全文获取类型
收费全文 | 984篇 |
免费 | 83篇 |
国内免费 | 39篇 |
专业分类
电工技术 | 209篇 |
综合类 | 34篇 |
化学工业 | 143篇 |
金属工艺 | 22篇 |
机械仪表 | 8篇 |
建筑科学 | 3篇 |
矿业工程 | 4篇 |
能源动力 | 52篇 |
轻工业 | 1篇 |
水利工程 | 1篇 |
武器工业 | 2篇 |
无线电 | 450篇 |
一般工业技术 | 148篇 |
冶金工业 | 5篇 |
原子能技术 | 3篇 |
自动化技术 | 21篇 |
出版年
2024年 | 1篇 |
2023年 | 37篇 |
2022年 | 16篇 |
2021年 | 26篇 |
2020年 | 38篇 |
2019年 | 34篇 |
2018年 | 25篇 |
2017年 | 30篇 |
2016年 | 18篇 |
2015年 | 33篇 |
2014年 | 44篇 |
2013年 | 44篇 |
2012年 | 43篇 |
2011年 | 65篇 |
2010年 | 46篇 |
2009年 | 52篇 |
2008年 | 41篇 |
2007年 | 66篇 |
2006年 | 41篇 |
2005年 | 46篇 |
2004年 | 31篇 |
2003年 | 42篇 |
2002年 | 43篇 |
2001年 | 36篇 |
2000年 | 34篇 |
1999年 | 34篇 |
1998年 | 31篇 |
1997年 | 14篇 |
1996年 | 44篇 |
1995年 | 3篇 |
1994年 | 3篇 |
1993年 | 9篇 |
1992年 | 5篇 |
1991年 | 5篇 |
1990年 | 7篇 |
1989年 | 12篇 |
1987年 | 4篇 |
1985年 | 1篇 |
1982年 | 1篇 |
1980年 | 1篇 |
排序方式: 共有1106条查询结果,搜索用时 0 毫秒
51.
Abstract The plasma etch process requirements are different for etching 2μm ferroelectric capacitor structures in FeRAM's (SRAM) vs. the smaller capacitor sizes (0.2–0.5 μm) of DRAM's. Plasma etch integration of ferroelectric capacitors presents three major differences between FeRAM's and DRAM's. The first difference is in the ferroelectric capacitor structure. FeRAM's use planar capacitors with top side metal contacts to vias while DRAM's use vertical capacitor structures with bottom side contact to a poly post structure. The second major difference is in material selected and thickness of layers. FeRAM's use thicker electrodes of Pt or Ir and a thicker PZT or Y1 dielectric layer. FeRAM's use a thick bottom electrode (and a thin top electrode) consisting of Pt, Ru or Ir and a thin BST dielectric layer. The third major difference is the plasma etch process requirements for the two devices. FeRAM's require a clean etch process and no corrosion. Profile is not critical but should be maintained at greater than 60° for 2μm bottom post electrode. An HRe? (Highly Density Reflected Electron) etch system is used to develop process trends for ferroelectric capacitor applications. 相似文献
52.
文章简要介绍了美国CDE公司表面安装电容的分类和特点,并详细讨论了ESRD和ESRE系列电容的结构和机理,最后向读者推荐了不同应用时表贴电容的选型参考。 相似文献
53.
唐耀胜 《电力电容器与无功补偿》2002,(4)
从我国电力系统实际情况出发 ,结合避雷器选型的历史回顾和新版本的避雷器国家标准 ,提出了使电力系统安全、可靠运行的并联电容器装置用氧化锌避雷器的选型方法 ,对变电站中并联电容器装置的设计具有一定的参考价值 相似文献
54.
本文介绍了本课题组研制、开发成功的GFD-360型涂层钢板,专用点焊机的机械部分、主回路电气、微机控制等原理及其焊接工艺规范。 相似文献
55.
阳极铝箔交流腐蚀发孔对比容的影响 总被引:2,自引:0,他引:2
采用50Hz交流电腐蚀发孔和进一步腐蚀阳极铝箔,在腐蚀箔表面形成透明钝化型腐蚀膜且蚀孔孔径较大。在交流电腐蚀过程中不产生发黑、掉粉和减薄现象。另外,该工艺对盐酸浓度和硫酸添加剂浓度的适应范围很宽。 相似文献
56.
