Tribological approaches to material removal rate during chemical mechanical polishing

In this study, the effect of the friction and wear of a polishing pad on the material removal rate of a silicon oxide wafer was investigated during chemical mechanical polishing (CMP) with ceria slurry. Further, the effect of surface properties of the polishing pad, such as surface roughness and hardness, on the variation in the material removal rate was examined. From a tribological viewpoint, the in-situ friction force was monitored during the CMP process, and wear of the polishing pad was controlled by different types of conditioners. After CMP, the pad surface roughness was measured by optical profiling and scanning electron microscopy. Experimental results showed that the material removal rate was almost linearly proportional to the friction force between the pad and the wafer surface, irrespective of the properties of the pad. Experiments on the dependency of the pad wear rate on the material removal rate showed that the material removal rate increased with a decrease in the pad wear rate. Experiments and pad characterization confirmed that such a correlation was attributed to the pad surface roughness and the friction force.     

锆元素诱导非球形磨粒对氧化锆陶瓷的化学机械抛光性能

目的为了提高氧化锆陶瓷手机背板的化学机械抛光(CMP)性能,合成新型非球形二氧化硅磨粒,并分析非球形二氧化硅磨粒在CMP过程中的作用机理。方法利用Zr⁴⁺阳离子对球形二氧化硅纳米颗粒间作用力进行调控,制备Zr⁴⁺与SiO₂的质量比分别为0、0.025、0.050、0.075、0.100的抛光磨粒;利用纳米粒度电位仪和电子扫描显微镜(SEM)分析抛光液胶体稳定性和磨粒形貌;采用表面粗糙度(Sa)和材料去除率(MRR)来分析磨粒的化学机械抛光性能;利用改装后的摩擦因数仪和X射线光电子能谱仪(XPS)揭示非球形二氧化硅对氧化锆陶瓷的作用机理。结果在锆元素相对含量(以质量分数计)为0.075%时,得到了分散性良好的非球形二氧化硅磨粒抛光液,相较于球形二氧化硅磨粒抛光液,MRR提升了40.5%,并得到了Sa为1.74 nm的光滑表面;XPS分析结果表明,在抛光过程中二氧化硅磨粒可与氧化锆发生固相化学反应,生成更易去除的ZrSiO₄。摩擦因数测量结果表明,非球形二氧化硅磨粒与陶瓷片的摩擦因数从球形磨粒时的0.276提高到0.341。结论非球形的二氧化硅磨粒在抛光过程中具有更高的摩擦因数和化学机械协同作用,能高效地去除表面粗糙峰,并获得粗糙度为纳米级的平整表面,实现对氧化锆陶瓷手机背板的高效、高精度抛光。     

磨料水射流抛光不锈钢工件表面质量的研究

阐述了3740龙门式数控水切割机床的系统构成及工作原理。通过牌号为0Cr18Ni9Si的不锈钢抛光实验,结合测量表面粗糙度值、摩擦系数变化、三维形貌图,分析了工艺参数对抛光区域表面质量的影响。根据不同材料的自身特性合理选择工艺参数,为异形曲面的冷态抛光加工提供指导。     

基于响应面法的钛合金Halbach阵列增强磁流变抛光工艺参数优化

目的 提高钛合金磁流变抛光的表面质量和抛光效率。方法 用Halbach磁场阵列强化磁场,通过载液盘与磁铁反向旋转来增强磁流变抛光效率,使抛光头拥有更强的恢复性与自锐性。通过仿真模拟和实际测量对比研究Halbach阵列与N-S阵列的磁场分布和磁场梯度。依照试验结果描述抛光剪切力、表面粗糙度与表面微观形貌随时间的变化规律。采用响应面法优化载液盘转速、磁铁转速和加工间距等3个工艺参数,建立剪切力和表面粗糙度的拟合方程数学预测模型,并对其中的不显著项进行优化。结果 在响应面交互作用分析中,工艺参数对剪切力的影响的大小顺序为加工间距、磁铁转速、载液盘转速;对表面粗糙度影响的大小顺序为载液盘转速、磁铁转速、加工间距。根据不同的需求,确定选定范围内的工艺参数组合,需要快速去除材料时,使剪切力趋于最大值的工艺参数组合为载液盘转速227 r/min,磁铁转速64 r/min,加工间距0.1 mm,通过20 min抛光后得到了表面粗糙度Sa为34.911 nm的光滑表面。抛光过程中,钛合金抛光所受剪切力τ为0.812 N。需要最优表面质量时,使表面粗糙度值趋于最小值的工艺参数组合为载液盘转速300 r/min,磁铁转速150 r/min,加工间距0.1 mm,通过20 min抛光后得到了表面粗糙度Sa为26.723 nm的光滑表面。抛光过程中,钛合金抛光所受剪切力τ为0.796 N。结论 Halbach阵列拥有较高的磁场强度和富有空间变化的磁感线,能够使磁流变液中的磁链呈现出更多的姿态变化。根据响应面法优化后的剪切力和表面粗糙度预测模型,预测结果与验证试验结果相差很小,预测模型的准确度与可信度较高。     

