In0.63Ga0.37As／InP压应变量子阱的GSMBE生长及特性研究

用ＧＳＭＢＥ方法生长出了高质量的具有不同阱宽（ｌ～１１ｎｍ）的Ｉｎ０．６３Ｇａ０．３７Ａｓ／ＩｎＰ压应变量子阱结构材料．通过双晶Ｘ射线衍射测量及计算机模拟确定了阱层中的Ｉｎ组份．对材料进行了低温光致发光谱测试，确定了压应变量子阱中的激子跃迁能量．半高宽数值表明，量子阱界面具有原子级的平整度．与７ｎｍ和９ｎｍ阱所对应的低温光致发光谱峰的半高宽为４．５ｍｅＶ．     

含有超晶格电子势垒的In0.83Ga0.17As探测器暗电流仿真和验证

为了获得In0.83Ga0.17As探测器的暗电流机制,采用了TCAD软件对吸收层中含有和不含有超晶格电子势垒的p-i-n结构探测器暗电流特性进行仿真,并开展了器件验证,结果表明,超晶格势垒可以调整器件的能带结构,改变载流子传输特性,降低SRH复合,从而降低器件的暗电流,仿真结果与实验结果吻合;并在此基础上,分析了势垒位置和周期变化对暗电流的影响,提出了进一步降低器件暗电流的超晶格电子势垒优化结构。     

磁各向异性对(In,Ga)As衬底(Ga,Mn)As的影响

在(In,Ga)As缓冲层中生长的Ga<,0.95>Mn<,0.05>As薄膜的磁光圆二向色性(MCD)扫描磁场的测量中发现异常现象,这一现象出现在外磁场把样品的磁化矢量扭转到与入射光方向一致或远离入射光方向之时.通过磁各向异性的平均场理论,我们认为这实际上是磁各向异性对带-带跃迁影响的表现,是由于空穴带劈裂和E-k色...     

不同尺寸分布的自组织In0.55Al0.45As/Al0.5Ga0.5As量子点的静压光谱

在15K测量了不同尺寸分布的In0.55A10.45As/Al0.5Ga05As量子点的静压光致发光,静压范围为0-1.3GPa.常压下观察到三个发光峰,分别来源于不同尺寸的量子点(横向直径分别为26、52和62am)的发光.它们的压力系数分别为82、94和98meV/Gpa,都小于In0.55Al0.45As体材料带边的压力系数,特别是尺寸为26nm的小量子点比In0.55Al0.45As体材料带边小17%,并且压力系数随量子点尺寸的变小而减小.理论计算表明有效质量的增大和Γ-X混合是量子点压力系数变小的主要原因,并得到横向直径为26和52nm的小量子点的Γ-X混合势为15和10meV.根据实验还确定In0.55Al0.45As/Al0.5Ga0.5As量子点系统X能带具有Ⅱ类结构,并且估算出价带不连续量为0.15±0.02.     

一种应用于太赫兹频段的平面In0.53Ga0.47As耿氏二极管

介绍了一种InP衬底上的平面In0.53Ga0.47As耿氏二极管的设计、制作和测试方法。为了提高器件的输出功率,使用Advanced Design System 2011仿真软件设计了50 ?共面波导馈电结构作为器件电极,减少测试功率损耗;同时在版图设计时加大了金属电极面积,改善器件的散热效果。测试结果表明,当所加电压为4.4 V时,沟道长度和宽度分别为2 μm和120 μm器件的基波振荡频率为168.3 GHz,输出功率为-5.21 dBm。这种高功率平面结构耿氏二极管在太赫兹频段具有巨大的应用潜力。     

In0.68Ga0.32As热光伏电池的制作和特性分析

用在InP衬底上失配生长的能隙为0.6eV的In0.68Ga0.32As制成了热光伏(TPV)电池。对其光伏特性的测试分析表明,通过对As组分渐变的InAsxP1-x缓冲层厚度的优化,可以将晶格失配引起的位错完全弛豫在缓冲层内,从而大幅改善热光伏电池的性能。在AM1.5G标准光谱下,与晶格失配没有被完全弛豫的热光伏电池相比,优化措施可将开路电压从0.19V提高到0.21V,外量子效率在长波处可达到85%,转换效率也提高了30%。     

