光电子技术

O432005060119二氧化锆薄膜制备及其特性测量/任树喜,马洪良,徐国庆,张义炳(上海大学物理系)//强激光与粒子束.―2005,17(2).―222～224.在室温下采用电子束蒸发的办法制备二氧化锆(ZrO2)薄膜。借助紫外分光光度计、原子力显微镜(AFM)、X射线衍射(XRD)等方法研究了薄膜的透射率和表面结构,同时研究了不同退火温度对薄膜物理性质的影响,在退火温度700,900,1050℃时显微镜图像没有明显差别。随着退火温度的变大,薄膜表面的晶粒的直径逐渐变大,但粒径均在25nm左右。当退火温度达到1150℃时,粒径变得很大(约400nm)。在700,900,1050℃下退火…     

磁控溅射YSZ薄膜的激光损伤阈值

利用射频磁控溅射方法在不同衬底上制备出掺Y2O3 8 %的YSZ薄膜, 用X射线衍射、原子力显微镜(AFM)、扫描电子显微镜和透射光谱测定薄膜的结构、表面特性和光学性能, 研究了退火对薄膜结构和光学性能的影响。结果表明：随着退火温度的升高, 薄膜结构依次从非晶到四方相再到四方和单斜混合相转变, AFM分析显示薄膜表面YSZ颗粒随退火温度升高逐渐增大, 表面粗糙度相应增大, 晶粒大小计算表明, 退火温度的提高有助于薄膜的结晶化, 退火温度从400 ℃到1100 ℃变化范围内晶粒大小从20.9 nm增大到42.8 nm; 同时根据ISO11254-1激光损伤测试标准对光学破坏阈值进行了测量, 发现与其他电子束方法制备的YSZ薄膜损伤阈值结果比较, 溅射法制备的薄膜损伤阈值有了一定程度的提高。     

连续氩氪离子激光晶化非晶硅薄膜的研究

为了研究连续激光晶化非晶硅薄膜中激光功率密度对晶化效果的影响,利用磁控溅射法制备非晶硅薄膜,采用连续氩氪混合离子激光器对薄膜进行退火晶化,用显微喇曼光谱测试技术和场发射扫描电子显微镜研究了薄膜在5ms固定时间下不同激光功率密度对晶化效果的影响,并对比了普通玻璃片和石英玻璃两种衬底上薄膜晶化过程的差异。结果表明,在一定激光功率密度范围内(0kW/cm2~27.1kW/cm2),当激光功率密度大于15.1kW/cm2时,普通玻璃衬底沉积的非晶硅薄膜开始实现晶化;随着激光功率密度的增大,晶化效果先逐渐变好,之后变差;激光功率密度增大到24.9kW/cm2时,薄膜表面呈现大面积散落的苹果状多晶硅颗粒,晶粒截面尺寸高达478nm ;激光功率密度存在一个中间值,使得晶化效果达到最佳;石英衬底上沉积的非晶硅薄膜则呈现与前者不同的结晶生长过程,当激光功率密度为19.7kW/cm2时,薄膜表面呈现大晶粒尺寸的球形多晶硅颗粒,并且晶粒尺寸随着激光功率密度的增大而增大,在 27.1kW/cm2处晶粒尺寸达到最大5.38m。研究结果对用连续激光晶化法制备多晶硅薄膜的研究具有积极意义。     

温度对飞秒激光沉积ZnO/Si薄膜的结构和性能的影响

通过飞秒脉冲激光(50 fs,800 nm,1 kHz,2 mJ)沉积技术在n型Si(100)单晶基片上制备了ZnO薄膜.详细研究了基片温度变化以及退火处理对ZnO薄膜的结构、表面形貌及光学性质的影响.X射线衍射(XRD)结果表明,不同温度下(20~350℃)生长的ZnO薄膜具有纤锌矿结构,并且呈c轴择优取向;当基片温度为80℃时,薄膜沿(002)晶面高度择优生长;当基片温度为500℃时薄膜沿(103)晶面择优生长,场发射扫描电子显微镜(FEEM)结果表明薄膜呈纳米晶结构,并观察到了ZnO的六方结构.进一步通过透射光谱的测量讨论了基片温度及退火处理对ZnO薄膜光学透射率的影响,结果表明退火后薄膜的透射率增大.     

