| 面向MEMS封装的微钎料球键合技术 |
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| 引用本文： | 田德文,田艳红,王春青.面向MEMS封装的微钎料球键合技术[J].电子工业专用设备,2008,37(5):1-8. |
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| 作者姓名： | 田德文 田艳红 王春青 |
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| 作者单位： | 哈尔滨工业大学微连接研究室,哈尔滨,150001 |
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| 摘 要： | 微钎料球键合技术是一种成本低、适应性强,可靠性好的键合技术,容易与现有的IC自动化设备集成。微钎料球键合技术结合倒扣封装可以实现低成本、高密度以及高可靠性的MEMS封装;而且具有自对准或者自组装的功能,在MEMS封装中获得了广泛的应用。准确地预测微钎料球键合对于MEMS自组装的影响依赖于动态模型的发展。微钎料球键合技术的出现推动了标准化的MEMS封装工艺的进程。
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| 关 键 词： | 微钎料球键合 微机电系统 3-D封装 自组装 倒装 |
| 文章编号： | 1004-4507(2008)05-0001-08 |
| 修稿时间： | 2008年4月20日 |
Micro Solder Ball Bonding for MEMS Packaging |
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| TIAN De-wen,TIAN Yan-hong,WANG Chun-qing.Micro Solder Ball Bonding for MEMS Packaging[J].Equipment for Electronic Products Marufacturing,2008,37(5):1-8. |
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| Authors: | TIAN De-wen TIAN Yan-hong WANG Chun-qing |
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| Abstract: | Micro Solder Ball Bonding (MSBB) is low-cost, flexible, reliable and easy to be integrated into the present automated devices for IC manufacturing. MEMS packages with low-cost, high density and high reliability can be achieved in combination of MSBB and Flip Chip (FC). MSBB has been widely used in the MEMS packaging for its self-alignment or self-assembly functions. The accurate prediction of the influence of MSBB on MEMS packaging needs to development the dynamic model of solder formation. MSBB push forward the process of the standardization of MEMS packaging. |
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| Keywords: | Micro solder ball bonding MEMS 3-D packaging Self-assembly Flip Chip |
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