| 氧化层对于倒装焊接质量的影响和分析 |
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| 引用本文： | 张智超,赵建忠.氧化层对于倒装焊接质量的影响和分析[J].激光与红外,2009,39(10):1074-1077. |
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| 作者姓名： | 张智超 赵建忠 |
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| 作者单位： | 华北光电技术研究所,北京,100015 |
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| 摘 要： | 利用氧化铟易于溶于酸性溶液的性质,提出了在倒装焊接之前使用酸性溶液对铟柱进行酸洗.在未进行酸洗和进行酸洗的条件下,对比了样品在焊接之后的拉力以及在经过热循环后的盲元率,结果显示酸洗能够降低表面氧化层的影响,有效地改善倒装焊接的质量.
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| 关 键 词： | 酸洗 倒装焊 铟柱 |
Affect and analysis of oxidation layer for the quality of flip chip bonding |
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| ZHANG Zhi-chao,ZHAO Jian-zhong.Affect and analysis of oxidation layer for the quality of flip chip bonding[J].Laser & Infrared,2009,39(10):1074-1077. |
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| Authors: | ZHANG Zhi-chao ZHAO Jian-zhong |
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| Affiliation: | North China Research Institute of Electro-optics,Beijing 100015,China |
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| Abstract: | This article presents acid could be used to wash the indium bumps before flip chip bonding,based on indium oxide dissolved in acid.The samples are divided into two parts:without acid pickling and with acid pickling.According to the comparison of pulling force and blind pixel rate of these samples,the result is showed:acid pickling reduces the affect of oxidation layer and improves the quality of flip chip bonding. |
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| Keywords: | acid pickling flip chip bonding indium bumps |
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