Influence of pulse plating parameters on the electrocodeposition of matrix metal nanocomposites |
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Authors: | Denny Thiemig |
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Affiliation: | Department of Physical Chemistry, Dresden University of Technology, D-01062 Dresden, Germany |
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Abstract: | Electrocodeposition of alumina particles with copper and nickel from acidic electrolytes has been investigated using different deposition techniques. Compared to direct current (DC) deposition, both pulse plating (PP) and pulse-reverse plating (PRP) facilitated higher amounts of particle incorporation. With conventional DC plating the maximum alumina incorporation is ∼1.5 wt% in a nickel and ∼3.5 wt% in a copper matrix. However, the implementation of rectangular current pulses can give considerably higher particle contents in the metal layer. A maximum incorporation of 5.6 wt% Al2O3 in a copper matrix was obtained by PP at a peak current of 10 A dm−2, a duty cycle of 10% and a pulse frequency of 8 Hz. In general, low duty cycles and high pulse frequencies lead to an enhanced particle codeposition. The microstructure and the hardness of both pure metal films and nanocomposite coatings showed only a weak dependence on the PP and PRP conditions. |
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Keywords: | Electrocodeposition Copper Nickel Alumina Nanocomposite Pulse-plating |
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