| 微电子封装中芯片焊接技术及其设备的发展 |
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| 引用本文： | 葛劢冲.微电子封装中芯片焊接技术及其设备的发展[J].电子工业专用设备,2000,29(4):5-10. |
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| 作者姓名： | 葛劢冲 |
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| 作者单位： | 信息产业邵电子第四十五研究所,甘肃,平凉,744000 |
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| 摘 要： | 概述了微电子封装中引线键合、载带自动键合、倒装芯片焊料焊凸键合、倒装芯片微型焊凸键合等芯片焊接技术及其设备的发展 ,同时报告了世界著名封装设备制造公司芯片焊接设备的现状及发展趋势。
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| 关 键 词： | 微电子 封装技术 引线键合 设备 发展 |
| 文章编号： | 1004-4507(2000)04-0005-06 |
The Development of Chip Bonding Techniques and Its Equipment in Microelectronics Packaging Technologies |
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| GE Mai-chong.The Development of Chip Bonding Techniques and Its Equipment in Microelectronics Packaging Technologies[J].Equipment for Electronic Products Marufacturing,2000,29(4):5-10. |
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| Authors: | GE Mai-chong |
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| Affiliation: | GE Mai - cbong
(The 45th Institute of Electronics, Ministry of II, Pingliang Gansu 744000, China) |
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| Abstract: | This paper summarizes the development of various chip bonding techniques and its equipment in microelectronics packaging technologies, such as wire bonding (WB),tape automated bonding (TAB),flip chip solder bump bonding(FCSBB)and flip chip micron bump bonding(FCMBB) And alsoreporting the current state and the development trend of chip bonding equipment from world famous manufacturers |
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| Keywords: | Microelectronics Packaging Technologies Wire Bonding Equipment Developme |
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