| 半固着磨具在非晶态Ni-Pd-P合金薄膜铜片衬底精密研磨中的应用 |
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| 引用本文： | 邓乾发,袁巨龙,文东辉,陶黎,王志伟.半固着磨具在非晶态Ni-Pd-P合金薄膜铜片衬底精密研磨中的应用[J].表面技术,2009,38(4):1-3,6. |
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| 作者姓名： | 邓乾发 袁巨龙 文东辉 陶黎 王志伟 |
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| 作者单位： | 浙江工业大学省部共建机械制造及自动化教育部重点实验室,浙江,杭州,310014;浙江工业大学省部共建机械制造及自动化教育部重点实验室,浙江,杭州,310014;湖南大学国家高效磨削工程技术研究中心,湖南,长沙,410082 |
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| 基金项目： | 国家自然科学基金重点项目 |
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| 摘 要： | 非晶态Ni-Pd-P合金薄膜具有非常好的热传导性和耐磨性,因而被广泛用作防护镀层.铜片由于其良好的导电性能被选为生长非晶态Ni-Pd-P合金薄膜的衬底材料.主要研究半固着磨具精密研磨非晶态Ni-Pd-P合金薄膜铜片衬底,以铜片衬底的表面粗糙度和材料去除率为评价指标,探讨了研磨过程中不同的工艺参数对铜片表面粗糙度和材料去除率的影响.结果表明:用800# SiC半固着磨具对铜片衬底进行研磨加工,10min后铜片表面粗糙度Ra可由0.553μm减小到0.28μm,同时表面无深划痕.加工后的铜片再经金刚石研磨膏抛光可快速获得满足Ni-Pd-P合金薄膜生长用的铜片衬底表面.
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| 关 键 词： | 铜片衬底 半固着磨具 表面粗糙度 材料去除率 Ni-Pd-P合金 薄膜 |
Approach to Semi-fixed Abrasive Grinding Plate on Surface Lapping Copper Substrates of Amorphous Ni-Pd-P Alloy Films |
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| DENG Qian-fa,YUAN Ju-long,WEN Dong-hui,TAO Li,WANG Zhi-wei.Approach to Semi-fixed Abrasive Grinding Plate on Surface Lapping Copper Substrates of Amorphous Ni-Pd-P Alloy Films[J].Surface Technology,2009,38(4):1-3,6. |
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| Authors: | DENG Qian-fa YUAN Ju-long WEN Dong-hui TAO Li WANG Zhi-wei |
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| Affiliation: | DENG Qian-fa1,YUAN Ju-long1,2,WEN Dong-hui1,TAO Li1,WANG Zhi-wei1(1.MOE Key Laboratory of Mechanical Manufacture , Automation,Zhejiang University of Technology,Hangzhou 310014,China,2.National Engineering Research Center for High Efficiency Grinding,Changsha 410082,China) |
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| Abstract: | The amorphous Ni-Pd-P alloy films have superior properties of good heat conductivity and wear resistance,thus they are widely used as the protecting coating.For unique electrical properties of copper,it has been chosen to be a substrate material for producing amorphous Ni-Pd-P alloy films.The precision lapping technology to machine the copper substrate using semi-fixed abrasive plate was studied.The surface roughness and material removal rate as the evaluation of indicators,the influences of the different l... |
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| Keywords: | Copper substrate Semi-fixed abrasive plate Surface roughness Material removal rate Ni-Pd-P alloy Film |
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