Catalyst instabilities during the liquid phase partial oxidation of methane

A promising catalytic system for the low temperature oxidation of methane to a methanol derivative has been investigated under both batch and semi-continuous operation in two different reactor types. The system comprises of a bimetallic palladium and copper(II) chloride catalyst contained in a trifluoroacetic acid (TFA) and an aqueous phase. Methane, oxygen and a co-reductant carbon monoxide constitute the gas phase. Typical operating conditions were a temperature of 85 °C and a pressure of 83 bar.

The yields of the methyl trifluoroacetate product observed in this present work were less than those obtained in other batch autoclave works, which employed only 4 ml of liquid phase, compared with 50 ml in this study. Furthermore, an encouraging initial product formation rate of ca. 40 mol/m³ h, quickly decreased after the first hour, and came to an apparent end after only 2 h. This observation had not been reported previously.

Work performed in a semi-continuous porous tube reactor (300 ml of re-circulating liquid phase) also showed the same reaction characteristics as in the batch reactor. Thus, the deteriorating product formation rate cannot be attributed to gaseous reactant depletion (batch operation). The results suggest problems associated with catalyst instabilities, e.g. with the previously elucidated Wacker chemistry.     

电解铜箔产业发展趋势

随着技术的进步,电解铜箔在厚度上迅速向薄、超薄方向发展,THE、RCC、CAC等特殊性能铜箔需求比例快速 增加,以锂离子电池为代表的新应用领域正在形成。     

化学镀工艺在微电子材料中的研究和应用

简要综述了化学镀工艺在微电子材料中的应用,讨论了影响化学镀镍、铜、锡、钴和贵金属等的主要因素,阐述了化学镀微电子材料的特性、存在问题及研究动态。     

纯铜双层辉光离子渗钛组织形成机理及性能分析

采用双层辉光离子渗金属技术对纯铜进行了渗钛处理。用配有能谱仪(EDS)的扫描电子显微镜(SEM)、X射线衍射仪和透射电子显微镜对合金层的显微组织形貌、钛含量分布、相组成及相结构类型进行了观察与测定，对合金层的形成机理进行了探讨，并对其性能进行了对比测定。结果表明：渗钛层由合金层和扩散层组成，合金层主要由TiCu (Cu)固溶体 TiCu4构成，TiCu4为Dla型有序相，TiCu为B2型有序相，扩散层为(Cu)固溶体。渗钛处理后纯铜的表面得到显著强化。     

On the permeation rate of copper extraction through liquid membranes

The understanding of the permeation rate of metal ions through liquid membranes is important for the design of such systems. In this paper, the permeation rates of copper ions through liquid surfactant membranes, including interfacial reaction rates and the diffusion rate of the copper ion, were analyzed using a model based on a mobilized hollow spherical globule configuration. The analysis shows that the extracting reaction is dominant at the external interface of the membrane and the stripping reaction is dominant at the internal interface; this means the reactions at both interfaces are not in equilibrium during the course of extraction. It also shows that the extraction rate, the diffusion rate and the stripping rate are not of equal value, especially at the early stage of the run.     

Growth and characterization of barium copper oxalate single crystals in gels

Barium copper oxalate was grown in silica hydrogel at ambient temperature. The effect of various parameters like gel pH, gel density, gel aging and concentrations of reactants on the growth of these crystals was studied. The crystals grown were characterized by chemical analysis, X-ray powder diffractometry, infrared spectroscopy, thermogravimetric and differential thermal analysis. The results of these observations are described and discussed.     

The initial behaviour of freshly etched copper in moderately acid, aerated chloride solutions

When freshly etched samples of various types of copper were exposed in moderately acid, aerated chloride solutions, two phenomena were observed. First the corrosion potential and the pH of the solution decreased over a shorter time, then the potential increased over a long period (600-1500 min), following an s-shaped pattern. Increase in pH during the second stage was avoided using a pH-stat. The corrosion rate increased little or not at all over the entire period. A tentative interpretation of the short-term behaviour is presented with some reservation. The long-term development of the potential suggests phase formation or transformation following the Avrami pattern. By suitable derivations it was possible to fit the development of potentials to the Avrami equation. Subsequent examinations by Auger spectroscopy proved the presence of thin layers of Cu₂O on the copper surfaces, increasing in thickness with exposure time. The dissolution kinetics can be described in terms of two parallel electrochemical reactions and a simultaneous non-electrochemical dissolution reaction.     

图形电镀中抗镀现象——凹坑的原因剖析

该文通过对本公司在图形电镀时出现的凹坑现象,进行了一个简要的分析探讨,供大家参考。     

UL简介与CCL认可

本文从六个方面对UL的基本知识作了一个简要的概述及CCL认可过程的介绍,希望能为业界同仁提供一个参考方向。     

对未来我国覆铜板业技术发展的战略与任务的探讨

对未来十年我国覆铜板业技术发展的战略与技术开发重点任务进行了探讨。