引线键合技术进展

引线键合以工艺简单、成本低廉、适合多种封装形式而在连接方式中占主导地位.对引线键合工艺、材料、设备和超声引线键合机理的研究进展进行了论述与分析,列出了主要的键合工艺参数和优化方法,球键合和楔键合是引线键合的两种基本形式,热压超声波键合工艺因其加热温度低、键合强度高、有利于器件可靠性等优势而取代热压键合和超声波键合成为键合法的主流,提出了该技术的发展趋势,劈刀设计、键合材料和键合设备的有效集成是获得引线键合完整解决方案的关键.

Progress on Technology of Wire Bonding

Wire bonding holds the leading position of connection ways because of its simple techniques,low cost and variety for different packaging forms. Discuss and analyz the research progress of wire bonding process, materials, devices and mechanism of ultrasonic wire bonding. The main process parameters and optimization methods were listed. Ball bonding and Wedge bonding are the two fundamental forms of wire bonding. Ultrasonic/thermosonic bonding became the main trend instead of ultrasonic bonding and thermosonic bonding because of its low heating temperature, high bonding strength and reliability. A development tendency of wire bonding was mentioned. The integration of capillaries design, bonding materials and bonding devices is the key of integrated solution of wire bonding.