Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Use of radial forces for fault detection in tapping

A model-based method for fault detection in tapping based on torque and radial forces is proposed. The method allows the identification of faults typical of a tapping operation including axial misalignment, tap runout, tooth breakage both singly and together. The validation experiments have been run on aluminum 356 workpieces for different combinations of process faults. Results have shown that the model predictions are in good agreement with the experimental radial force and torque signals under various fault conditions.     

A new approach to study organic solar cell using Lambert W-function

Organic photovoltaic solar cells bear an important potential of development in the search for low-cost modules for the production of domestic electricity. One of the main differences between inorganic and organic solar cells is that photo-excitation in these materials does not automatically lead to the generation of free charge carriers, but to bind electron–hole pairs (exciton) with a binding energy of about 0.4 eV. Till now various numerical methods using approximations have been reported to study different aspects of organic solar cells. For the first time an accurate method using Lambert W-function is presented to study different parameters of organic solar cells.     

Implementations of a four-level mechanical architecture for fault-tolerant robots

This paper describes a fault tolerant mechanical architecture with four levels devised and implemented in concert with NASA (Tesar, D. & Sreevijayan, D., Four-level fault tolerance in manipulator design for space operations. In First Int. Symp. Measurement and Control in Robotics (ISMCR '90), Houston, Texas, 20–22 June 1990.) Subsequent work has clarified and revised the architecture. The four levels proceed from fault tolerance at the actuator level, to fault tolerance via in-parallel chains, to fault tolerance using serial kinematic redundancy, and finally to the fault tolerance multiple arm systems provide. This is a subsumptive architecture because each successive layer can incorporate the fault tolerance provided by all layers beneath. For instance a serially-redundant robot can incorporate dual fault-tolerant actuators. Redundant systems provide the fault tolerance, but the guiding principle of this architecture is that functional redundancies actively increase the performance of the system. Redundancies do not simply remain dormant until needed. This paper includes specific examples of hardware and/or software implementation at all four levels.     

Relationship of provider characteristics to outcomes, process, and costs of care for community-acquired pneumonia

OBJECTIVES: The authors describe the relation of provider characteristics to processes, costs, and outcomes of medical care for elderly patients hospitalized for community-acquired pneumonia. METHODS: Using Medicare claims data, Medicare beneficiaries discharged from Pennsylvania hospitals during 1990 with community-acquired pneumonia were identified. Claims data were used to ascertain mortality, readmissions, use of procedures and physician consultations, and the costs of care. The relationship of these measures to provider characteristics was analyzed using regression techniques to adjust for patient characteristics, including comorbidity and microbial etiology. RESULTS: Among 22,294 pneumonia episodes studied, 30-day mortality was 17.0%. After adjusting for patient characteristics, 30-day mortality and readmission rates were unrelated to hospital teaching status or urban location or to physician specialty. Use of procedures and physician consultations was more common and costs were 11% higher among patients discharged from teaching hospitals compared with nonteaching hospitals. Similarly, costs were 15% higher at urban hospitals compared with rural hospitals. General internists and medical subspecialists used more procedures and had higher costs than family practitioners. CONCLUSIONS: Processes and costs of care for community-acquired pneumonia varied by provider characteristics, but neither mortality nor readmission rates did. These differences cannot be explained by clinical variables in the database. Further studies should determine whether less costly patterns of care for pneumonia, and perhaps other conditions, could replace more costly ones without compromising patient outcomes.     

Victim retention for reducing cache misses in tiled chip multiprocessors

This paper presents CMP-VR (Chip-Multiprocessor with Victim Retention), an approach to improve cache performance by reducing the number of off-chip memory accesses. The objective of this approach is to retain the chosen victim cache blocks on the chip for the longest possible time. It may be possible that some sets of the CMPs last level cache (LLC) are heavily used, while certain others are not. In CMP-VR, some number of ways from every set are used as reserved storage. It allows a victim block from a heavily used set to be stored into the reserve space of another set. In this way the load of heavily used sets are distributed among the underused sets. This logically increases the associativity of the heavily used sets without increasing the actual associativity and size of the cache. Experimental evaluation using full-system simulation shows that CMP-VR has less off-chip miss-rate as compared to baseline Tiled CMP. Results are presented for different cache sizes and associativity for CMP-VR and baseline configuration. The best improvements obtained are 45.5% and 14% in terms of miss rate and cycles per instruction (CPI) respectively for a 4 MB, 4-way set associative LLC. Reduction in CPI and miss rate together guarantees performance improvement.     

Structural drivers controlling sulfur solubility in alkali aluminoborosilicate glasses

If the direct feed approach to vitrify the Hanford's tank waste is implemented, the low activity waste (LAW) will comprise higher concentrations of alkali/alkaline-earth sulfates than expected under the previously proposed vitrification scheme. To ensure a minimal impact of higher sulfate concentrations on the downstream operations and overall cost of vitrification, advanced glass formulations with enhanced sulfate loadings (solubility) are needed. While, the current sulfate solubility predictive models have been successful in designing LAW glasses with sulfate loadings <2 wt.%, it will be difficult for them to design glass compositions with enhanced loadings due to our limited understanding of the fundamental science governing these processes. In this pursuit, this article unearths the underlying compositional and structural drivers controlling the sulfate solubility in model LAW glasses. It has been shown that the preferentially removes non-framework cations from the modifier sites in the silicate network, thus, leading to the polymerization in the glass network via the formation of ring-structured borosilicate units. Furthermore, though the sulfate solubility slightly decreases with increasing Li⁺/Na⁺ in the glasses, the prefers to be charge compensated by Na⁺, as it is easier for to break Na–O bonds instead of Li–O bonds.     

Dynamic variable depth of cut machining using piezoelectric actuators

This paper describes the design of a piezoelectric actuated cutting tool and implementation of digital servo controls for machining surfaces with dynamically varying depth of cut. Through a flexure hinge, the tool holder could generate 50 μm travel at the tip of the cutting insert. Tool motion errors of less than 0.5 μm were achieved in tracking cyclic waveforms by employing a digital repetitive servo control. When applied to turning aluminum and steel workpieces with variable depth of cut using carbide tools, less than 5 μm machined surface errors were measured.     

A reclaimer scheduling problem arising in coal stockyard management

We study a number of variants of an abstract scheduling problem inspired by the scheduling of reclaimers in the stockyard of a coal export terminal. We analyze the complexity of each of the variants, providing complexity proofs for some and polynomial algorithms for others. For one, especially interesting variant, we also develop a constant factor approximation algorithm.