Microstructure,mechanical, tribological,and oxidizing properties of AlCrSiN/AlCrVN/AlCrNbN multilayer coatings with different modulated thicknesses

Multilayer structure design is one of the most promising methods for improving the comprehensive performance of AlCrN-based hard coatings applied to cutting tools. In this study, four types of AlCrSiN/AlCrVN/AlCrNbN multilayer coatings, with different modulated thicknesses, were deposited to investigate their microstructure, mechanical, tribological, and oxidizing properties. All multilayer coatings exhibited grain growth along the crystallographic plane of (200) with a NaCl-type face-centered cubic (FCC) structure. The results show that, as the modulation thickness decreases from ～35 nm to ～10 nm, (1) the grain refinement effect is increasingly evident; (2) all multilayer coatings show a hardness of >30 GPa and an elastic modulus of >300 GPa. Both the ability to resist elastic strain to failure and the plastic deformation of multilayer coatings increase. In addition, their resistance to cracking reduces; (3) the wear rates of these multilayer coatings reduce successively from 1.78 × 10^?16 m³ N^?1 m^?1 to 7.7 × 10^?17 m³ N^?1 m^?1. This is attributed to an increase in self-lubricating VO_x and a decrease in adhesives from the counterparts; (4) the best high-temperature oxidation resistance was obtained for the multilayer coating with a modulated thickness of ～15 nm.     

毫米波三维异质异构集成技术的进展与应用

三维异质异构集成技术是实现电子信息系统向着微型化、高效能、高整合、低功耗及低成本方向发展的最重要方法,也是决定信息化平台中微电子和微纳系统领域未来发展的一项核心高技术。文章详细介绍了毫米波频段三维异质异构集成技术的优势、近年来的发展趋势以及面临的挑战。利用硅基MEMS 光敏复合薄膜多层布线工艺可实现异质芯片的低损耗互连,同时三维集成高性能封装滤波器、高辐射效率封装天线等无源元件,还能很好地处理布线间的电磁兼容和芯片间的屏蔽问题。最后介绍了一款新型毫米波三维异质异构集成雷达及其在远距离生命体征探测方面的应用。     

积层板的制造方法

概述了积层板的开发背景、制造工艺和最近的开发动向。     

Defocusing image to pattern contact holes using attenuated phase shift masks

The patterning of contact holes by selecting out-of-focus image plane (defocus) using attenuated phase shift masks (APSM) has been studied. Defocus is found to enhance the image modulation at low partial coherence for contact holes with negative local average of mask function. Semi-dense holes up to 130 nm in 8% APSM have been printed by 0.5 μm defocus at a partial coherence of 0.31 using KrF scanner with highest numerical aperture of 0.68. However, these holes were closed with in-focus imaging. Defocus is also found to be beneficial for patterning the pitches that have extensive side lobes with in-focus imaging.     

X射线光刻掩模背面刻蚀过程中的形变仿真

开发了理论模型以验证有限元方法用于X射线光刻掩模刻蚀过程数值仿真的正确性。利用相同的有限元技术，对X射线光刻掩模的背面开窗、Si片刻蚀过程进行数值仿真。结果表明，图形区域的最大平面内形变(IPD)出现在上、下边缘处，最大非平面形变(OPD)出现在左、右边缘处。此外对Si片单载荷步刻蚀和多载荷步刻蚀的仿真进行比较，结果表明图形区域最终的形变量与Si片刻蚀的过程无关。     

数字电视用中分辨率74cm纯平彩色显像管BC配列不良的分析与对策

通过对74cm中分辨率纯平彩色显像管BC配列局部严重群散不良的调查分析,确定荫罩受力塌陷是主要原因,通过改良设计、工艺优化及其它方面的综合对策,使以上技术难题得到满意的解决,整管不良率由4.78%下降到0.172%。     

BaxSr（1—x）TiO3多层膜椭偏光谱研究

用溶胶－凝胶技术在Bi(100）衬底上制备了单层和渐变型多层的BaxSr(1-X)TiO3薄膜，其膜层组分分别为：Ba0.7Sr0.3TiO3,Ba0.8Sr0.2TiO,Ba0.9Sr0.1TiO3,BaTiO3，对生长制备出的多层BaxSr(1-X)TiO3薄膜进行了变角度椭偏光谱测量，通过椭偏光谱解谱分析研究，首次得到了BaxSr(1-X)TiO3多层膜结构不同膜层的膜厚和光学常数，其结果显示：椭偏光谱分析得到的不同膜层的膜厚与卢瑟福背向散射测量得到的结果基本相符；渐变型多层膜中BaTiO3薄膜的折射率比单层BaTiO3薄膜折射率大许多，与体BaTiO3的折射率相接近，这说明渐变型多层膜中BaTiO3薄膜的光学性质与体材料的光学性质接近。     

多层薄膜结构气敏效应研究

在SnO2气敏薄膜层上覆盖一层或多层钝化材料（SiO2,Al2O3) 薄膜，制成的多层膜气敏元件，可很好地排除大分子气体如乙醇等对小分子H2检测的干扰，使其具有单独检测H2的功能。本文还通过测量元件的升温曲线，推导出敏感体表面的氧吸附活化能；找出活化能与灵敏度、选择性的关系。根据实验现象和物性分析结果，试着探讨了元件的敏感机理。     

Display reflectance: Basics,measurement, and rating

Abstract— In this paper, methods and instruments for measurement and evaluation of reflection characteristics are reviewed as needed for research and development of electronic displays and for material and surface modeling with ray‐tracing and rendering software packages. Contrast under ambient illumination and recognizability under daylight illumination are prime development targets in the electronic‐display field, while computation and synthesis of realistic scenes and objects are pushing the need for physical data in computer graphics applications. Three categories of instruments are available for detailed reflection analysis. They are based on (1) gonioscopic (mechanical) and conoscopic (optical) directional scanning, (2) imaging approaches, and (3) on arrangements with variable source or receiver aperture. The capabilities, advantages, and limitations of these methods are introduced and discussed in order to facilitate appropriate selection of methods and instruments. For illustration purposes we present typical results obtained from commercial electronic display screens. A basis for continued widespread implementation and standardization of reflection metrology as required for objective rating and comparison of electronic‐display screen performance under ambient illumination is provided.     

晶体管的计算机辅助设计

将晶体管设计中繁琐的纵向、横向参数的设计计算以及参数验算,采用Basic人机对话方式,由计算机完成。并用BAsic语言绘制出所需的七块光刻掩膜图。既大大地减轻了设计人员繁琐劳动、缩短了设计时间、提高设计质量,又便于修改。还可广泛用于同种结构的不同动率要求的各种晶体管的设计中。