InP/InGaAs/InP红外光电阴极时间响应特性的模拟研究

文中理论研究了InP/In0.53Ga0.47As/InP异质结透射式红外光电阴极的时间响应特性,光谱响应范围1.0～1.7 m。在场助偏压的作用下,模拟计算了光激发的电子在阴极内部的传输特性。模拟计算表明,光电阴极的响应速度随场助偏压的增大而加快;随光吸收层厚度的增大而减慢;随光吸收层掺杂浓度的增大,光电阴极的响应速度变慢。发射层厚度及掺杂浓度的增大都会使得阴极的响应时间加长。经过对阴极结构参数和掺杂浓度的优化,得到在吸收层和发射层厚度分别为2 m、0.5 m,掺杂浓度分别为1.51015 cm-3、1.01016 cm-3时,在适当场助偏压下光电阴极的响应时间可优于100 ps。     

离子损伤对等离子体辅助分子束外延生长的 Ga NAs/ Ga As和Ga In NAs/ Ga As量子阱的影响

研究了离子损伤对等离子体辅助分子束外延生长的 Ga NAs/ Ga As和 Ga In NAs/ Ga As量子阱的影响 .研究表明离子损伤是影响 Ga NAs和 Ga In NAs量子阱质量的关键因素 .去离子磁场能有效地去除了等离子体活化产生的氮离子 .对于使用去离子磁场生长的 Ga NAs和 Ga In NAs量子阱样品 ,X射线衍射测量和 PL 谱测量都表明样品的质量被显著地提高 .Ga In As量子阱的 PL 强度已经提高到可以和同样条件下生长的 Ga In As量子阱相比较 .研究也表明使用的磁场强度越强 ,样品的光学质量提高越明显     

粗糙GaAs(001)表面对In015Ga085As薄膜生长的影响

通过改变衬底降温速率的方法利用分子束外延(MBE)和扫描隧道显微镜(STM)联合系统制备了不同形貌的GaAs(001)表面。采用SPIP软件测量统计和Bauer定则理论分析,研究了粗糙GaAs(001)表面对In015Ga085As薄膜生长的影响。结果表明粗糙GaAs(001)表面存在大量的岛和坑,表面能增加,易于In015Ga085As薄膜层状生长形成平整表面。经计算,面积为100×100 nm2的粗糙GaAs(001)表面相对平坦GaAs(001)表面,其表面能增加了4.6×103 eV,大于生长厚度为15 ML的In015Ga085As薄膜应变能(2.3×103 eV),说明In015Ga085As薄膜在粗糙GaAs(001)表面的外延生长模式为层状生长。     

OMVPE growth of In0.53Ga0.47As on InP using tertiarybutylarsine

We have successfully grown bulk In_0.53Ga_0.47As on InP using tertiarybutylarsine (TBA), trimethylindium and trimethylgallium. The growth temperature was 602° and the V/III ratio ranged from 19 to 38. Net carrier concentrations were 2 – 4 × 10¹⁵ cm^-3, n-type, with a peak 77 K mobility of 68,000 cm²/V. sec. Increasing compensation was observed in In_0.53Ga_0.47As grown at higher V/III ratios. PL spectra taken at 5 K revealed strong near bandgap emission at 0.81 eV—with the best sample having a FWHM of 2.5 meV. At lower energies, donor-acceptor pair transitions were evident. Strong and sharp 5 K PL emission was observed from InP/In_0.53Ga_0.47As/InP quantum wells grown with TBA.     

Systematic optical and x-ray study of In x Ga1−x As on InP

We present a systematic study of In _x Ga_1−x As on InP grown by molecular beam epitaxy using the characterization techniques of Fourier transform photoluminescence, x-ray diffraction, micro-Raman spectroscopy, and photoreflectance spectroscopy. The four techniques were used to determine and correlate the fundamental parameters of band-gap energy, phonon frequency and composition. Comparing room temperature (293 K) PL and low temperature PL indicate the presence of a partially ionized acceptor with binding energy of about 13 meV in the unintentionally doped material. Double crystal x-ray diffraction (XRD) using a symmetric <400> and asymmetric <224> reflections was also employed. The use of two reflections gives precise lattice constants, composition, and extent of film relaxation. Micro-Raman spectroscopy was used to measure phonon frequencies in the In _x Ga_1−x As films and correlated to XRD composition. Room temperature photoreflectance (PR) was used to determine band-gap energy for both the low and intermediate field cases. Band gap energies determined at room temperature by PL and PR were in agreement within experimental error.     