Y2O3:Eu薄膜的制备及其发光性能研究

用电子束蒸发方法在ITO基片上生长Y2O3：Eu荧光薄膜．并在不同条件下退火处理。分别用X射线衍射(XRD)、X射线光电子能谱(KPS)、扫描电于显微镜(SEM)和光致发光(PL)谱表征Y2O3：Eu荧光薄膜的结构、成分、形貌和发光性能。实验表明：随着温度升高,薄膜的结晶程度提高,弥补了薄膜晶体表面的表面缺陷,提高了薄膜的发光性能：600 O退火处理的光致发光中,617nm和596nm的谱线最强。     

退火时间对TiO2薄膜光学性能的影响

研究退火时间对薄膜相结构、形貌及光学性能的影响。采用射频磁控溅射法在单晶硅片和石英玻璃片上负载TiO2薄膜,通过X-射线衍射(XRD)、原子力显微镜(AFM)和紫外可见光谱(UV-Vis)对其进行表征。结果表明,在相同的退火温度下,与退火0.5 h相比,退火1 h的薄膜中锐钛矿相TiO2减少,金红石相TiO2增多,对可见光透射率有所减小,1 000℃以上退火时,透射率减小更明显。与退火1 h相比,退火0.5 h薄膜晶粒较小,明显呈纳米团簇状,薄膜表面粗糙度增大。     

Au/SiO_2纳米复合薄膜的结构表征及光致发光特性

采用磁控溅射和退火技术制备出Au/SiO2纳米复合薄膜。利用扫描电子显微镜(SEM),X射线衍射(XRD)和原子力显微镜(AFM)对上述纳米复合薄膜进行了结构表征。实验结果表明,纳米复合薄膜的表面上均匀分布着直径在100～300nm的金纳米颗粒。金纳米颗粒的大小随着退火时间的增加而增大。用荧光光谱仪(PL)对薄膜的光致发光特性进行了研究。结果表明,在激发波长为325nm时,分别在525nm和560nm处出现两个发光峰;在激发波长为250nm时,在325nm处出现发光峰,这一发光峰可能与非晶SiO2的结构缺陷有关。     

脉冲激光沉积制备Ge纳米薄膜的研究

利用脉冲激光沉积(PLD)技术,在Ar环境下于Si基片上制备出Ge纳米薄膜.用X射线衍射(XRD)仪和原子力显微镜(AFM)观测了薄膜的微观结构和形貌,分析了它们随激光能量密度和衬底温度的变化情况.结果表明:Ge薄膜在室温下即可以结晶,其平均品粒尺寸随脉冲激光能量密度的增大而增大.当脉冲激光能量密度为0.94 J/cm2时,所制备的薄膜由约13 nm的颗粒组成;当脉冲激光能量密度增大为1.31 J/cm2时,颗粒的平均尺寸增大为56 nm,凡薄膜表面变得比较均匀.此外,当衬底温度从室温升到450℃过程中,晶粒平均尺寸随温度升高而增大.在实验基础上,对薄膜的生长机理进行了分析.     

反应电子束蒸发HfO_2薄膜的结构、光学、化学和抗激光损伤特性

采用反应电子束蒸发技术在不同氧分压下制备了HfO_2薄膜,并采用X射线衍射仪、扫描电子显微镜、椭圆偏振仪、X射线光电子能谱仪、1064 nm弱吸收测试仪、1064 nm激光1-on-1损伤测试系统等,对HfO_2薄膜的结构、光学性能、化学组分、吸收性能、抗激光损伤特性和损伤形貌等进行了表征和分析。当沉积温度为200℃时,所制备的HfO_2薄膜为单斜多晶结构,晶粒尺寸约为10 nm。随着氧分压升高,薄膜的氧化程度随之增大,由化学计量比缺陷主导的薄膜1064 nm弱吸收系数变小,同时薄膜结构变得疏松,折射率随之降低。深入研究后发现,在采用反应电子束蒸发技术制备HfO_2薄膜时,提高氧分压有助于抑制膜内纳米吸收缺陷和基底亚表面裂纹,提高HfO_2薄膜抗1064 nm激光损伤阈值,对制备出基于HfO_2薄膜的高性能光学元器件具有重要的参考价值。     

热处理温度对ZrO2薄膜表面形貌和结构的影响

采用溶胶-凝胶法,在302不锈钢表面制备了经不同温度热处理的ZrO2薄膜。通过原子力显微镜(AFM)、X射线衍射仪(XRD)和傅里叶变换红外光谱仪(FTIR),研究了热处理温度对ZrO2薄膜表面形貌和相结构的影响。研究结果表明:室温下ZrO2结构呈非晶态,随着温度升高,晶体结构逐渐由四方相(t-ZrO2)向单斜相(m-ZrO2)转变;当热处理温度从400℃升高到600℃时,薄膜表面ZrO2晶粒尺寸由40 nm逐渐增大到70.1 nm,表面粗糙度也由3.34 nm缓慢增大到5.3 nm;而当热处理温度为700℃时,ZrO2晶粒明显增大(109 nm),表面粗糙度迅速增大到33 nm;红外吸收谱显示,随着热处理温度的升高,非晶态ZrO2(648与460.9 cm-1)逐渐向480.2和574.7 cm-1处的t-ZrO2结构以及424.3和732.8 cm-1处的m-ZrO2结构转变,与XRD结果一致。     

