高密度超多芯连接器组装工艺研究

为了适应电子产品小型化和高密度集成要求,高密度超多芯连接器被广泛使用。由于其引线数量多、间距小、焊接间隙微小等原因,传统手工焊接方法很难满足其焊接质量要求。对高密度超多芯连接器组装方法进行了研究。通过焊接工艺优化,成功实现了焊接间隙0.08 mm的LRMS系列连接器可靠焊接,一次组装合格率达到98%以上。     

超声促进Ni/Sn固-液溶解行为

钎焊接头的可靠性主要由界面金属间化合物的形貌及接头微观组织决定,超声辅助钎焊过程中母材溶解行为直接影响接头可靠性。为进一步探明超声对Ni-Sn溶解行为的影响,本文采用浸入实验法对比研究了加载超声和无超声辅助下Ni在Sn中的溶解动力学,通过模拟探明了熔池中声压分布规律,观察了Ni-Sn界面微观组织。上述研究表明,超声作用10 s Ni丝的溶解量与不加超声保温5 min的溶解量相当,表明超声能促进Ni在熔融Sn钎料中的溶解。无超声辅助时,随着保温时间的增加,Ni-Sn界面金属间化合物逐渐增厚,阻碍了Ni与Sn 之间的相互扩散；而在超声空化作用下,Ni-Sn界面处于动态非平衡状态,能促进Ni在液态Sn中不断溶解；同时,在声流作用下界面Ni原子快速迁移至Sn中,在随后的冷却过程中析出大量细长棒状的Ni₃Sn₄金属间化合物。     

锡在Cu6Sn5金属间化合物表面的润湿行为

利用改良座滴法研究了高真空条件下熔融纯Sn在350 ~ 450 ℃下分别与Cu₆Sn₅和T2纯铜的润湿行为. 结果表明，表面镀金的金属间化合物基板在各试验温度下的润湿性均优于纯铜基板；金属基板表面氧化膜对润湿性的影响不容忽视；离子溅射后表面形成的金膜可以作为一种改善润湿性及控制界面IMC厚度的有效方法；润湿性改善的机制为Sn与氧化膜的化学反应，界面析出IMC或者IMC的溶解过程并非限制铺展的主要因素；铺展过程表现出线性铺展规律，可用反应产物控制模型对其进行描述，计算得到Sn/Cu₆Sn₅和Sn/Cu两体系的铺展激活能分别为20.469 kJ/mol和22.270 kJ/mol.     

Interaction of Zn and Zn–4Al,Zn–15Al (wt-%) solder alloys with aluminium

The interaction of pure zinc and Zn–4Al, Zn–15Al (wt-%) solder alloys with aluminium has been investigated. Two different experimental techniques were used: (i) the aluminium samples soldering and (ii) the holding of liquid solder alloys inside the hollow in an aluminium base. The aluminium content was determined in samples after contact with aluminium at various temperatures and various holding times. It is shown that in soldered seams and solder alloys that had been held inside the aluminium base, the content of the aluminium was higher than at the points on the liquidus line on the Zn–Al equilibrium phase diagram at the corresponding temperatures and increases along with an increase in the holding time. This was apparently due to isothermal solidification.     

Brazing of beryllium with aluminium brazing alloys

It is shown that the activation of the surface of beryllium components with titanium results in efficient wetting with aluminium brazing alloys. The experimental results show that the application of aluminium brazing alloys, alloyed with titanium, produces high-quality butt and lap brazed joints with the tensile strength of up to 150 MPa.     

水基免清洗型助焊剂研究进展

随着绿色化学的发展,无铅钎料专用的水基免清洗助焊剂,在未来电子工业中具有重要的应用价值.本文比较各类型助焊剂,阐述了水基免清洗助焊剂的特点,综述了国内外科研工作者改善水基免清洗助焊剂性能的研究状况,并展望该领域未来的发展方向.     

板翅式铝合金散热器真空钎焊技术的发展

综述了板翅式铝合金散热器真空钎焊的原理、预处理工艺、装配状况、真空钎焊工艺等。结合生产实际和试验情况,着重探讨了目前板翅式铝合金散热器真空钎焊成功率低的原因及解决方法。     

Numerical modeling and optimization of laser soldering for Micro‐USB electric connector

The laser soldering process was introduced in Micro‐USB electronic packaging in this paper. Numerical modeling and analysis was used for laser process parameter design, because experimental measurements of peak temperature and soldering stress are expensive and often intractable. Accurate knowledge of the residual stress and distortion is a prerequisite for the reliability of the electric connector. The present work proposes a three‐dimensional transient heat transfer model of Micro‐USB package laser soldering process. The calculated thermal cycles and distribution are subsequently used to calculate the distortion and thermal stresses. Meanwhile, the effect of process parameters on residual stress and pin distortion was discussed, and the tensile strength, microstructure, and residual stresses of laser soldering were tested. It can be concluded that the proper laser soldering parameters and power can improve the mechanical property of solder joints on Micro‐USB connector. Copyright © 2014 John Wiley & Sons, Ltd.     

SnAgCu无铅焊膏用溶剂的优化研究

以SnAgCu无铅焊膏铺展性能和焊点形貌作为评价的主要指标,通过回流焊接实验,对常用于焊膏的10种溶剂进行了单一溶剂优选,并对两种性能较好的溶剂进行复配优化研究.结果表明:A醇、二缩三乙二醇和B醚作为单一溶剂时焊膏的润湿性较好、焊点外形较饱满,铺展率都大于83%;A醇和B醚按质量比3:2复配时得到的焊膏铺展率达到93%...