Properties of Zn-doped P-type In0.53Ga0.47as grown by vapor phase epitaxy (VPE) on InP substrates

Electrical properties of Zn-doped, p-type In_0.53Ga_0.47As grown by the vapor phase epitaxy (VPE) technique are presented. High (p ∼ 4.0 × 10¹⁹ cm⁻³) p-type doping and low resistivity (ρ ∼ 2.8 × 10⁻³ Ωsu−cm) was obtained. These propertie's are useful in the formation of ohmic contacts in laser diodes and photodiodes fabricated from the quaternary and ternary alloy systems. A calibration curve for the non-destructive determination of carrier concentration from photoluminescence linewidths has been obtained.     

Low pressure metalorganic chemical vapor deposition of InP and related compounds

The low pressure metalorganic chemical vapor deposition epitaxial growth and characterization of InP, Ga_0.47In_0.53 As and Ga_xIn_1-xAs_yP_1-y, lattice-matched to InP substrate are described. The layers were found to have the same etch pit density (EPD) as the substrate. The best mobility obtained for InP was 5300 cm² V⁻¹S⁻¹ at 300 K and 58 900 cm² V⁻¹ S⁻¹ at 77₂K, and for GaInAs was 11900 cm² V⁻¹ S⁻¹ at 300 K, 54 600 cm² V⁻¹ S⁻¹ at 77 K and 90 000 cm V⁻¹S⁻¹ at 2°K. We report the first successful growth of a GaInAs-InP superlattice and the enhanced mobility of a two dimensional electron gas at a GaInAs -InP heterojunction grown by LP-MO CVD. LP MO CVD material has been used for GaInAsPInP, DH lasers emitting at 1.3 um and 1.5 um. These devices exhibit a low threshold current, a slightly higher than liquid phase epitaxy devices and a high differential quantum efficiency of 60%. Fundamental transverse mode oscillation has been achieved up to a power outpout of 10 mW. Threshold currents as low as 200 mA dc have been measured for devices with a stripe width of 9 um and a cavity length of 300 um for emission at 1.5 um. Values of T in the range 64–80 C have been obtained. Preliminary life testing has been carried out at room temperature on a few laser diodes (λ = 1.5μm). Operation at constant current for severalthousand hours has been achieved with no change in the threshold current.     

The behavior of unintentional impurities in Ga0.47 In0.53As grown by MBE

A number of factors contribute to the high n-type background carrier concentration (high 10¹⁵ to low 10¹⁶ cm⁻³) measured in MBE Ga_0.47In_0.53As lattice-matched to InP. The results of this study indicate that the outdiffusion of impurities from InP substrates into GalnAs epitaxial layers can account for as much as two-thirds of the background carrier concentration and can reduce mobilities by as much as 40%. These impurities and/or defects can be gettered at the surfaces of the InP by heat treatment and then removed by polishing. The GalnAs epitaxial layers grown on the heat-treated substrates have significantly improved electrical properties. Hall and SIMS measurements indicate that both donors and acceptors outdiffuse into the epitaxial layers during growth resulting in heavily compensated layers with reduced mobilities. The dominant donor species was identified by SIMS as Si, and the dominant acceptors as Fe, Cr and Mn.     

Metalorganic InP and Inx Ga1-x,Asy P1-y,on InP epitaxy at atmospheric pressure

We present a procedure for the MOVPE of InP as simple as the one currently used for GaAs. InP and InGaAsP alloys are grown on InP substrates using trimethy1indium (TMI), phosphine, trimethylgallium (TMG) and arsine. The choice of carrier gas is important ; a mixture of hydrogen and nitrogen allowed us to grow uniform layers over large areas at atmospheric pressure, without pyrolizing the phosphine or separating the input reactants. Preliminary characterization results are presented. Most information contained in this paper was presented at the 1983 Electron Materials Conference as paper Cl.     