TaN-TiN binary alloys and superlattices as diffusion barriers for copper interconnects

Binary alloys and superlattices of TaN-TiN thin films were grown on Si(100) substrates with a TiN buffer layer using pulsed laser deposition. A special target assembly was used to manipulate the concentrations of these binary component films. The 60% TaN resulted in a TaN (3 nm)/TiN (2 nm) superlattice, while 30% and 70% TaN generated uniform Ta_xTi_1−xN alloys. X-ray diffraction (XRD), transmission electron microscopy (TEM), and scanning transmission electron microscopy (STEM) confirmed the single-crystalline nature of these films. Four-point probe resistivity measurements suggest that these alloy and superlattice films have a lower resistivity than pure single-crystalline TaN films. The Cu-diffusion characteristic studies showed that these materials would have the potential as high-temperature diffusion barriers for Cu in ultra-large-scale integration technology.     

低功率密度激光合成金刚石的相变机制

为了延长激光法合成纳米金刚石的有效作用时间从而提高合成效率,提出采用功率密度低、脉宽长的毫秒脉冲激光照射循环水介质中石墨颗粒合成纳米金刚石的新工艺。高分辨透射电镜(HRTEM)及X射线衍射(XRD)分析结果表明,产物中含大量具有球形单晶体结构或五重孪晶结构的金刚石颗粒(平均颗粒尺寸约为5 nm)。通过对纳米金刚石微观组织结构的分析以及理论计算测算出低功率密度(106W.cm-2)毫秒脉冲激光照射时石墨颗粒表面可达到最高温度5300 K,认为该功率密度毫秒脉冲激光照射石墨颗粒时,不能产生碳等离子体,只能使石墨颗粒熔融,得到液态碳。因此生成纳米金刚石的相变机制为:激光脉冲开始时,石墨颗粒吸收激光能量快速升温并达到熔融状态,激光脉冲过后,碳液滴迅速冷却,金刚石形核并长大得到纳米晶。     

GaN/metal/Si heterostructure fabricated by metal bonding and laser lift-off

A process methodology has been adopted to transfer GaN thin films grown on sapphire substrates to Si substrates using metal bonding and laser lift-off techniques. After bonding, a single KrF (248 nm) excimer laser pulse was directed through the transparent sapphire substrates followed by low-temperature heat treatment to remove the substrates. The influence of bonding temperature and energy density of the excimer laser on the structure and optical properties of GaN films were investigated systemically. Atomic force microscopy, X-ray diffraction and photolumi-nescence measurements showed that (1) the quality of the GaN film was higher at a lower bonding temperature and lower energy density; (2) the threshold of the energy density of the excimer laser lift-off GaN was 300 mJ/cm~2. The root-mean-square roughness of the transferred GaN surface was about 50 nm at a bonding temperature of 400 ℃.     

Preparation of erbium ion-doped TiO2 films and the study of their photocatalytic activity under simulated solar light

A series of erbium ion-doped TiO₂ (Er³⁺-TiO₂) films were prepared by a sol-gel dip/spin coating method, and the effect of the dosage of erbium ion (0-2.0 mol%), the films coating layers (1-5 layers), and calcination temperature (400-700℃) on the film structure and photocatalytic activity were investigated in detail. The films were characterized by means of X-ray diffraction (XRD), scanning electron microscopy (SEM), thermal analysis (TG-DTG) and UV-Vis diffusive reflectance spectra (DRS). The results showed that the films were composed of anatase, and no other TiO₂ phases (rutile and brookite). With the increase of the erbium ion dosage, the crystal size decreased. Erbium ion doping could enhance the thermal stability of TiO₂ and inhibit the increase of the crystallite size. Meanwhile doping of erbium ions gave rise to three typical absorption peaks within the range of visible light (400-700 nm), locating at 490, 523, and 654 nm, attributed to the transition of 4f electrons. The higher calcination temperature led to higher crystallinity and bigger crystal grains. The photocatalytic performance of the films was evaluated by degradation of methyl orange solution under simulated solar light. The highest quality film we prepared was with 4 layers, 1.0 mol% dosage of erbium ion, and the calcination temperature of 500℃. With this film, the degradation percentage of 7.8 mg/L methyl orange solution was up to 53.3% under simulated solar light after 6 h photoreaction.     

