钨铜复合材料的现状与发展

高导电导热性铜与高温强度、强抗电弧烧蚀钨的良好结合使钨铜复合材料具有一系列优异性能,广泛应用于电接触材料、电子封装和热沉材料。简要介绍了当前钨铜复合材料的应用、制备技术和致密化方法,阐述了钨铜复合材料的研究进展,指出了今后的应用发展前景。     

Manufacture of high-dispersed W-Cu composite powder by mechano-thermal process

In order to improve the process of co-reduction of oxide powder, a new mechano-thermal process was designed to produce high-dispersed W-Cu composite powder by high temperature oxidation, short time high-energy milling and reduction at lower temperature. The particle size, oxygen content and their sintering abilities of W-Cu composite powder in different conditions were analyzed. The results show that after a quick milling of the oxide powder for about 3-10 h, the reduction temperature of the W-Cu oxide powder can be lowered to about 650 ℃ from 700-750 ℃ owning to the lowering of particle size of the oxide powder. The average particle size of W-Cu powder after reduction at 650 ℃ is about 0. 5μm smaller than that reduced at 750 ℃. After sintering at 1 200℃ for 1 h in hydrogen atmosphere, the relative density and thermal conductivity of final products (W-20Cu) can attain 99. 5% and 210 W ·m-1· K-1 respectively.     

纳米晶W-25Cu复合粉末烧结行为的研究

研究了机械合金化工艺制备纳米晶W-25Cu复合粉末的烧结致密化和晶粒长大行为,并考察了一种新型晶粒长大抑制剂对抑制W晶粒长大的作用,探讨了其作用机理。结果表明,烧结致密化和晶粒长大强烈依赖于烧结温度和时间。经1200℃烧结30min后,烧结相对密度和W晶粒尺寸为97.7%和310nm。新型晶粒长大抑制剂抑制W晶粒长大效果明显。     

钨铜材料应用和生产的发展现状

介绍了钨铜材料目前主要的应用领域、使用特点及其在钨铜材料中所占的份额。叙述为满足钨铜材料新的应用在制取工艺上的研究发展情况。     

铜包覆纳米钨粉及轧制薄带的烧结与组织特征

本文研究了纳米级W-40%Cu包覆粉的制备方法,使用软模压制成形法和粉末轧制法制备两种试样并进行了烧结收缩动力学的研究。结果表明,纳米级W-40%Cu包覆粉压坯在980℃达到最大收缩速率。在1 200℃烧结后,合金相对密度达到98%,平均晶粒尺寸为2μm。纳米级W-40%Cu粉末轧制薄带在1 200℃下烧结成为W-40%Cu合金薄带,合金薄带的相对密度达到99%。SEM和定量金相对烧结合金薄带进行组织结构分析结果表明,薄带合金中的平均W晶粒度仅为1.5μm,W晶粒的形状呈椭球体状。     

电子封装用粉末冶金材料

本文阐述了电子封装材料的基本要求与状况，对传统封装材料Al2O3、BeO、SiC的制备工艺、性能指标进行了介绍，着重分析了新型电子封装材料A1N、W／Cu、Mo／Cu、SiC／Al的性能特点和粉末冶金制备工艺的最新研究进展。     

W-Cu触头材料的电寿命研究

研究了W-Cu系列触头材料的电弧烧损规律。触头材料的电弧烧损随开断次数的变化分为老炼、稳定和失效三个阶段，其中稳定阶段的长短是影响电寿命的决定性因素。还发现蚀头材料的电弧烧损主要是触点在断开和闭合的过程中，产生电弧或其它放电现象的热效应所造成的。材料的比热容、密度、熔点和电导率决定触头的电寿命。     

Kinetic characteristics of liquid phase sintering of mechanically activated W-15wt% Cu powder

The kinetic characteristics of W grain growth operated by diffusion controlled Oswald ripening （DOR） during liquid phase sintering were studied. A liquid phase sintering of W-15wt%Cu was carried out by pushing compacts into a furnace at the moment when the temperature increased to 1340℃ for different sintering times. The results show that liquid phase sintering produces the compacts with considerably low relative density and inversely, rather high homogeneity. On the basis of the data extracted from the SEM images, the kinetic equation of W grain growth, G^n = G0^n ＋ kt, is determined in which the grain growth exponent n is 3 and the grain growth rate constant k is 0.15 μm^3/s. The cumulative normalized grain size distributions produced by different sintering times show self-similar. The cumulative distribution function is extracted from the curves by non-linear fitting. In addition, the sintering kinetic characteristics of W-15wt%Cu compacts were also investigated.     

钨铜复合材料的应用与研究现状

在简述钨铜复合材料具有良好导热、导电性和高温抗氧化性等优良性能及其在电子封装、集成电路、国防军工、航空航天等高尖端技术的应用拓展空间的基础上，介绍了国内外钨铜材料的主要应用领域和制备新工艺的研究发展现状。     

钨粉颗粒形貌对钨铜合金药型罩破甲性能的影响

为了研究钨粉形貌对钨铜合金药型罩破甲性能的影响,采用了4种不同颗粒形貌的钨粉,利用机械合金化法和冷等静压旋压工艺制备钨铜合金药型罩,并对钨铜合金药型罩射孔弹进行了地面静破甲穿钢靶试验,通过试验分析钨粉形貌对钨铜合金药型罩破甲性能的影响。结果表明:钨粉颗粒完整、形貌为多面体的钨粉,其松装密度达到9.564 g/cm³,制备的钨铜合金药型罩的破甲深度达到338.3 mm,破甲稳定性达到99.21%;而钨粉颗粒有缺陷、形貌为类球状的钨粉,其松装密度仅为7.142 g/cm3,制备的钨铜合金药型罩的破甲深度达到338.3 mm,破甲稳定性达到99.21%;而钨粉颗粒有缺陷、形貌为类球状的钨粉,其松装密度仅为7.142 g/cm³,制备的钨铜合金药型罩的破甲深度为288.1 mm,破甲稳定性为92.7%,分别下降了17.4%和7.6%。