Dislocation-Induced deep level states in In0.08Ga0.92As/GaAs heterostructures

We have performed luminescence experiments on In_0.08Ga_0.92As/GaAs heterointerfaces to explore the energy distribution of deep level states in the bandgap for two cases: (1) unrelaxed, pseudomorphic In_0.08Ga_0.92As films (200Å thick), which have few if any dislocations at the interface, and (2) partially relaxed In_0.08Ga_0.92As films (1000Å thick) which are expected to have a substantial interfacial dislocation density. A combined photoluminescence and cathodoluminescence technique is used which allows us to profile the sample luminescence through the buried interface region. Our results show the existence of deep level luminescent features characteristic of the GaAs substrate and features common to In_0.08Ga_0.92As and GaAs, as well as the existence of a deep level feature near 1 eV photon energy which undergoes a shift in energy depending upon the degree of strain relaxation in the In_0.08Ga_0.92As film. In addition, a deep level feature near 0.83 eV becomes prominent only in In_0.08Ga_0.92As films which have relaxed, and thus contain misfit dislocations at the interface. These deep level differences may be due to bandgap states associated with the intrinsic dislocation structure, impurities segregated at the dislocation, or bulk point defects, or threading dislocations generated during the strain relaxation. Previous work has determined that a deep level state 0.7 eV above the valence band edge would account for the electrical behavior of relaxed In_0.08Ga_0.92As/GaAs interfaces, which is in good agreement with the range of deep level transitions near 0.8 eV photon energy which we observe. These measurements suggest that photo- and cathodoluminescence measurements of deep level emission in these III-V semiconductors can provide a useful indicator of electrically active defect densities associated with misfit dislocations.     

Ga1-xinxas - inp abrupt heterostructures grown by MOVPE at atmospheric pressure

High quality InP and Ga_1-x In_xAs layers have been grown on InP substrates using MOVPE growth at atmospheric pressure. Excellent material quality has been obtained using triethylindium and trimethylgallium sources(n = 1.7 10¹⁴ cm^-3, μ = 106 000 cm²V^-1s^-1 at 77 K for InP andn = 1 ? 3 10¹⁵ cm^-3, μ= 75 000 cm²V^-1 s^-1 at 77 K for Ga_1-xIn_xAs). The InP/Ga_1-xIn_xAs interface width obtained is very small (10 Å). The first PIN diodes grown by the process exhibit excellent characteristics.     

Analysis of 14nm technology node In0.53Ga0.47As nFinFET integrated with In0.52Al0.48As cap layer for high-speed circuits

CMOS (Complementary Metal-oxide-semiconductor) based high-speed applications in the sub-14 nm technology node using InGaAs Fin field-effect-transistors (FinFETs) confront with inevitable effect in form of interface traps upon integration of dielectric layer with InGaAs material. In this work, we have explored the impact of the traps on short channel effects (SCEs) and a technique of abating the effect of interface traps by introducing In_0.52Al0.₄₈As cap layer. Proposed work reforms the device by varying the cap layer thickness (Tcap), doping concentrations of cap layer and underlap region. The effect of traps on intrinsic delay, work function variation and SCEs was investigated to assess the trend on devices with In_0.52Al_0.48As cap layer. It has been observed that introduction of Tcap improves SCEs and helps to mitigate the effect of interface traps. SCEs can be additionally diminished by presenting underlap fin length at the cost of higher delay. The experimental results show the value of subthreshold swing = 149.54 mV/decade, drain-induced barrier lowering = 38.5 mV V^?1 and delay = 1.1 ps for T_cap = 4 nm without underlap fin length structure for traps concentration of 10¹² cm^?2eV^?1. Thus, significant improvement has been seen in SCEs and delay performance in FinFET structure with cap layer.     

Capacitance-voltage profiling and thermal evolution of the conduction band-offset of unstrained Ga0.47In0.53As/InP single quantum well

We report the results of capacitance-voltage (C-V) and Deep Level Transient Spectroscopy (DLTS) measurements performed upon a Ga_0.47In_0.53As/InP quantum well structure. At room temperature, a conduction-band offset ΔE_c=(200±10)meV and charge densities σ_I=±(3±1)*10¹¹ times the electronic charge per cm² have been measured from C-V experiments. At lower temperature (T≤150K) we have observed an important decrease of the band-offset, considerably larger than a pure thermal effect. We have shown that the explanation lies in the presence of a high concentration of deep traps located at the well-barrier interfaces. Two species A and B have been detected through DLTS experiments with activation energies E_tA=90 meV and E_tB=195 meV, respectively. The filling of these trap levels at low temperature lowers the band offset from 200 to 120 meV, owing to band repulsion effects.