| 倒装焊结构对太赫兹对数周期天线的影响 |
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| 引用本文： | 郝海东,史君宇,成立峰,赵修臣,王兵,吕昕.倒装焊结构对太赫兹对数周期天线的影响[J].红外与毫米波学报,2017,36(4):593-596. |
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| 作者姓名： | 郝海东 史君宇 成立峰 赵修臣 王兵 吕昕 |
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| 作者单位： | 北京理工大学 信息与电子学院 毫米波与太赫兹技术北京市重点实验室,北京理工大学 信息与电子学院 毫米波与太赫兹技术北京市重点实验室,中科院微电子研究所,北京理工大学 材料科学与工程学院;北京理工大学 材料科学与工程学院,北京理工大学 信息与电子学院 毫米波与太赫兹技术北京市重点实验室,北京理工大学 信息与电子学院 毫米波与太赫兹技术北京市重点实验室 |
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| 摘 要： | 设计了一种倒装焊结构，用于340GHz的肖特基二极管探测器。探测单元是基于砷化镓（GaAs）工艺设计的。薄膜陶瓷支撑层旨在为太赫兹检测单元提供封装。通常，导电胶用作天线和输出电路之间的附接。分别对倒装焊结构和无倒装焊结构（类引线键合结构）模型对太赫兹接收天线性能的影响进行研究。为了比较的目的，使用相同的测试系统表征FC结构模型和无FC结构模型（引线键合结构）。通过引线键合与倒装焊测试增益的结果比较，表明倒装焊结构可以作为大规模太赫兹检测阵列封装的低成本解决方案。
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| 关 键 词： | 关 键 词: 太赫兹 倒装焊 对数周期天线 太赫兹封装 薄膜陶瓷 肖特基二极管 |
| 收稿时间： | 2016/12/25 0:00:00 |
| 修稿时间： | 2017/4/6 0:00:00 |
Effects of flip-chip structure on the performance of THz detector with log periodic antenna |
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| HAO Hai-Dong,SHI Jun-Yu,CHENG Li-Feng,ZHAO Xiu-Chen,WANG Bing and LV Xin.Effects of flip-chip structure on the performance of THz detector with log periodic antenna[J].Journal of Infrared and Millimeter Waves,2017,36(4):593-596. |
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| Authors: | HAO Hai-Dong SHI Jun-Yu CHENG Li-Feng ZHAO Xiu-Chen WANG Bing and LV Xin |
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| Affiliation: | Beijing Key Laboratory of Millimeter Wave and Terahertz Technology, School of Information and Electronics, Beijing Institute of Technology,Beijing Key Laboratory of Millimeter Wave and Terahertz Technology, School of Information and Electronics, Beijing Institute of Technology,Institute of Microelectronics, Chinese Academy of Sciences (IMECAS),School of Materials Science and Engineering, Beijing Institute of Technolog University,Beijing Key Laboratory of Millimeter Wave and Terahertz Technology, School of Information and Electronics, Beijing Institute of Technology,Beijing Key Laboratory of Millimeter Wave and Terahertz Technology, School of Information and Electronics, Beijing Institute of Technology |
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| Abstract: | This paper presents a novel flip-chip (FC) structure design for 340GHz Schottky diode detectors, which are designed and fabricated based on the gallium arsenide (GaAs) process. A ceramic thin-film supporting layer is used to provide a package for such detector. Conductive adhesive is typically used as attachment material between the antenna and output circuit. The behaviour of terahertz (THz) detectors with and without the novel FC structure was studied. For comparison, the FC structure model and wire bonding structure one (free of FC) were characterized using the same test system. A comparison analysis for the gains of the THz detector measured with and without the ceramic thin-film layer indicated that the novel FC structure offers a low-cost and practical solution for packaging the array of THz detectors. |
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| Keywords: | THz Flip chip Log periodic antenna THz package Thin-film ceramic Schottky diode |
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