用于电弧检测的电力专用SoC设计

针对传统的电弧电路故障检测结果不准确的问题,设计用于电弧检测的SoC系统,并且在55nm工艺下进行流片验证。采用包含两种结构的模数转换器的片上电压源,设计了锁相环以及复位电路,精度最高可达8.67 bit。验证结果表明,本设计可提高电弧检测的准确性。     

Lactobacillus Gasseri LGZ 1029 in yogurt: rheological behaviour and volatile compound composition

Yogurt preserves and enhances nutritional value of milk. In this study, we have compared several strains to determine the physicochemical, sensory, rheological and aroma characteristics of different yogurts. We used Lactobacillus gasseri LGZ 1029 (LG), commercial probiotic L. rhamnosus (LGG) and traditional fermentation strains Streptococcus thermophilus and L. bulgaricus (SL). Results showed that the flavour and texture characteristics of mixed-strain yogurts were obviously better than in single-strain yogurts. Addition of LG increased pseudoplastic behaviour, as shown by Herschel–Bulkley model analysis of rheological behaviour. The LG + SL group also had both the highest viscosity consistency index and thickening ability. In addition, a total of 57 volatile compounds were detected in yogurts and the fermentation with the addition of LG was mainly affected by ketones. Our study suggested that a yogurt with new attributes can be produced by using LGZ 1029.     

Damage evolution in polymer due to exposure to high-pressure hydrogen gas

The use of hydrogen as a fuel is increasing exponentially, and the most economical way to store and transport hydrogen for fuel use is as a high-pressure gas. Polymers are widely used for hydrogen distribution and storage systems because they are chemically inert towards hydrogen. However, when exposed to high-pressure hydrogen, some hydrogen diffuses through polymers and occupies the preexisting cavities inside the material. Upon depressurization, the hydrogen trapped inside polymer cavities can cause blistering or cracking by expanding these cavities. A continuum mechanics–based deformation model was deployed to predict the stress distribution and damage propagation while the polymer undergoes depressurization after high-pressure hydrogen exposure. The effects of cavity size, cavity location, and pressure inside the cavity on damage initiation and evolution inside the polymer were studied. The stress and damage evolution in the presence of multiple cavities was also studied, because interaction among cavities alters the damage and stress field. It was found that all these factors significantly change the stress state in the polymer, resulting in different paths for damage propagation. The effect of adding carbon black filler particles and plasticizer on the damage was also studied. It was found that damage tolerance of the polymer increases drastically with the addition of carbon black fillers, but decreases with the addition of the plasticizer.     

Adaptive viewpoints for co-browsing on heterogeneous devices

Co-browsing is an activity in which a group of users navigate their way through of a set of Web pages together for a shared purpose. Effective co-browsing among users with different device capabilities requires a shared understanding of those Web pages. This paper demonstrates the concept of shared viewpoints (SVPs), and personal viewpoints (PVPs), for co-browsing, before detailing a framework for implementing these concepts. Finally, the effectiveness of the framework is presented through a perceptual experiment.     

信息安全风险评估的模糊多准则决策方法

基于ISO/IEC17799标准建立了一个综合的信息系统风险分析框架,并运用模糊多准则决策(FMCDM)方法计算信息安全风险,根据风险等级矩阵(RLM)对信息资产风险进行级别划分,最终建立评估信息资产相关风险的完整模型。     

基于滑窗结构的软输出维特比算法的实现

文章在对软输出维特比算法(SOVA)进行推导的基础上，分析了软信息的提取过程。同时从硬件实现的角度考虑，提出了一种基于滑动窗1：3结构的SOVA算法实现方案，该算法大大降低了算法实现复杂度和译码延迟，同时通过调整滑窗参数，可以取得与非滑窗SOVA算法几乎相同的性能。     

New encapsulation development for fine pitch IC devices

The continuous reduction of chip size driven by the market demand has a significant impact on circuit design and assembly process of IC packages. Shrinking chip size and increasing I/O counts require finer bond pad pitch and bond pad size for circuitry layout. As a result, serious wire deflection during transfer molding process could make adjacent wires short, and this issue becomes more critical as a smaller wire diameter has to be applied for the finer pitch wire bonded IC devices.This paper presents a new encapsulation process development for 50 μm fine pitch plastic ball grid array package. Since reduced wire diameter decreases the bending strength of bonded wires significantly, wire deflection during molding process becomes quite serious and critical. Experiments on conventional transfer molding were conducted to evaluate wire span threshold with 23.0 μm diameter gold wire. The results show that the wire span threshold is about 4.1 mm, which is much shorter than the wire span threshold of over 5.0 mm for wire with 25.4 μm diameter. Finite element analysis shows there is a significant difference in the wire deflection between 23.0 μm gold wire and 25.4 μm gold wire diameter under the same action of mold flow. A novel encapsulation method is introduced using non-sweep solution. The wire span could be extended to over 5.0 mm with wire sweep less than 1%. Reliability tests conducted showed that all the units passed 1000 temperature cycles (−55 to 125 °C) with JEDEC moisture sensitivity level 2a (60 °C/60% relative humidity for 120 h) and 3 times reflow (peak temperature at 220–225 °C). It is believed that this solution could efficiently overcome the risk of wire short issues and improve the yield of ultra fine pitch wire bonds in high-volume production.     

The sleeping dragon: Wind energy in the Asia-Pacific region

The Asia-Pacific region is one of the fastest growing regional economies in the world today. The region is home to over half of the global population and is one of the most important markets for multinational corporations to penetrate. The wind power sector is no exception. Wind resources remain untapped and the demand for electricity continues to grow as a result of expanding and modernizing economies. Godfrey Chua, Emerging Energy Research USA reports on the current status and development of the wind industry in the region.     

The glass fibre-polymer interface: II—Work of fracture and shear stresses

Pull-out experiments have been carried out on single production fibres under carefully controlled conditions. Four parameters were determined. The interfacial yield stresses, of about 9–14 MPa, were very much smaller than the shear strengths of the bulk polymers in the case of an epoxy, whether post-cured or not, and a non-post-cured polyester. Values for the work of fracture of the interface varied from 140 to 300 Jm^?2, and again were less than those of the polymer. Interface failure sometimes took place in the epoxy rather than at the fibre surface, whereas with the polyester it always took place at the fibre surface. After interface failure, pull-out was governed by friction, with maximum shear stresses of 7–10 MPa for polyester, and 21–34 MPa for epoxy, the higher values being obtained for the post-cured resins. Average frictional shear stresses were sometimes less than a half of the maximum shear stress, indicating that the fibre Poisson's shrinkage was playing an important role in the pull-out process. A silicone release agent reduced the frictional shear stresses to 2·5 MPa, with both resins.     

室温下Ho∶YAG激光器输出3J的2．1μm激光

根据对２．１μｍ波长Ｃｒ，Ｔｍ，Ｈｏ∶ＹＡＧ激光器的实验研究，详细分析了冷却温度、放电脉冲半宽度和输出镜透过率等因素对激光器的输出的影响