Leakage current mechanisms of ultrathin high-κEr_2O_3 gate dielectric film

A series of high dielectric material Er_2O_3 thin films with different thicknesses were deposited on p-type Si (100) substrate by pulse laser deposition at different temperatures. Phase structures of the films were determined by means of X-ray diffraction (XRD) and high resolution transmission electron microscopy (HRTEM). Leakage current density was measured with an HP4142B semiconductor parameter analyzer. The XRD and HRTEM results reveal that Er_2O_3 thin films deposited below 400 ℃ are amorphous, while films deposited from 400 to 840 ℃ are well crystallized with (111)-preferential crystallographic orientation. I-V curves show that, for ultrathin crystalline Er_2O_3 films, the leakage current density increases by almost one order of magnitude from 6.20 × 10~(-5) to 6.56×10~(-4) A/cm~2, when the film thickness decreases by only 1.9 nm from 5.7 to 3.8 nm. However the leakage current density of ultrathin amorphous Er_2O_3 films with a thickness of 3.8 nm is only 1.73×10~(-5) A/cm~2. Finally, analysis of leakage current density showed that leakage of ultrathin Er_2O_3 films at high field is mainly caused by Fowler-Nordheim tunneling, and the large leakage of ultrathin crystalline Er_2O_3 films could arise from impurity defects at the grain boundary.     

Deposition and characterization of molybdenum thin films using dc-plasma magnetron sputtering

Molebdenum (Mo) thin films were deposited on well-cleaned soda-lime glass substrates using DC-plasma magnetron sputtering. In the design of experiment deposition was optimized for maximum beneficial characteristics by monitoring effect of process variables such as deposition power (100–200 W). Their electrical, structural and morphological properties were analyzed to study the effect of these variables. The electrical resistivity of Mo thin films could be reduced by increasing deposition power. Within the range of analyzed deposition power, Mo thin films showed a mono crystalline nature and the crystallites were found to have an orientation along [110] direction. The surface morphology of thin films showed that a highly dense micro structure has been obtained. The surface roughness of films increased with deposition power. The adhesion of Mo thin films could be improved by increasing the deposition power. Atomic force microscopy was used for the topographical study of the films and to determine the roughness of the films. X-ray diffractrometer and scanning electron microscopy analysis were used to investigate the crystallinity and surface morphology of the films. Hall effect measurement system was used to find resistivity, carrier mobility and carrier density of deposited films. The adhesion test was performed using scotch hatch tape adhesion test. Mo thin films prepared at deposition power of 200 W, substrate temperature of 23°C and Ar pressure of 0.0123 mbar exhibited a mono crystalline structure with an orientation along (110) direction, thickness of ～550 nm and electrical resistivity value of 0.57 × 10^?4 Ω cm.     

热丝化学气相沉积法低温制备纳米晶态碳化硅薄膜

采用热丝化学气相沉积(HFCVD)技术以甲烷(CH4)和硅烷(SiH4)作为源反应气体在Si(111)衬底上合成了纳米晶态SiC薄膜。通过X射线衍射(XRD)、扫描电镜(SEM)、高分辨透射电镜(HRTEM)以及光致发光(PL)检测技术对薄膜的晶体结构、表面形貌和PL特性进行了分析和表征。结果表明，在较低的衬底温度下所沉积的薄膜是由镶嵌于非晶SiC网络中的晶态纳米SiC构成。纳米晶粒平均尺寸约为6nm。室温下用HeCr激光激发样品，观到薄膜发出波长位于400～550nm范围内可见光辐射。     

激光能量密度对原位生成纳米石墨的影响

研究了直径尺度为50 m的片状石墨,在不同激光能量密度的辐照下,原位生成纳米粒状石墨的微观结构及形貌,初步探讨了激光辐照参数与微米石墨原位生成纳米石墨之间的规律。采用高分辨透射电镜（HRTEM）、扫描电子显微镜（SEM）和X射线衍射（XRD）对制备的纳米石墨的晶体结构及显微形貌进行了测试、分析。试验结果表明:在激光能量密度为5.00 kJ/cm2时,试样由微米片状石墨原位生成分散性较好的、平均粒径为245 nm的球状石墨;在激光能量密度提高到6.25 kJ/cm2时,样品原位生成双向生长的椭球状石墨,有团聚现象产生,平均粒径为240 nm;在激光能量密度达到12.50 kJ/cm2时,微米片状石墨转变成大量的球状石墨,平均粒径为61.5 nm;在激光能量密度继续增加到13.75 kJ/cm2时,产物呈现小颗粒附着在大颗粒上的现象,粒径范围为150~500 nm,平均粒径达280 nm。     

磁控溅射制作金红石——TiO_2

用磁控溅射方法制备了粒径大小为20nm的金红石———TiO2,用X射线(XRD)和扫描电镜(SEM)观察表面形貌,局部表观致密,颗粒大小均匀。