后讨论了该复合材料在水听器中的应用     

丙烯酸酯单体对聚氯乙烯密封胶粘剂的改性作用

丙烯酸酯有较大的反应活性，能与聚氯乙烯发生接技共聚反应。本文中，我们着重研究不同结构丙烯酸酯单体对聚乙烯基密封胶粘剂的改性作用。以PVC为100份，分别加入甲基丙烯酸一缩二乙二醇双脂（DEGDMA），甲基丙烯酸乙二醇双酯（EGDMA）和丙烯酸一缩二乙二醇双酯（DEGDA）各为10份、20份、30份的试验结果看出，随着丙烯酸酯单体添加量的增加，PVC片基的硬度增大，拉伸强度提高，而伸长率降低。不同的单体其影响也不同。就硬度和拉伸强度有EGDMA＞DEGDA＞DEGDMA的规律伸长率的降低则为DEGDMA＞DEGDA＞EGDMA。就丙烯酸…