双亲纳米SiO2颗粒的制备及提高渗吸采收率性能

以正辛基三乙氧基硅烷和3-巯基丙基三乙氧基硅烷为改性剂，以双氧水为氧化剂，在水基环境下对亲水纳米SiO2颗粒表面进行改性，得到具有磺酸基和辛基的双亲纳米SiO2颗粒，并通过红外和热重对其化学结构和热稳定性进行分析。将双亲纳米SiO2颗粒分散在地层水中制备纳米流体，并评价纳米流体的稳定性、界面性质和渗吸效率。利用核磁共振技术探究纳米流体渗吸过程中岩心孔隙内原油运移规律。结果表明，纳米流体储存30 d未出现分层现象，表现出良好的稳定性；经纳米流体处理的岩心亲水性增强。此外，双亲纳米SiO2颗粒将油水界面张力降低至1.7 mN/m；纳米流体渗吸采收率高达22.6%，渗吸初始阶段小孔隙中的原油被动用，而在渗吸后期阶段大孔隙中的原油才被动用。     

Effect of the particle size ratio on macro- and mesoscopic shear characteristics of the geogrid-reinforced rubber and sand mixture interface

As a new type of material for civil engineering projects, the rubber and sand mixture is widely used in roadbed fillers, offering environmental benefits over traditional tyre disposal methods. This study uses a large-scale direct shear apparatus to examine the interface shear properties of the geogrid-reinforced rubber and sand mixture, considering different particle size ratios (r), rubber contents, and normal stresses. Based on indoor tests, direct shear models of the mixture with different values of r are established in PFC^3D, revealing the meso-mechanical mechanism of the mixture in the direct shear process. The results show that when r is greater than 1, incorporating a certain amount of rubber particles can increase the shear strength of the mixture. The r values of 15.78, 7.63, and 3.98 correspond to an optimal rubber content of 30%, 10%, and 20%, respectively. When r is less than 1, mixing rubber particles can only reduce the shear strength of the mixture. When the rubber content is low, the smaller the value of r, the greater is the thickness of the shear band. Furthermore, the normal and tangential contact forces are greater. The fabric anisotropy evolution law of the mixture is consistent with the change in the contact force distribution.     

异种铁素体耐热钢接头界面组织及其影响

综述了铁素体与铁素体异种金属焊缝（dissimilar metal welds，DMWs）接头界面组织及其影响。结果表明，在焊后热处理或运行温度下的铁素体钢DMWs接头的不均匀界面组织中，通常会形成脱碳层和增碳层。在铁素体钢DMWs焊接接头界面组织影响因素中，焊缝金属的化学成分有重要影响；焊后热处理规范（温度和时间）、工作温度下运行时间的影响较为突出；焊接工艺参数的影响亦不可忽略。异种钢接头界面处近缝区裂纹的产生，以及接头的蠕变强度随Larson Miller 参数增大而下降等不利影响，均为异种钢界面碳迁移行为所导致。焊缝成分控制法是接头界面组织控制或改善的必要条件，而脱碳层部位转移法能有效防止裂纹发生，亦是接头安全运行的重要工艺措施之一。     

Multiple material domain‐based computational tools for ease assessment of modal parameter in photonic crystal fibers

We report here the development of two computational tools PCFPS (Photonic Crystal Fiber Parameter Study) and PCFPA (Photonic Crystal Fiber Parameter Analysis), equipped with graphical user interface (GUI) for modeling of photonic crystal fiber. The tools are based on different structural parameters, and they provide characteristic analysis of the modal parameters from the structural parameters. The main feature of PCFPS is that it enables the user to find out the values of each defining modal parameter that has an immense contribution towards the manufacture of photonic crystal fiber. Additionally, PCFPA allows the user to observe the variation in the modal parameters with respect to the changes in structural parameters (such as d, Λ, d/Λ, and λ/>Λ). Besides their ease of use, these two schemes have high computational precision and adaptability, giving a novel platform to optical engineers to modulate the microstructured fibers according to their requirement.     