Development of Ferroelectric Ceramics with High Dielectric Constant and Low Dissipation Factor for High-Voltage Capacitors 总被引:3,自引:0,他引:3
Both ferroelectric BaTiO3-based and SrTiO3-based dielectric ceramics with high dielectric constant and low dissipation factor have been successfully developed, and applied into mass production for high-voltage ceramic capacitors. Crystalline phases of the ceramics were identified by XRD. STEM study of the ceramics was also conducted. Based on the computer simulation of a shell-core and two-phase mixed structural model proposed, a novel processing method was employed to produce SrTiO3-based ceramics with the following satisfactory dielectric properties: dielectric constant at room temperature 20C=2000, dissipation factor at room temperature D
20C=0.003, temperature coefficient of dielectric constant = –8% (–25°C to 85°C), and, breakdown electric field E
b=10kV/mm(dc). Optional composition of BaTiO3-based ceramics has been obtained through the orthogonal design experimentation: BaTiO3-xBaZrO3-yBaSnO3, where x = 8wt% and y = 6wt%, with minor additions of MnSiO3, WO3, CeO2, Bi2(SnO3)3 and ZnO. Its major properties are as follows: Curie temperature T
c = 21°C, 20C=18,000, D
20'C = 0.008, =–80% (–25°C+85°C) and E
b = 8kV/mm (dc). 相似文献
57.
Emmanuel Defaÿ David Wolozan Jean-Pierre Blanc Emmanuelle Serret Pierre Garrec Sophie Verrun Denis Pellissier Philippe Delpech Julie Guillan Bernard Andr Laurent Ulmer Marc Aïd Pascal Ancey 《Solid-state electronics》2007,51(11-12):1624
This paper describes realization and characterization of SrTiO3 (STO) high K MIM capacitors above BiCMOS integrated circuit (IC). These capacitances are connected to IC and are used as coupling capacitors in order to realize a high pass filter. Surface capacitance achieved is 10 nF/mm2 with capacitance value of 1.2 nF. The process for STO MIM fabrication does not exceed 400 °C, which is compatible with interconnections. Typical K and dielectric losses values obtained are, respectively 110% and 2%. Yield obtained reaches 83% for capacitors. A functional high pass filter using these STO capacitors was realized in this study. It exhibits a cut-off frequency at 6.5 kHz and a constant gain at higher frequencies of −1.3 dB. 相似文献
58.
对风电场并联电容器的投入过程进行了仿真研究。着重研究了投入电容器时的高频涌流及过渡电压降低的现象并提出了有效的改善措施。 相似文献
59.
This paper reports a ferroresonant experience involving inductive voltage transformers (VT's) in a 400 kV substation equipped with circuit breaker grading capacitors. Field measurements are presented and compared with ATP/EMTP simulation results, showing very good agreement. A parametric analysis has been performed to investigate the effect of the substation capacitance on the occurrence of ferroresonance. Fundamental frequency and sub-harmonic ferroresonant modes have been identified and compiled in a bifurcation diagram. The methodology presented can be used to create risk maps of avoidable switching operations or substation configurations. 相似文献
60.
Yuehua Wen Jie Cheng Gaoping Cao Yusheng Yang 《Journal of Applied Electrochemistry》2007,37(5):543-548
For double-layer capacitors in alkaline electrolyte, the specific capacitance of the positive electrode is not equal to that
of the negative one. Thus, capacitor performance cannot be optimal with a positive/negative electrode matching ratio of 1.
In this study nanoporous glassy carbons (NPGCs) were employed as the electrodes of capacitors, and the influence of matching
ratio between positive and negative electrode on capacitor performance was systematically investigated. In aqueous KOH, the
specific capacitance of the positive electrode is lower than that of the negative electrode. The matching ratio at which a
maximum capacitance is obtained is dependent on the values of the positive and negative electrode capacitance. At low current
rate, the highest specific capacitance is achieved at a matching ratio slightly higher than 1. At high current rate, a capacitor
has the highest specific capacitance with the lowest resistance at a matching ratio of 1.5. This indicates that an optimum
matching relationship between positive and negative electrodes is attained. 相似文献