Phase constitution,microstructure and mechanical properties of a Ni-based superalloy specially designed for additive manufacturing

In this study, a kind of Ni-based superalloy specially designed for additive manufacturing (AM) was investigated. Thermo-Calc simulation and differential scanning calorimetry (DSC) analysis were used to determine phases and their transformation temperature. Experimental specimens were prepared by laser metal deposition (LMD) and traditional casting method. Microstructure, phase constitution and mechanical properties of the alloy were characterized by scanning electron microscopy (SEM), transmission scanning electron microscopy (TEM), X-ray diffraction (XRD) and tensile tests. The results show that this alloy contains two basic phases, γ/γ', in addition to these phases, at least two secondary phases may be present, such as MC carbides and Laves phases. Furthermore, the as-deposited alloy has finer dendrite, its mean primary dendrite arm space (PDAS) is about 30-45 μm, and the average size of γ' particles is 100-150 nm. However, the dendrite size of the as-cast alloy is much larger and its PDAS is 300-500 μm with secondary and even third dendrite arms. Correspondingly, the alloy displays different tensile behavior with different processing methods, and the as-deposited specimen shows better ultimate tensile stress (1,085.7±51.7 MPa), yield stress (697±19.5 MPa) and elongation (25.8%±2.2%) than that of the as-cast specimen. The differences in mechanical properties of the alloy are due to the different morphology and size of dendrites, γ', and Laves phase, and the segregation of elements, etc. Such important information would be helpful for alloy application as well as new alloy development.     

Novel core-shell-like Ni-supported hierarchical beta zeolite catalysts on bioethanol steam reforming

Hierarchical-Beta zeolites have been hydrothermally synthesized by adding a new gemini organic surfactant. The used gemini surfactant play the role of a “pore-forming agents” on the mesoscale, on the same time, providing alkaline environment for the system. With this hierarchical Beta zeolite as the core support, we successfully prepared a shell layer of Ni-containing (22 wt%) petal-like core-shell-like catalyst and applied it to bioethanol steam reforming. At the reaction temperature of 350 °C–550 °C, the conversion rate of ethanol and the selectivity of hydrogen were always above 85% and 70%. After reaction of 100 h on stream at 400 °C, there were not obvious inactivation could be observed on NiNPs/OH-MBeta catalyst.     

Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy

The eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging. In this study, low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy is reported. The 80Au/20Sn solder shows a quasi-static fracture characteristic at high strain rates, and then gradually transforms from a transgranular fracture (dominated by fatigue damage) to intergranular fracture (dominated by creep damage) at low strain rates with increasing temperature. Coffin-Manson and Morrow models are proposed to evaluate the low cycle fatigue behavior of the 80Au/20Sn solder. Besides, the 80Au/20Sn solder has enhanced fatigue resistance compared to the 63Sn/37Pb solder.     

镍基高温合金锥筒形件拉深旋压成形机理研究

针对镍基高温合金因加工硬化严重成形时极易产生破裂和起皱等典型缺陷的问题,以锥筒形壳体类零件为对象,提出了一种由锥形预制坯经过真空固溶处理后拉深旋压成形锥筒形件的方法,并对其成形机理进行了研究。基于Abaqus/Explicit平台,建立了锥筒形件拉深旋压有限元模型,分析了成形过程中的瞬态等效应力、等效塑性应变、切向应力、壁厚及三向应变分布规律。结果表明:在旋压成形过程中,最大瞬态等效应力位于旋轮接触区及附近区域、最大瞬态等效塑性应变位于坯料口部;瞬态切向压应力最大值位于旋轮接触区,而瞬态切向拉应力最大值位于旋轮接触区附近的两侧区域。筒形段中部壁厚减薄,而坯料口部壁厚增厚。旋压成形试验表明,锥形预制坯经拉深旋压后可获得壁厚均匀的锥筒形件。     

Effect of Supports and Promoters on the Performance of Ni-Based Catalysts in Ethanol Steam Reforming

Ethanol steam reforming (ESR) is one of the potential processes to convert ethanol into valuable products. Hydrogen produced from ESR is considered as green energy for the future and can be an excellent alternative to fossil fuels with the aim of mitigating the greenhouse gas effect. The ESR process has been well studied, using transition metals as catalysts coupled with both acidic and basic oxides as supports. Among various reported transition metals, Ni is an inexpensive material with activity comparable to that of noble metals, showing promising ethanol conversion and hydrogen yields. Additionally, different promoters and supports were utilized to enhance the hydrogen yield and the catalyst stability. This review summarizes and discusses the influences of the supports and promoters of Ni-based catalysts on the ESR process.     

