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41.
A new excimer laser annealing (ELA) process that uses a floating amorphous-Silicon (a-Si) thin film with a multichannel structure is proposed for high-performance poly-Si thin-film transistors (TFTs). The proposed ELA method produces two-dimensional (2-D) grain growth, which can result in a high-quality grain structure. The dual-gate structure was employed to eliminate the grain boundaries perpendicular to the current flow in the channel. A multichannel structure was adapted in order to arrange the grain boundary to be parallel to the current flow. The proposed poly-Si TFT exhibits high-performance electrical characteristics, which are a high mobility of 504 cm/sup 2//Vsec and a low subthreshold slope of 0.337 V/dec. 相似文献
42.
43.
论文提出了一种混沌通信系统的噪音衰减算法,该算法利用混沌同步现象在接收端获得正确的噪音估计值,从而从接收信号中滤除噪音恢复出正确的信号。通过数值仿真试验表明该方法是可行的。 相似文献
44.
论文将Fermat素性检验的思想运用于不可约多项式的判断,给出了一个对于不可约判断问题的Monte Carlo 算法,分析了该算法的计算复杂度问题,并且给出了次数在200以内的检验结果。 相似文献
45.
With the creation of a pattern recognition system for metal transfer mode, this article has collected five kinds of spectrum signals in gas metal arc welding (MIG, MAG and CO2) and take them as training samples. These samples have been pretreated by computer, several key characteristic parameters of the spectrum signal have been creatively extracted, and a corresponding recognition function and a minimum-distance-classifier have been constructed. The results show that the pattern recognition of several kinds of metal transfer modes for the metal gas arc welding can be done successfully, and relative important parameters in welding process, such as the frequency of droplet transfer and the approximate diameter of each droplet, can also be obtained. 相似文献
46.
提出一种适用于DS-CDMA无线通信系统的低计算量而性能良好的信道估计算法。在DS-CDMA系统中,当接收信号经过解扩或多用户检测等时域预处理后,可以认为干扰大大减弱、期望信号在处理后的信号中占主要地位。这样,用预处理后信号相关阵的最大特征值对应的特征矢量可以很好地近似期望信号的信道矢量。但是,直接特征分解需要很大的计算量,特征跟踪计算量较低,但瞬态性能较差。本文提出一种基于相关矩阵列矢量平均的信道估计算法,该算法不需要特征分解或跟踪。仿真结果表明:新算法在降低计算量的情况下可以获得同直接特征分解方法几乎相同的性能。 相似文献
47.
The c-axis preferred orientation of ZnO film is the most important factor for its successful application in piezoelectric devices. The effects of surface roughness of the substrate on the c-axis preferred orientation of ZnO thin films, deposited by radio frequency magnetron sputtering, were investigated. During sputtering, the oxygen content in the argon environment used was varied from 0 to 70% at a total sputtering pressure of 10 mTorr. Very smooth Si, smooth evaporated Au/Si, smooth evaporated-Al/Si, and rough sputtered-Al/Si were used as substrates. Their r.m.s. roughnesses, as measured by atomic force microscopy, were 1.27, 17.1, 21.1 and 65-118 Å, respectively. The crystalline structure and the angular spread of the (0 0* 2) plane normal to the ZnO films were determined using X-ray diffraction and X-ray rocking curves, respectively. The crystallinity and the preferred c-axis orientation of the ZnO films were strongly dependent on the surface roughness of the substrates rather than on the oxygen content of the working environment or on the chemical nature of the substrate. 相似文献
48.
以3D软件应用为中心的设计管理模式——PDS在配管设计中的应用 总被引:1,自引:0,他引:1
由PDS的特点入手,结合工程实践的应用情况,阐明了3D软件可以更广泛的应用于配管的设计中,强调了以3D模型为中心开展设计和管理的新模式. 相似文献
49.
50.
A mechanism of soldering of an aluminum alloy die casting to a steel die is proposed. A soldering critical temperature is
postulated, at which iron begins to react with aluminum to form an aluminum-rich liquid phase and solid intermetallic compounds.
The liquid joins the die with the casting upon solidification. The critical temperature is determined by the elements in both
the casting alloy and the die material and is equal to the solidus temperature of the resulting alloy. The critical temperature
is used to predict the onset of die soldering, and the local liquid fraction is related to the soldering tendency. Experiments
have been carried out to validate the concept and to determine the critical temperature for die soldering in an iron-aluminum
system. Thermodynamic calculations are used to determine the critical temperature and soldering tendency for the cases of
pure aluminum and a 380 alloy in a steel mold. Factors affecting the soldering tendency are discussed, and methods for reducing
die soldering are suggested. 相似文献