硅离子注入引入纳米晶对SIMOX材料进行总剂量辐射加固

本研究工作采用硅离子注入和高温退火工艺对SIMOX材料的BOX层进行总剂量辐射加固.辐射实验结果证明了该加固方法的有效性.PL谱和HRTEM图像显示了硅离子注入及退火工艺在材料的BOX层中引入了Si纳米晶,形成电子陷阱能级,有效俘获电子,从而提高了材料BOX层的抗总剂量辐射能力.     

漏及衬底偏压对深亚微米工艺器件总剂量效应的影响

本文对采用0.18?m工艺制造的NMOS器件辐射总剂量效应进行了研究。对晶体管进行了不同剂量的₆₀Co辐射实验,同时测试了辐照前后晶体管电学参数随漏、衬底偏压的变化的规律。采用STI寄生晶体管模型来解释晶体管的关态漏电流及阈值电压漂移性质。3D器件仿真验证了模型的准确性。     

超薄SIMOX材料的Pseudo-MOSFET电学表征

介绍了一种表征SOI材料电学性质的手段,并对三种不同顶层硅厚度的SIMOX材料进行测试、提取参数,分析材料制备工艺对性能产生的影响。研究结果表明,标准SIMOX材料通过顶层硅膜氧化、腐蚀等减薄工艺制得的顶层硅厚度小于100nm的超薄SIMOX材料,其顶层硅与BOX层界面有更多的缺陷,会影响到在顶层硅膜上制得的器件的性能,引起NMOSFET的阈值电压升高、载流子迁移率降低。Pseudo-MOSFET方法能够在晶圆水平上快捷有效地表征超薄SIMOX材料的电学性质。     

栅长对深亚微米器件总剂量辐射诱生漏电流的影响研究

对0.18 um 工艺NMOSFET器件进行总剂量辐照实验,包括不同栅长器件。由于深亚微米器件栅氧化层厚度较薄,对总剂量辐照不敏感,辐照前后器件阈值电压基本不发生变化。所有尺寸器件的关态漏电流随总剂量增加而增加。我们认为,总剂量辐射在浅沟槽隔离氧化物侧壁诱生成源漏之间漏电路径。该漏电路径是由于浅沟槽隔离氧化物种陷阱正电荷形成的。研究发现,辐射诱生的漏电流大小与器件栅长密切相关。通过主晶体管和寄生晶体管模型可以很好解释该现象。     

Radiation induced inter-device leakage degradation

The evolution of inter-device leakage generation technologies is studied with an N-type current with total ionizing dose in transistors in 180 nm poly-gate field device （PFD） that uses the shallow trench isolation as an effective gate oxide. The overall r     

离子注入改性SOI材料总剂量辐射退火效应和机理研究

基于绝缘体上硅(SOI)的CMOS电路具有天然的抗单粒子优势,但绝缘埋层的存在使得其总剂量效应尤为突出和复杂。本文研究了利用离子注入改性SOI材料的总剂量辐射和退火效应、基于赝MOS技术的SOI材料辐射效应评估技术和离子注入改性提高SOI材料抗辐射性能的机理。实验结果表明,采用该技术制备的绝缘体上硅材料抗总剂量能力达到1Mrad(Si);离子注入改性SOI材料在经过室温和高温退火后,辐射导致的固定电荷和界面态可以完全恢复;离子注入和高温退火在二氧化硅薄膜中形成硅纳米团簇结构,从而引入深电子陷阱,补偿总剂量辐射引起的绝缘埋层中的空穴积累。     

硅离子注入对全耗尽SIMOX材料总剂量效应的影响

Total dose hardened fully-depleted SOI materials are fabricated on separation by implanted oxygen （SIMOX） materials by silicon ion implantation and annealing. The ID-VG characteristics of pseudo-MOS transistors pre- and post-irradiation are tested with ^60Co gamma rays. The chemical bonds and the structure of Si in the buried oxide are also studied by X-ray photoelectron spectroscopy and cross-sectional high-resolution transmission electron microscopy, respectively. The results show that Si nanocrystals in the buried oxide produced by ion implantation are efficient deep electron traps, which can significantly compensate positive charge buildup during irradiation. Si implantation can enhance the total-dose radiation tolerance of the fully-depleted SOI materials.     

Gate length dependence of the shallow trench isolation leakage current in an irradiated deep submicron NMOSFET

The effects of gamma irradiation on the shallow trench isolation(STI)leakage currents in a 0.18μm technology are investigated.NMOSFETs with different gate lengths are irradiated at several dose levels.The threshold voltage shift is negligible in all of the devices due to the very thin oxide thickness.However,an increase in the off-state leakage current is observed for all of the devices.We believe that the leakage is induced by the drain-to-source leakage path along the STI sidewall,which is formed by the positive trapped charge in the STI oxide.Also, we found that the leakage is dependent on the device’s gate length.The three-transistor model(one main transistor with two parasitic transistors)can provide us with a brief understanding of the dependence on gate length.     

浮栅存储器的单粒子辐射效应研究进展

综述了浮栅存储器的单粒子效应国外研究进展,对浮栅存储器控制电路及存储单元的单粒子效应进行详细分析和讨论。指出控制电路是浮栅存储器单粒子效应的关键部件以及重离子轰击使浮栅存储器数据保持特性退化;阐述了浮栅存储单元辐射后可能的电荷损失机制。最后指出纳米晶浮栅存储器具有好的抗辐射能力。     

Pseudo-MOS晶体管和nMOS晶体管评估SOI材料抗总剂量辐射能力的比较

本文用辐射加固和未加固的SIMOX(注氧隔离)SOI(绝缘体上硅)材料制作了Pseudo-MOS晶体管和nMOS晶体管,并进行了X射线总剂量辐射实验。结果表明加固工艺能有效提高SIMOXSOI材料的抗总剂量辐射能力,同时也表明Pseudo-MOS晶体管能有效的替代nMOS晶体管对SOI材料的抗总剂量辐射能力进行评估。