金的化学镀

随着电子元器件和高密度、高精度多层印制电路板在航天、航空、航海、遥感等领域中获得广泛应用，化学镀金取得了惊人的进展，并有取代电镀金之趋势，为镀金业带来新的生机。文中针对化学镀金中镀液组分的主盐与络合剂、稳定剂和缓冲剂的筛选与优化等关键技术进行了研究和阐述。

Electroless plating of gold

With the wide application of electronic components and high density high accuracy multilayer printed circuit board in aviation,astronavigation,navigation and remote sensing technology,electroless plating has made a remarkable progress,and can see the trend of replacing electroplating technique,bringing about an opportunity for the development of gold plating.This paper studied and discussed the determination and optimization of the principal salt,complexing agent,stabilizer,and buffering contained in plating solution.