| 化学置换镀铜研究进展 |
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| 引用本文： | 刘烈炜,卢波兰,吴曲勇,杨志强,付承华.化学置换镀铜研究进展[J].材料保护,2004,37(12):36-38. |
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| 作者姓名： | 刘烈炜 卢波兰 吴曲勇 杨志强 付承华 |
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| 作者单位： | 1. 华中科技大学化学系,湖北,武汉,430074
2. 武汉材料保护研究所,湖北,武汉,430030 |
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| 摘 要： | 置换镀铜的技术已经研究了许多年,但至今仍未在工业上取得有价值的应用,特别是化学置换镀铜层在铁基和锌基表面上作为电镀的底层的要求,其关键技术上仍未彻底地解决.回顾了近10年来置换镀铜的历史,总结了几种较为重要的理论模型和实际工艺,并对使用情况作了说明.提出了对化学浸铜添加剂今后的研究方向,以利于化学浸铜工艺的发展.
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| 关 键 词： | 化学置换镀铜 添加剂 结合力 化学置换镀铜 研究进展 Plating Copper Replacement 发展 铜工艺 方向 铜添加剂 情况 使用 理论模型 历史 电镀 表面 锌基 铁基 置换镀铜层 应用 价值 |
| 文章编号： | 1001-1560(2004)12-0036-03 |
Chemical Replacement Copper Plating |
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| LIU Lie-wei,LU Bo-lan,WU Qu-yong,YANG Zhi- qiang,FU Cheng- hua.Chemical Replacement Copper Plating[J].Journal of Materials Protection,2004,37(12):36-38. |
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| Authors: | LIU Lie-wei LU Bo-lan WU Qu-yong YANG Zhi- qiang FU Cheng- hua |
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| Affiliation: | LIU Lie-wei~1,LU Bo-lan~1,WU Qu-yong~1,YANG Zhi- qiang~2,FU Cheng- hua~1 |
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| Abstract: | Although the chem- ical replacement copper plating technology has been researched for many years, it has not got valuable industrial application as yet. Because there still exist several crucial technical problems, especially as the important basic copper plating on Fe Or Zn metal surface. The development history of chemical replacement copper plating was reviewed, and several more important mechanisms and technical processes of immersion plating copper were de- scribed. The application situations of above processes were also commented. At last, some possible chemical additive that could be used in the future were presented. |
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| Keywords: | chemical replacement copper plating additive bond- ing force |
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