固溶处理对低膨胀GH2909高温合金奥氏体晶粒长大的影响

为了分析固溶温度和时间对GH2909高温合金奥氏体晶粒长大的影响,获得GH2909合金奥氏体晶粒长大规律,对GH2909高温合金在不同固溶温度(1000~1080 ℃)和不同固溶时间(1~4 h)下进行固溶处理。对不同固溶处理工艺后的GH2909合金奥氏体晶粒平均尺寸进行测量,建立了GH2909合金固溶处理时奥氏体晶粒长大模型。结果表明,GH2909合金奥氏体晶粒随固溶温度和时间的增加而逐渐长大,组织中的Laves相逐渐回溶,且当固溶温度小于1020 ℃时,GH2909合金具有较好的抗奥氏体晶粒粗化能力,可以有效指导GH2909合金锻造过程中的晶粒度控制。

Effect of solution treatment on austenite grain growth of low expansion GH2909 superalloy

In order to analyze the effect of solution treatment temperature and time on austenite grain growth in GH2909 superalloy and obtain the grain growth law, the GH2909 superalloy was solution treated at different temperatures (1000-1080 ℃) for different time (1-4 h). The average grain size of austenite in GH2909 alloy after different solution treatment processes was measured, and the austenite grain growth model during solution treatment was established. The results show that the austenite grain size of GH2909 alloy increases gradually with the increase of solution treatment temperature and time, and the Laves phase in the structure gradually redissolves. When the solution treatment temperature is lower than 1020 ℃, the GH2909 alloy has good ability to resist austenite grain coarsening, which can effectively guide the grain size control in the forging process of GH2909 alloy.