| 基于改进CAF-WAS的绑定前硅通孔测试 |
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| 引用本文： | 卞景昌,梁华国,聂牧,倪天明,徐秀敏,黄正峰.基于改进CAF-WAS的绑定前硅通孔测试[J].计算机工程与科学,2017,39(3):430-435. |
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| 作者姓名： | 卞景昌 梁华国 聂牧 倪天明 徐秀敏 黄正峰 |
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| 作者单位： | ;1.合肥工业大学电子科学与应用物理学院;2.合肥工业大学计算机与信息学院 |
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| 基金项目： | 国家自然科学基金（61674048,61574052,61371025,61474036） |
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| 摘 要： | 硅通孔TSV发生开路故障和泄漏故障会降低三维集成电路的可靠性和良率,因此对绑定前的TSV测试尤为重要。现有CAF-WAS测试方法对泄漏故障的测试优于其他方法(环形振荡器等),缺点是该方法不能测试开路故障。伪泄漏路径思想的提出,解决了现有CAF-WAS方法不能对开路故障进行测试的问题。另外,重新设计了等待时间产生电路,降低了测试时间开销。HSPICE仿真结果显示,该方法能准确预测开路和泄漏故障的范围,测试时间开销仅为现有同类方法的25%。
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| 关 键 词： | 三维集成电路 硅通孔(TSV) 自测试 伪泄漏路径 开路故障 |
| 收稿时间： | 2016-09-06 |
| 修稿时间： | 2017-03-25 |
CAF-WAS based pre-bonding TSV testing |
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| BIAN Jing-chang,LIANG Hua-guo,NIE Mu,NI Tian-ming,XU Xiu-min,HUANG Zheng-feng.CAF-WAS based pre-bonding TSV testing[J].Computer Engineering & Science,2017,39(3):430-435. |
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| Authors: | BIAN Jing-chang LIANG Hua-guo NIE Mu NI Tian-ming XU Xiu-min HUANG Zheng-feng |
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| Affiliation: | (1.School of Electronic Science & Applied Physics,Hefei University of Technology,Hefei 230009;
2.School of Computer & Information,Hefei University of Technology,Hefei 230009,China)
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| Abstract: | Though silicon via (TSV) open/leakage defect reduces the reliability and yield of three-dimensional integrated circuits, so pre-bonding TSV tests are especially important. The existing charge and float, wait and sample (CAF-WAS) test method for leakage defect test is superior to other methods such as ring oscillator, etc., however, it cannot test open defect. We propose a pseudo leak path thought to solve this problem. In addition, we redesign a waiting time generation circuit of to reduce the test time overhead. HSPICE simulation results show that the proposed method can accurately forecast the open defect and the scope of the leakage defect with only 25% test time of the existing method ［14］. |
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| Keywords: | three-dimensional integrated circuits TSV self-test false leakage path open defect |
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