毫米波三维异质异构集成技术的进展与应用

三维异质异构集成技术是实现电子信息系统向着微型化、高效能、高整合、低功耗及低成本方向发展的最重要方法,也是决定信息化平台中微电子和微纳系统领域未来发展的一项核心高技术。文章详细介绍了毫米波频段三维异质异构集成技术的优势、近年来的发展趋势以及面临的挑战。利用硅基MEMS 光敏复合薄膜多层布线工艺可实现异质芯片的低损耗互连,同时三维集成高性能封装滤波器、高辐射效率封装天线等无源元件,还能很好地处理布线间的电磁兼容和芯片间的屏蔽问题。最后介绍了一款新型毫米波三维异质异构集成雷达及其在远距离生命体征探测方面的应用。     

Mechanical behavior of 30–50 nm thick aluminum films under uniaxial tension

We present uniaxial tensile test results for 30–50 nm thick freestanding aluminum films. Young’s modulus and ductility were found to decrease monotonically with grain size. Reverse Hall–Petch behavior was observed with no appreciable room temperature creep. Non-linear elasticity with small irreversible deformation was observed for 50 nm thick specimens.     

MEMS移相器及其在微型通信系统中的应用

从传统移相器的构造和原理出发，进一步分析了MEMS移相器的结构、特性。结果表明，MEMS移相器具有传统移相器所无法比拟的体积小、损耗小、成本低、频带宽、易于集成等突出优点。随着高阻硅衬底在微波领域应用的扩展，MEMS移相器介质损耗大幅度降低，将能与信号处理电路一同集成于硅衬底上，便于相控阵雷达等通信系统实现微小型化。     

Analytical model of displacement amplification and stiffness optimization for a class of flexure-based compliant mechanisms

The paper formulates an analytical method for displacement and stiffness calculations of planar compliant mechanisms with single-axis flexure hinges. The procedure is based on the strain energy and Castigliano’s displacement theorem and produces closed-form equations that incorporate the compliances characterizing any analytically-defined hinge, together with the other geometric and material properties of the compliant mechanism. Displacement amplification, input stiffness and output stiffness calculations can simply be performed for any serial compliant mechanism. The class of amplifying compliant mechanisms that contain symmetric corner-filleted or circular flexure hinges is specifically addressed here. A parametric study of the mechanism performance is performed, based on the mathematical model, and an optimization procedure is proposed, based on Lagrange’s multipliers and Kuhn-Tucker conditions, which identifies the design vector that maximizes the performance of these flexure-based compliant mechanisms. Independent finite element simulation confirms the analytical model predictions.     

BioMEMS和人体植入式生物微系统

MEMS技术在医药科学技术的一个重要应用是植入人体内的生物微系统(BioMEMS)。该系统集微传感器、微驱动器、微流体系统、微光学系统及微机械元件于一体,用于体内器官的诊断、体内器官功能修复或替代,其治疗效果确切,已成为关系本世纪医学与人类健康进步的重要领域。本文介绍了近年来不同功能类别植入式BioMEMS的发展状况,说明了MEMS工艺、方法及材料在此领域的应用。     

光通信用垂直腔面发射激光器的进展

垂直腔面发射激光器(VCSEL)以其优异的性能有望成为信息时代的新光源.文章介绍了用于光通信的VCSEL的开发现状.     

微型电磁继电器的制作和仿真分析

介绍了一种基于MEMS技术的微型电磁继电器的制作过程和仿真分析.这种微继电器的大小约是4mm×4mm×0.5mm,主要采用普通的微加工技术来完成全部制作工艺.与传统继电器相比,这种继电器采用平面线圈来代替螺线管线圈,有利于MEMS工艺,并且提出了一种双支撑的悬臂梁结构做为活动电极,具有较高的灵敏性和稳定性.另外,还进行了一些有关线圈通过激励电流后对活动电极产生电磁力的理论计算和仿真分析,利用这些结果可以对这种电磁继电器的结构和参数进一步优化.     

等离子体横向刻蚀硅的特性研究

研究了用SiO2 +Al作掩模 ,SF6 +O2 混合气体等离子体对Si的横向刻蚀 ,其结果表明 ,在SF6 +O2 等离子体气氛中 ,Al是很好的保护膜 ,可以在待悬浮器件下形成大的开孔。因此 ,预计用这种技术 ,可以在Si片上集成横向尺寸为数百微米 ,具有优良高频性能的MEMSRF/MW无源器件 ,如开关、传输线、电感和电容等。     

Rare-earth-enabled universal solders for microelectromechanical systems and optical packaging

In packaging of microelectromechanical systems (MEMS), optical, and electronic devices, there is a need to directly bond a wide variety of inorganic materials, such as oxides, nitrides, and semiconductors. Such applications involve hermetic-sealing components, three-dimensional MEMS assembly components as well as active semiconductor or optical components, dielectric layers, diffusion barriers, waveguides, and heat sinks. These materials are known to be very difficult to wet and bond with low melting-point solders. New Sn-Ag- or Au-Sn-based universal solders doped with a small amount of rare-earth (RE) elements have been developed, which now allow direct and powerful bonding onto the surfaces of various MEMS, optical, or electronic device materials. The microstructure, interface properties, and mechanical behavior of the bonds as well as the potential packaging applications of these new solder materials for MEMS and optical fiber devices are described. Various packaging-related structural, thermal, or electrical issues in MEMS are also discussed.     

PCR芯片和生化微分析系统

介绍了PCR微芯片的最新研究进展,给出了不同结构的PCR芯片设计原理以及特点,介绍由PCR芯片为主要单元的集成微全分析系统的相关研究,同时简要介绍了对PCR的仿真模拟等。