浅谈参地开发中水土流失防治对策

本文通过对典型小流域内参地开发造成水土流失的分析,提出适合本区域操作的参地防治对策。     

基于进化算法的常减压装置模拟

提出了基于优选优生进化算法（Select—best and prepotency evolution algorithm，SPEA）的常减压装置模拟方法。以各塔的温度分布为目标，基于生产过程和分析数据，采用SPEA确定各塔板Murphree效率，从而精确描述各塔板平衡偏离程度。在实际应用中，获得具有良好精度的常减压装置模型。系统分析了SPEA算法的关键参数——优选领域大小与计算复杂性及寻优性能之间的关系，结果显示其取值为群体规模的10％最为合适。     

管道风险管理方法研究

按照管道风险管理的流程分别对管道风险评价、风险控制和决策支持、效能测试和响应进行了论述。针对目前国内管道行业的情况，提出了进行管道风险评价的有效方法及维护措施。着重介绍了国外管道风险可接受标准的情况，作为国内制定管道风险评价标准的参考。     

TUD-DNS3脱硝助剂在催化裂化装置的工业应用

TUD-DNS3脱硝助剂在中韩（武汉）石油化工有限公司1号催化裂化装置上进行了工业应用。结果表明：针对两段再生工艺，当系统中助剂占总催化剂藏量的质量分数为2.6%时，烟气脱硫装置外排污水中的氨氮质量浓度由加剂前的100 mg/L下降至40 mg/L以内；助剂的加入降低了CO焚烧炉的炉膛温度，有利于烟气的合格排放，并对装置操作、产品分布及汽油、柴油产品质量无不良影响。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

ADIC iPlatform智能磁带库体系结构

本文介绍了ADIC iPlatform智能磁带库体系结构。     

传感器管理及其在相控阵雷达中的应用

传感器管理是数据融合的一部分。介绍了传感器管理的概念和框架 ,概述了国内外传感器管理算法的研究现状。主要工作是针对相控阵雷达这一传感器 ,通过对其不同工作模式以及不同参数的管理 ,来说明传感器管理的原理。提出了一种新的自适应采样周期算法 ,仿真结果表明该算法的优越性     

Gamma-irradiation-induced Ag/SiO2 composite films and their optical absorption properties

Small Ag particles or clusters dispersed mesoporous SiO₂ composite films were prepared by a new method: First the matrix SiO₂ films were prepared by sol-gel process combined with the dip-coating technique, then they were soaked in AgNO₃ solutions followed by irradiation of γ-ray at room temperature and in ambient pressure. The structures of these films were examined by X-ray diffraction (XRD), high-resolution transmission electron microscope (HRTEM), and optical absorption spectroscopy. It has been shown that the Ag particles grown within the porous SiO₂ films are very small, and they are isolated and dispersed from each other with very narrow size distributions. With increasing the soaking concentration and an additional annealing, an opposite peakshift effect of the surface plasmon resonance (SPR) was observed in the optical absorption measurements.     

浅谈应用标准进行软件测试

国家标准GB T175 44规定了软件包的质量要求及针对这些要求如何对软件包进行测试的细则。质量要求从产品描述、用户文档、程序及数据三个方面进行了规定 ,测试细则依据这些规定制定。ISO IEC912 6 (1991)版由ISO IEC 912 6 (软件产品质量 )和ISO IEC14 5 98(软件产品评测 )两个标准代替 ,ISO IEC912 6表述了软件产品质量的内部质量、外部质量和使用中的质量 ,规定了内部质量、外部质量的六个质量特性 ,并细分为 2 1个子特性 ,使用中的质量规定了四个使用质量特性 ,使用质量是指六个软件产品质量特性的综合效果。进行软件测试时 ,可以依据GB T175 44中的规定组织测试过程再结合ISO IEC912 6中的质量特性及子特性的规定确定测试需求的内容和测试的重点 ,利用ISO IEC912 6质量的规定建立质量评级的标准。     

合成己二腈反应技术研究——(Ⅴ)己二腈工业反应过程模拟与反应器改造

对己二腈工业反应器提出了两釜串联带回流的模型,通过模拟计算得出模型的级间返混系数 f=6的结论。该模型能较好地预测工业反应器中物料组分浓度变化和气、液两相的流动特性;指出了现工业反应器的鼓泡中和段体积偏小是造成己二酸浓度偏高的关键;提出了可以通过增加串连一个鼓泡预反应段的改造方案,能有效地降低己二酸的浓度,从7%降至4%左右,从而能较好地减缓腐蚀和结焦。