毫米波三维异质异构集成技术的进展与应用

三维异质异构集成技术是实现电子信息系统向着微型化、高效能、高整合、低功耗及低成本方向发展的最重要方法,也是决定信息化平台中微电子和微纳系统领域未来发展的一项核心高技术。文章详细介绍了毫米波频段三维异质异构集成技术的优势、近年来的发展趋势以及面临的挑战。利用硅基MEMS 光敏复合薄膜多层布线工艺可实现异质芯片的低损耗互连,同时三维集成高性能封装滤波器、高辐射效率封装天线等无源元件,还能很好地处理布线间的电磁兼容和芯片间的屏蔽问题。最后介绍了一款新型毫米波三维异质异构集成雷达及其在远距离生命体征探测方面的应用。     

智能工作站主机的MMPIS实验模型研究──一个全互连式结构MMPIS硬件环境的设计与实现

本文介绍中日国际合作开发研究的Ａ１型智能网（Ａ１型ＩＮ）智能工作站（ＩＷ）主机的并行推理硬件结构的实验模型设计与实现，给出了一种并行推理硬件支持环境实现方案和该方案在实现中若干问题的解决方法。     

帧中继交换技术

本文论述了帧中继交换的概念、标准，结构、特点网络式样及在互连网中的应用。     

光学全交叉网络与SW榕树（F＝S＝2）网络拓扑等价的多样性

本文对有关互连网络拓扑等价的分析方法作了简单评述。并采用互连网络拓扑等价的图分析法分析了自由空间光学互连全交叉网络与ＳＷ榕树网络的拓扑等价及其多样性，拓展了全交叉网络在数字光计算、光子交换及多处理机系统的潜在应用。     

A One‐Kilobit PQR‐CMOS Smart Pixel Array

The photonic quantum ring (PQR) laser is a three dimensional whispering gallery (WG) mode laser and has anomalous quantum wire properties, such as microampere to nanoampere range threshold currents and √T‐dependent thermal red shifts. We observed uniform bottom emissions from a 1‐kb smart pixel chip of a 32×32 InGaAs PQR laser array flip‐chip bonded to a 0.35 µm CMOS‐based PQR laser driver. The PQR‐CMOS smart pixel array, now operating at 30 MHz, will be improved to the GHz frequency range through device and circuit optimization.     

A simplified cascade current‐source inverter interconnected to a single‐phase three‐wire distribution system and its application to electric energy storage systems with batteries

A novel current source inverter system interconnected to the single‐phase grid is proposed. It has the same construction as the conventional three‐phase current source inverter that is interconnected to the single‐phase three‐wire distribution system. Though the proposed circuit has no output transformer, it can be equivalently performed as the single‐phase double cascade inverter by diverting the pole transformer in the utility system. By controlling the appropriate scheme, the output currents can be obtained as the five‐level waveforms and their distortions can be decreased sufficiently. It is applied to the interactive electric energy storage system with batteries and the basic discharging characteristics are discussed experimentally. © 2004 Wiley Periodicals, Inc. Electr Eng Jpn, 150(2): 50–61, 2005; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/eej.10380     

广义de Bruijn多计算机互连网络

（ｄ，ｍ）ｄｅ Ｂｒｕｉｊｎ多计算机系统互连网络限制网络的规模必须为ｄ＾ｍ。本文把（ｄ，ｍ）ｄｅ Ｂｒｕｉｊｎ网络推广到了任意顶点情形，提出了广义ｄｅ Ｂｒｕｉｊｎ网络，研究了广义ｄｅ Ｂｒｕｉｊｎ网络的自路由性质，设计了路由算法，研究了广义ｄｅ Ｂｒｕｉｊｎ网络顶点度的性质和容错特性。     

计算机网络互连模式及实现技术

本文讨论了计算机网络互连的体系结构模式及实现技术。文中先论述了ＩＳＯ、ＤＯＤ和Ｐｕｐ网际互连参考模式，然后讨论了网络互连的主要实现技术：互连层，网际寻址，网际路由选择，信包分拆与重装，网际流控与拥挤控制，网际保安与差错控制，网际信关与桥以及协议转换等技术。     

A Solder Alloy Filled Z-Axis Conductive Epoxy Adhesive

Epoxy adhesives filled with four different volume fractions of eutectic tin-bismuth solder alloy were prepared and the effect of filler content on the electrical and mechanical properties of these anisotropic electrically conductive adhesives was investigated. The results show that the adhesive containing the lowest amount of the filler alloy had the best combination of conductivity, insulation resistance and shear strength. The DSC-measurements suggested that the filler melts before the cure of the resin begins which allows the filler to wet and bond well to the conductors. This was verified by SEM/EPMA examinations. A temperature cycling test and high humidity, high temperature treatment were conducted on the best composite adhesive. The temperature variation had no effect on conductivity of the joints while humid and hot environment decreased the conductivity.