换热器表面预处理及防腐工艺

石化换热器许多设备都由碳钢制作,需要涂镀渗防腐,为保证防腐层质量,需要进行严格的表面预处理。概述了机械与化学表面预处理及相关的防腐工艺。     

化学还原法制备导电涂料用片状超细铜粉的研究

以CuSO4·5H2 O为原料 ,抗坏血酸为还原剂 ,NH3 ·H2 O为络合剂 ,将络合剂在反应温度加到CuSO4·5H2 O溶液中 ,再加入还原剂 ,制备了粒径分布为 1～ 10 μm的片状铜粉。探索与分析NH3 ·H2 O的用量、反应温度和CuSO4浓度对铜粉形貌及产率的影响。结果表明 :络合剂的使用是制备片状超细铜粉的关键 ,其与Cu2 + 形成络合物 ,减少溶液中游离Cu2 + 的浓度 ,控制铜的生成速度 ,并影响铜的成核和生长 ,最终形成片状铜粉。     

四官能环氧树脂的合成以及在覆铜板中的应用

对四官能环氧树脂[1,1,2,2-四(对羟基苯基)乙烷四缩水甘油醚]的合成与改性及在覆铜板中的应用作了初步探讨,并对其屏蔽紫外线与产生荧光的机理作用作了简单阐述。     

采用“两级跳间隙镀”电源的无氰碱铜工艺研究

回顾了对无氰碱铜研究历史中的经验教训。在大量试验基础上，提出了一种706无氰碱铜工艺。对配位剂的恰当选择、组合及工艺条件控制，能将临界活化电流密度降得很小，使钢铁件上能在宽JK范围内直接预镀铜而取得良好结合力。用开发的“冲击镀加间隙镀两级跳自动电源”，更有利于提高结合力及提高抗阴阳离子杂质影响能力。加入适量硝酸钾能降低液温并提高允许JK，有利于无氰加厚镀铜及复杂管件装饰镀。     

硫酸铜灭藻影响因素的试验研究

目的通过对硫酸铜灭藻影响因素的试验研究,确定出硫酸铜灭藻的最佳工况条件.方法以叶绿素a法作为检测方法,通过烧杯试验,确定处理含藻水的最佳硫酸铜投加量、接触反应时间、pH等参数.结果硫酸铜最佳投加量为1.5 mg/L;硫酸铜适宜的接触反应时间为8～12 h;pH值6.6左右时,硫酸铜藻类去除率较高,pH值＞9时,藻类去除率显著降低.结论 pH值对硫酸铜灭藻效果的影响较大;温度对硫酸铜灭藻有一定的影响;水中还原物质浓度对硫酸铜灭藻影响较小;藻类浓度不同对硫酸铜灭藻效果有一定的影响.     

连续电镀锌镍合金的研究

提出了一种高氯化铵弱酸型镀液体系连续电镀锌镍合金工艺，研究了m(Ni^2 )/[m(Ni^2 ) m(Zn^2 )]、氯化铵浓度，电流密度、温度、PH值对镀层镍含量的影响，推导出连续镀的镀速计算公式，采用此工艺可获得外观良好、镍含量在13％－15％的锌镍合金镀层。     

Investigation of transport phenomena in a hybrid ion exchange-electrodialysis system for the removal of copper ions

Hybrid ion exchange electrodialysis processes allow the removal of metal ions from dilute waste liquids and the recovery of more concentrated solutions. The work reported here was aimed at investigating the two steps in the treatment process, namely, adsorption of metal ions onto the packed bed of resin and electromigration (i.e., the transport of these ions in the complex system under the applied electrical field). The case of copper sulfate was investigated. Dowex resins with a cross-linking degree of 2 and 8% were used. The flux of copper through the resin bed and the current efficiency for ion transfer to the cathode compartment were determined as a function of potential gradient and copper ionic fraction in the bed. Apparent diffusion coefficients of Cu²⁺ in the overall system were deduced from the experimental data.     

化学镀Ni-P合金工艺的研究

本文研究了以硫酸镍作为主盐、次磷酸钠为还原剂的酸性化学镀镍磷合金工艺，并通过实验详细分析了主盐和还原剂、络合剂、催化剂、温度、pH值、前处理、亚磷酸钠等因素对化学镀镍磷合金工艺的影响，找出了最适合的镀浴配比和组成以及最佳的操作务件。     

光亮镀镍液pH值计算机控制系统

光亮镀镍液的ｐＨ值控制得稳定否，对于镀层质量有重要的影响，本文介绍了在电镀生产过程中，对镀镍液的ｐＨ值进行自动控制的一个计算机系统，该系统在广州五羊自行车厂电镀车间投入使用后，镀件质量有了明显的提高。     

Production of nanoparticles of copper compounds by anodic dissolution of copper in organic solvents

The anodic behaviour of copper was investigated in ethanol solution containing LiClO₄, LiCl electrolyte and water. The type of electrolyte and the water content influences the mechanism of the anodic process and the formation of anodic products. In LiClO₄ electrolyte the dissolution of copper is related to the oxidation of Cu(I) to Cu(II). In solutions of LiCl the etching of copper begins with the creation of soluble complexes of Cu(I) with chloride ions and solvent molecules. At potentials above 0.4 V the formation of alkoxides was observed in both solutions, characterized by a yellow tint. On the other hand, above 0.8 V (i.e. above the equilibrium potential of alcohol oxidation) copper dissolution is accompanied by the formation of a blue colloidal suspension of Cu (II) copper salt. Anodic etching of copper in solutions containing 3% H₂O at potentials higher than 0.4 V leads to the formation of colloidal suspension of copper oxide nanoparticles.