Interfacial reactions in In-Sn/Ni couples and phase equilibria of the In-Sn-Ni system

The In-Sn-Ni alloys of various compositions were prepared and annealed at 160°C and 240°C. No ternary compounds were found; however, most of the binary compounds had extensive ternary solubility. There was a continuous solid solution between the Ni₃Sn phase and Ni₃In phase. The Sn-In/Ni couples, made of Sn-In alloys with various compositions, were reacted at 160°C and 240°C and formed only one compound for all the Sn-In alloys/Ni couples reacted up to 8 h. At 240°C, Ni₂₈In₇₂ phase formed in the couples made with pure indium, In-10at.%Sn and In-11at.%Sn alloys, while Ni₃Sn₄ phase formed in the couples made of alloys with compositions varied from pure Sn to In-12at.%Sn. At 160°C, except in the In/Ni couple, Ni₃Sn₄ formed by interfacial reaction.     

Low-cycle fatigue properties of eutectic solders at high temperatures

This paper details the deformation mechanism and low‐cycle fatigue life of eutectic solder alloys at high temperature (around 0.8T_m). Grain boundary sliding generally nucleates a wedge‐type cavity that reduces the low‐cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn–Ag–Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb–Sn and Bi–Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low‐cycle fatigue endurance for theses eutectic Pb–Sn and Bi–Sn alloys.     

Effect of strain waveform on creep-fatigue life for Sn–8Zn–3Bi solder

This paper describes the creep‐fatigue life of Sn–8Zn–3Bi under push–pull loading. Creep‐fatigue tests were carried out using Sn–8Zn–3Bi specimens in fast–fast, fast–slow, slow–fast, slow–slow and hold–time strain waveforms. Creep‐fatigue lives in the slow–slow and hold‐time waveforms showed a small reduction from the fast–fast lives but those in the slow–fast and fast–slow waveforms showed a significant reduction from the fast–fast lives. Conventional creep‐fatigue life prediction methods were applied to the experimental data and the applicability of the methods was discussed. Creep‐fatigue characteristics of Sn–8Zn–3Bi were compared with those of Sn–3.5Ag and Sn–37Pb.     

印制板液态感光阻焊油墨的工艺控制

本文介绍印制板液态感光阻焊油墨的工艺流程、工艺控制，并对生产中较常出现的几种质量问题进行讨论，进而提出解决措施。     

Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

The reaction between the Sn-Ag-Cu solders and Ni at 250°C for 10 min and 25 h was studied. Nine different Sn-Ag-Cu solders, with the Ag concentration fixed at 3.9 wt.% and Cu concentrations varied between 0.0–3.0 wt.%, were used. When the reaction time was 10 min, the reactions strongly depended on the Cu concentration. At low-Cu concentrations (≦0.2 wt.%), only a continuous (Ni_1−xCu_x)₃Sn₄ layer formed at the interface. When the Cu concentration increased to 0.4 wt.%, a continuous (Ni_1−xCu_x)₃Sn₄ layer and a small amount of discontinuous (Cu_1−yNi_y)₆Sn₅ particles formed at the interface. When the Cu concentration increased to 0.5 wt.%, the amount of (Cu_1−yNi_y)₆Sn₅ increased and (Cu_1−yNi₆)₆Sn₅ became a continuous layer. Beneath this (Cu_1−yNi_y)₆Sn₅ layer was a very thin but continuous layer of (Ni_1−xCu_x)₃Sn₄. At higher Cu concentrations (0.6–3.0 wt.%), (Ni_1−xCu_x)₃Sn₄ disappeared, and only (Cu_1−yNi_y)₆Sn₅ was present. The reactions at 25 h also depended strongly on the Cu concentration, proving that the strong concentration dependence was not a transient phenomenon limited to a short reaction time. The findings of this study were rationalized using the Cu-Ni-Sn isotherm. This study shows that precise control over the Cu concentration in solders is needed to produce consistent results.