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1.
《Ceramics International》2022,48(6):8297-8305
Pure and Sn/Fe co-doped (0.2 at.% Sn and 0.6 at.% Fe, 0.6 at.% Sn and 0.2 at.% Fe, 1.0 at.% Sn and 1.0 at.% Fe) TiO2 nanoparticles were synthesized via a sol-gel method and subsequently calcined at different temperatures. Furthermore, the particles were analyzed by TG-DSC, XRD, TEM, HRTEM, EDS, SAED and UV–Vis for investigating the influences of dopant and calcination temperature on the thermal effect, composition, morphology, energy band gap (Eg) and the degradation efficiency of methyl orange (MO) under various light irradiations respectively. Results indicated that Sn/Fe co-doping inhibited the crystallization transformation from anatase to rutile phase of TiO2 and decreased the Eg. The increased calcination temperature and Sn/Fe co-doped effect brought about the abnormal grain growth of TiO2 nanoparticles. 0.6 at.% Sn/0.2 at.% Fe and 1.0 at.% Sn/1.0 at.% Fe co-doped TiO2 nanoparticles presented better photocatalytic performance than pure and 0.2 at.% Sn/0.6 at.% Fe co-doped TiO2 nanoparticles under visible light irradiation mainly due to the decreased Eg. On the contrary, 0.2 at.% Sn and 0.6 at.% Fe co-doped TiO2 nanoparticles calcined at 650 °C showed the most excellent photocatalytic performance under UV light irradiation, which was about twice as large as that of pure TiO2 possibly due to the formed hybrid structure of anatase and rutile phase as well as the h+-mediated decomposition pathway.  相似文献   
2.
Engineering novel Sn-based bimetallic materials could provide intriguing catalytic properties to boost the electrochemical CO2 reduction. Herein, the first synthesis of homogeneous Sn1−xBix alloy nanoparticles (x up to 0.20) with native Bi-doped amorphous SnOx shells for efficient CO2 reduction is reported. The Bi-SnOx nanoshells boost the production of formate with high Faradaic efficiencies (>90%) over a wide potential window (−0.67 to −0.92 V vs RHE) with low overpotentials, outperforming current tin oxide catalysts. The state-of-the-art Bi-SnOx nanoshells derived from Sn0.80Bi0.20 alloy nanoparticles exhibit a great partial current density of 74.6 mA cm−2 and high Faradaic efficiency of 95.8%. The detailed electrocatalytic analyses and corresponding density functional theory calculations simultaneously reveal that the incorporation of Bi atoms into Sn species facilitates formate production by suppressing the formation of H2 and CO.  相似文献   
3.
The eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging. In this study, low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy is reported. The 80Au/20Sn solder shows a quasi-static fracture characteristic at high strain rates, and then gradually transforms from a transgranular fracture (dominated by fatigue damage) to intergranular fracture (dominated by creep damage) at low strain rates with increasing temperature. Coffin-Manson and Morrow models are proposed to evaluate the low cycle fatigue behavior of the 80Au/20Sn solder. Besides, the 80Au/20Sn solder has enhanced fatigue resistance compared to the 63Sn/37Pb solder.  相似文献   
4.
The corrosion behavior of synthetic Cu–Sn bronze alloys with six different Sn contents was examined through an electrochemical test and a synthetic test in a simulated corrosive medium. The mechanism of corrosion and the morphology of the corroded surfaces were characterized through field emission scanning electron microscopy equipped with energy-dispersive spectroscopy. At the corrosion potential, the corrosion behavior appears to be determined by the charge transfer step and the diffusion process. It was found that the bronze-IV (Cu–26.8Sn) specimen exhibited the best corrosion resistance, as evidenced by a low corrosion current density and a high impedance. This improvement resulted from an increase in the content of the Cu–Sn solid solution in the alloy, which was conducive to forming a relatively more protective passive film on the surface of the bronze alloy. This finding would be valuable in the anticorrosion protection of archeological artefacts after their excavation.  相似文献   
5.
在无铅环境中的热风整平   总被引:2,自引:2,他引:0  
当电子工业走向无铅焊接的时候,热风焊料整平仍然是继续可焊性保护的优选方法。  相似文献   
6.
Several types of reinforced Nb3Sn wires have been developed to prevent reduction of superconducting properties by applying a strong electromagnetic force. To fabricate a cryocooled magnet using those reinforced wires, we experimentally measured the minimum quench energy (MQE) under cryocooled conditions of some reinforced Nb3Sn wires. As a result, it became clear that thermal stability expressed as MQE was controlled by the temperature margin between the temperature of the operating condition and the transition temperature from superconductivity to normal. Using the FEM analysis, it was realized that the cause of the decline in thermal stability for the reinforced wires was the low thermal conductivity of the reinforced materials.  相似文献   
7.
高能超声处理对锡锑包晶合金凝固组织的影响   总被引:5,自引:3,他引:2  
在锡锑包晶合金的凝固过程中导入高能超声,不仅显著细化α相和β相晶粒组织,同时使具有立方晶体特征的β相组织有明显的球化趋势,消除了密度偏析,分析了高能超声细化凝固组织的机理。  相似文献   
8.
铜铟铋硫对Sn-Ag基无铅焊料性能的影响   总被引:6,自引:1,他引:5  
研究了Cu、In、Bi、S元素对Sn-Ag基无铅焊料熔点和铺展性的影响。结果表明:Sn-Ag-Cu三元合金成分为95.5%Sn3.5%Ag1%Cu时具有较低熔点(215℃)和好的铺展性;加入适量的In可降低Sn-Ag合金的熔点和改善铺展性能;随w(Bi)的增加Sn-Ag-Bi三元合金的熔点降低、铺展性变好;Sn-Ag合金的熔点随w(S)的增加而升高,加入少量S能改善Sn-Ag合金的铺展性。  相似文献   
9.
在实际使用条件下,Pb/Sn凸点会由于承受温度循环而产生剪切应力,剪切应力导致的主要失效方式是开裂.通过对倒装焊后Pb/Sn凸点剪切强度的测量及对剪切后断口的分析,发现破坏主要发生在凸点下金属(UBM)层内部或UBM与Al焊盘之间,平均剪切强度受凸点尺寸影响很小,范围在21~24MPa。  相似文献   
10.
在30CrMnSiA钢中加入不同量的As,Sb,Sn元素,研究了这些元素单独存在及复合存在时对钢的强度,塑性,冲击韧度及韧脆转变温度的影响规律,并用扫描电镜及俄歇能谱分析了As,Sb,Sn导致晶界脆化的机理。  相似文献   
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