Environmentally Friendly Graphene Inks for Touch Screen Sensors

Graphene-based materials have attracted significant attention in many technological fields, but scaling up graphene-based technologies still faces substantial challenges. High-throughput top-down methods generally require hazardous, toxic, and high-boiling-point solvents. Here, an efficient and inexpensive strategy is proposed to produce graphene dispersions by liquid-phase exfoliation (LPE) through a combination of shear-mixing (SM) and tip sonication (TS) techniques, yielding highly concentrated graphene inks compatible with spray coating. The quality of graphene flakes (e.g., lateral size and thickness) and their concentration in the dispersions are compared using different spectroscopic and microscopy techniques. Several approaches (individual SM and TS, and their combination) are tested in three solvents (N-methyl-2-pyrrolidone, dimethylformamide, and cyrene). Interestingly, the combination of SM and TS in cyrene yields high-quality graphene dispersions, overcoming the environmental issues linked to the other two solvents. Starting from the cyrene dispersion, a graphene-based ink is prepared to spray-coat flexible electrodes and assemble a touch screen prototype. The electrodes feature a low sheet resistance (290 Ω □⁻¹) and high optical transmittance (78%), which provide the prototype with a high signal-to-noise ratio (14 dB) and multi-touch functionality (up to four simultaneous touches). These results illustrate a potential pathway toward the integration of LPE-graphene in commercial flexible electronics.     

The role of smart packaging system in food supply chain

Food supply chain is a rapidly growing integrated sector and covers all the aspects from farm to fork, including manufacturing, packaging, distribution, storing, as well as further processing or cooking for consumption. Along this chain, smart packaging could impact the quality, safety, and sustainability of food. Packaging systems have evolved to be smarter with integration of emerging electronics and wireless communication and cloud data solutions. Although there are many factors causing the loss and waste issues for foods throughout the whole supply chain of food and there have been several articles showing the recent advances and breakthroughs in developing smart packaging systems, this review integrates these conceptual frameworks and technological applications and focuses on how innovative smart packaging solutions are beneficial to the overall quality and safety of food supply by enhancing product traceability and reducing the amount of food loss and waste. We start by introducing the concept of the management for the integrated food supply chain, which is critical in tactical and operational components that can enhance product traceability within the entire chain. Then we highlight the impact of smart packaging in reducing food loss and waste. We summarize the basic information of the common printing techniques for smart packaging system (sensor and indicator). Then, we discuss the potential challenges in the manufacturing and deployment of smart packaging systems, as well as their cost-related drawbacks and further steps in food supply chain.     

Automatic Transformation of Membrane‐Type Electronic Devices into Complex 3D Structures via Extrusion Shear Printing and Thermal Relaxation of Acrylonitrile–Butadiene–Styrene Frameworks

This work demonstrates a means of automatic transformation from planar electronic devices to desirable 3D forms. The method uses a spatially designed thermoplastic framework created via extrusion shear printing of acrylonitrile–butadiene–styrene (ABS) on a stress‐free ABS film, which can be laminated to a membrane‐type electronic device layer. Thermal annealing above the glass transition temperature allows stress relaxation in the printed polymer chains, resulting in an overall shape transformation of the framework. In addition, the significant reduction in the Young's modulus and the ability of the polymer chains to reflow in the rubbery state release the stress concentration in the electronic device layer, which can be positioned outside the neutral mechanical plane. Electrical analyses and mechanical simulations of a membrane‐type Au electrode and indium gallium zinc oxide transistor arrays before and after transformation confirm the versatility of this method for developing 3D electronic devices based on planar forms.     

Nanocellulose-based films and their emerging applications

Extensive research has been directed towards the reinvention of paper for advanced applications. Nanocellulose-based films, a novel class of specialty paper primarily made of nanocellulose, demonstrate an ideal combination of sustainability and enhanced or novel properties. Enormous efforts have been devoted to enhancing these intrinsic properties and/or creating novel functions to expedite and expand the use of these materials in high-end fields such as touchscreen, solar cells, and nanogenerators. We review state-of-the-art advances in nanocellulose-based films and their utilization in several emerging and promising fields. We begin with an introduction of four types of nanocellulose-based films distinguished by their functional material loads (e.g., synthetic macromolecular polymers, 0D, 1D, and 2D nanomaterials), which involves their manufacturing techniques, structure design, properties, novel functions, and underlying principles. Additionally, we summarize the value-added applications of nanocellulose-based films in flexible electronics, energy converting or harvesting devices, and water treatment. Finally, we provide a critical viewpoint on the remaining challenges and future opportunities in this field.     

Ultra-Robust Flexible Electronics by Laser-Driven Polymer-Nanomaterials Integration

Polyethylene terephthalate (PET) is the most widely used polymer in the world. For the first time, the laser-driven integration of aluminum nanoparticles (Al NPs) into PET to realize a laser-induced graphene/Al NPs/polymer composite, which demonstrates excellent toughness and high electrical conductivity with the formation of aluminum carbide into the polymer is shown. The conductive structures show an impressive mechanical resistance against >10000 bending cycles, projectile impact, hammering, abrasion, and structural and chemical stability when in contact with different solvents (ethanol, water, and aqueous electrolytes). Devices including thermal heaters, carbon electrodes for energy storage, electrochemical and bending sensors show this technology's practical application for ultra-robust polymer electronics. This laser-based technology can be extended to integrating other nanomaterials and create hybrid graphene-based structures with excellent properties in a wide range of flexible electronics’ applications.     

Role of interface on irradiation damage of Cu−diamond composites using classical molecular dynamics simulations

Cu?diamond composites have been proposed as a candidate thermal management material for spacecraft electronics. Nevertheless, irradiation effects on the composites remain poorly understood at present. Here we focus on investigating the influence of Cu?diamond interfaces (CDIs) on energetic displacement cascades using atomistic simulations. Results show that a primary knock-on atom of Cu (PKA-Cu) can induce more significant damage than a PKA-C. Under almost all circumstances, the statistically averaged fraction of surviving interstitials is not only lower than that of vacancies but also no more than 1. Because of the unique nature in the mobility and interactions with CDIs, Cu interstitials exhibit the lowest concentration among all defects in most cases. The high residual rate of displaced defects in diamond makes it relatively difficult to heal. The structural damage is mainly manifested in a short-range disorder of diamond and a long-range disorder of Cu after irradiation. At elevated temperatures, the atomic displacement region may form compact chain-like defects to restrain lattice loosening. Despite the above, CDIs could act as effective sinks to facilitate the recombination and/or annihilation of irradiation-induced defects in all scenarios. This study provides an important insight into the understanding of the microscopic evolution of irradiation defects for the composites.