Simulation of thermal barrier coating spallation induced by the initiation/growth/coalescence of internal crack and interfacial crack based on a real image model

In the furnace cycle test, the growth of oxide film leads to the propagation and coalescence of multiple cracks near the interface, which should be responsible for the spallation of thermal barrier coatings (TBCs). A TBC model with real interface morphology is created, and the near-interface large pore is retained. The purpose of this work is to clarify the mechanism of TBC spallation caused by successive initiation, propagation, and linkage of cracks near the interface during thermal cycle. The dynamic growth of thermally grown oxide (TGO) is carried out by applying a stress-free strain. The crack nucleation and arbitrary path propagation in YSZ and TGO are simulated by the extended finite element method (XFEM). The debonding along the YSZ/TGO/BC interface is evaluated using a surface-based cohesive behavior. The large-scale pore in YSZ near the interface can initiate a new crack. The ceramic crack can propagate to the YSZ/TGO interface, which will accelerate the interfacial damage and debonding. For the TGO/BC interface, the normal compressive stress and small shear stress at the valley hinder the further crack propagation. The growth of YSZ crack and the formation of through-TGO crack are the main causes of TBC delamination. The accelerated BC oxidation increases the lateral growth strain of TGO, which will promote crack propagation and coalescence. The optimization design proposed in this work can provide another option for developing TBC with high durability.     

镁合金网格壁板压弯成形数值模拟及实验研究

为探索镁合金整体壁板压弯成形的可行性,以及镁合金壁板压弯成形过程中金属的流动规律,对AZ31镁合金网格壁板压弯成形进行了数值模拟和实验研究。建立了有限元数值模拟的几何模型,采用有限元计算软件对AZ31镁合金网格壁板压弯成形过程进行了数值模拟研究,分析了镁合金网格壁板压弯成形中的温度场、应变场、应力场、破坏系数等的分布规律。确定了合适的AZ31镁合金壁板压弯成形工艺参数,并对镁合金网格壁板压弯成形进行了实验研究,获得了合格的镁合金网格壁板弯曲件,并分析了镁合金网格壁板成形件尺寸精度,模拟结果与实验结果相吻合,最大相对误差为16.7%。     

单片机与接口技术项目化教学改革的实践与探索

As a comprehensive electrical and electronic course, Single Chip Microcomputer and Interface Technology is usually com- bined with automation technology, applied electronic technology, communication technology, etc., so that students can master the professional theory and application practice of single chip microcomputer. In the course teaching, teachers mainly focus on the knowledge points of single chip microcomputer system design, application programming, installation and debugging, select suitable interface circuit, application program, and organize and design the integrated circuit system and logic function of single chip micro- computer, so as to help students complete the resource allocation and function realization of different single chip microcomputer project design.     

User idea implementation in open innovation communities: Evidence from a new product development crowdsourcing community

In collaborative crowdsourcing communities for open innovation, users generate and submit ideas as idea co‐creators. Firms then select and implement valuable ideas for new product development. Despite the popularity and success of these open innovation communities, relatively little is known about the factors that determine the implementation of the user‐generated ideas. Based on research on individual creativity, we propose a conceptual model integrating users' previous experience, idea presentation characteristics and feedback valence to explain the likelihood of idea implementation. We validate our research model with a panel data analysis of 43 550 ideas submitted by 16 360 users in the MIUI new product development community hosted by Xiaomi, a large electronics manufacturing company in China. We find an inverted U‐shaped relationship between users' past successful experience and idea implementation. Furthermore, the length of ideas is positively associated with the likelihood of idea implementation. There is also an inverted U‐shaped relationship between supporting evidence and idea implementation. Finally, we demonstrate the negative effect of positive feedback and the positive effect of negative feedback on idea implementation. These findings offer rich insights to understand the phenomenon of open innovation better. Theoretical and practical implications are discussed.