内存芯片封装技术的发展

本文主介绍了国际上内存芯片封装技术的现状以及未来的发展等。     

Structured development of a virtual shared memory system

In this paper we formalise three different views of a virtual shared memory system and show that they are equivalent. The formalisation starts with five basic component processes specified in the language of CSP [Hoa85], which can be adapted as necessary by two operations called labelling and clamping, and are combined in two basic ways: either they are chained, so that the output of one component becomes the input of the next, or they are put in parallel, so that their communications are arbitrarily interleaved. Using the laws of CSP we show that these basic processes and operators satisfy a number of algebraic equivalences, which enable us to prove equivalence of the different models of the memory system by reasoning entirely at the level of processes, instead of at the lower and more complicated level of events. As a result the proofs of equivalence of the different models are purely algebraic and very simple.The specification is intended to provide a general framework for any architecture using an interconnection network, such as the on-chip interconnect between macrocells or the networks of processor nodes connected by bit-serial interconnect which are described in [Jon93]. It addresses architecture independent design issues such as access transparency, connectivity, addressing models and serialisability. By structuring it as a hierarchy of models it is hoped that the treatment of these many issues is made as clear and tractable as possible, whilst the proofs of equivalence ensure consistency.Funded by Esprit Project 7267/ OMI-Standards.     

使用“通信顺序进程”机制的神经网络仿真

本文引入了“通信顺序进程”的概念，同时介绍了一种实现环境－ＲＩＳＣ结构的Ｔｒａｎｐｕｔｅｒ处理器及Ｏｃｃａｍ并行化编程语言，并阐述了用“通信顺序进程”机制来仿真人工神经网络的方法。     

Refinement-oriented probability for CSP

Jones and Plotkin give a general construction for forming a probabilistic powerdomain over any directed-complete partial order [Jon90, JoP89]. We apply their technique to the failures/divergences semantic model for Communicating Sequential Processes [Hoa85].The resulting probabilistic model supports a new binary operator, probabilistic choice, and retains all operators of CSP including its two existing forms of choice. An advantage of using the general construction is that it is easy to see which CSP identities remain true in the probabilistic model. A surprising consequence however is that probabilistic choice distributes through all other operators; such algebraic mobility means that the syntactic position of the choice operator gives little information about when the choice actually must occur. That in turn leads to some interesting interaction between probability and nondeterminism.A simple communications protocol is used to illustrate the probabilistic algebra, and several suggestions are made for accommodating and controlling nondeterminism when probability is present.All authors are members of the Programming Research Group; McIver and Seidel are supported by the EPSRC.0     

0.5 mm间距CSP焊接工艺研究

随着对各种电子产品，尤其是消费类电子产品的便携性和多功能的追求，CSP等新型封装器件(封装尺寸约为芯片本身尺寸的1．2倍)便应用到这些产品的设计中去。CSP器件的引脚间距有0．8mm、0．75mm、0．65mm、0．5mm等。为了便于以后产品设计和生产的需要，就CSP器件在PWB设计和焊接两方面进行研究，侧重于焊接方面。     

CSP连铸结晶器的技术特点

介绍了CSP连铸结晶器的形状、设计特点和工艺特性,分析了CSP连铸结晶器的优点与不足。     

邯钢薄板坯连铸连轧工艺优化及创新

详细介绍了邯钢在引进建设薄板坯连铸连轧生产线过程中，实施的工艺优化和创新，以及取得的效果。     

CSP工艺热轧低碳钢板的强化机制

采用金相显微镜、H—800透射电镜和正电子湮没方法分析了CSP热轧低碳钢板金相组织、析出物形貌、尺寸、分布及位错密度。结果表明:CSP工艺热轧低碳钢板的晶粒较为细小,约为5.3μm;当累积变形量较小、变形温度较高时,析出物主要在晶界上,数量少见比较粗大,其尺寸大多大于150nm;当累积变形量较大、变形温度较低时,析出物主要在晶内,细小、弥散且数量较多,其尺寸大多为20～100nm,析出物主要为Al_2O_3、MnS或Cu_7S_4;随着累积变形量的增加,位错密度明显增加,终轧后轧件的位错密度约为6.35×10~(14)m~(-2)。晶粒细化、析出物弥散分布及位错密度增加是CSP工艺热轧低碳钢板强度高的决定因素。     

高密度组装电气互联新技术原理与研究方法

网络通信技术的高速发展围绕着小、轻、高速和高密度几个方向给IT市场提出了多样化的需求。介绍了高密度组装发展的现状和未来的发展趋势。CSP的研制使组装密度和性能得到提高，达到二维组装密度的极限；三维多芯片组装使组装密度达到一个新的高度，高速性能大大提高，同时力求降低制造成本。21世纪互联技术将继续沿着高密度和高速性方向发展。     

从2006年微合金钢应用国际研讨会看国际高钢级管线钢的发展动向(一)

简要报导了"微合金钢在油气工业中的应用国际研讨会"会议概况.纵观大会学术交流的内容,介绍了国际上高钢级管线钢制造工艺的新进展、中小口径X70/X80级ERW钢管的开发、X80钢在陆上长输管道上的应用、海底管道的发展趋势以及X100/X120钢级的开发等方面的最新动向.对进一步推动我国油气管道建设用高钢级管线钢及钢管应用基础研究、生产和使用技术的提高具有很好的借鉴作用.