18CrNiMo7-6钢研抛工艺试验研究

探究研抛工艺参数对工件材料去除率和表面粗糙度的影响。以砂纸和金刚石喷雾抛光剂为研抛介质,通过正交试验研究砂纸细度、研抛压力、研抛速度、研抛时间对18CrNiMo7-6工件材料去除率和表面粗糙度的影响。采用三维形貌仪、千分尺、电子天平和超景深显微镜对18CrNiMo7-6工件的表面粗糙度、厚度、质量和表面形貌进行测量分析,以材料去除率和表面粗糙度为评价指标,得到最佳的研抛工艺参数组合。在最佳工艺参数组合下,砂纸研磨工件的材料去除率为0.86μm/min,表面粗糙度为Ra0.048μm,金刚石抛光剂抛光后工件表面粗糙度为Ra0.024μm。砂纸研磨最佳工艺参数为:砂纸细度800#,研磨压力0.2MPa,研磨速度30rpm,研磨时间30min。抛光最佳工艺参数为:抛光压力0.2MPa,抛光速度30rpm,抛光时间15min。     

基于响应曲面法的304不锈钢化学机械抛光工艺参数优化

采用响应曲面法,以材料去除率R_MRR和表面粗糙度R_a为评价指标,研究抛光过程中抛光盘转速、压力、时间等3种参数对R_MRR和R_a的影响。根据抛光试验结果,建立材料去除率和表面粗糙度的回归模型,得出其响应曲面和等高线图,并进行详细分析。结果表明:回归模型较显著,证明了响应曲面法预测及优化304不锈钢化学机械抛光工艺参数的可行性及可靠性;据此得出R_a和R_MRR优化后的最佳工艺参数;R_a和R_MRR的试验值与预测值比较,相对误差在±10%以内,表明响应曲面得到的模型精度高,可用于化学机械抛光工艺参数优化与结果预测。      

不锈钢基板表面粗糙度对水膜吸附夹持的影响

目的从水膜吸附的功能研究出发,对不锈钢基板表面进行不同粗糙度处理,并测量不同基板对蓝宝石晶片的吸附力以及切向摩擦力的影响,从而得出粗糙度对水膜吸附效果的影响规律。方法通过砂纸打磨、研磨、抛光等方法,得到不同平均粗糙度(Sa=633.4、332.6、116.2、64.5、41.4nm)的不锈钢基板。利用接触角计对液滴在基板表面形成的静态接触角进行拍摄,得出不同粗糙度不锈钢表面的润湿性能。开发设计高精度的多维力测量平台,测量蓝宝石晶片在不同粗糙度不锈钢基板上润湿后的吸附力和切向摩擦力,并与未润湿的基板得到的测量结果进行对比研究,得出粗糙度对吸附力和摩擦系数的影响规律。结果5种粗糙度的不锈钢基板的静态接触角均小于90°,属于亲水性材料。水膜吸附条件下,吸附力大小随粗糙度的增加而减小;接触角大小随粗糙度的增加而增大,且吸附力的减小率和接触角的增大率趋势相似;摩擦系数随粗糙度的增大而增大。基板表面粗糙度较大时,水膜提供一定的粘滞力,使水膜吸附条件下比无水膜时的切向摩擦力更大;当粗糙度较小时,水膜更多的是润滑作用,此时比无水膜时的切向摩擦力要小得多。结论基板表面粗糙度较小时,基板能提供较大的吸附力,而摩擦力不如无水膜时的大;基板粗糙度较大时,吸附力相对较弱,但是摩擦力比无水膜的更大。在选择不锈钢基板作为水膜吸附夹持基板时,在保证足够吸附力的条件下,可以适当提高基板的表面粗糙度,抵抗晶片抛光过程中受到抛光垫的摩擦力。     

Fundamental performance of Magnetic Compound Fluid (MCF) wheel in ultra-fine surface finishing of optical glass

This study investigates a new semi-fixed-abrasive, ultra-fine finishing method for optical glass using a magneticcompound fluid (MCF) wheel. This MCF wheel generates a thin, uniform MCF slurry layer on the entire circumferentialsurface of a ring-shaped permanent magnet placed between two non-magnetic plates. The MCF slurry is composed ofnano-sized magnetite particles, micron-sized iron particles, several 10 μm-sized α-cellulose fibres and sub-micron-sizedabrasive particles that react to the magnetic field. Following modifications to the design of the MCF, experiments wereconducted to evaluate the performance of the modified wheel in spot-polishing fused silica glass. This paper describes themodifications to the MCF wheel and the experimental setup used to measure its performance. The improvement of themodified wheel over the unmodified wheel in terms of material removal and surfaces roughness is experimentallyconfirmed. The effects of the wheel rotational speed and the clearance between the wheel and the workpiece on materialremoval and the workpiece surface roughness are investigated. The polishing forces are measured, the structure of the MCFslurry is examined and the magnetic field distribution is analysed. A model of material removal in polishing with themodified MCF wheel is developed. The results indicate the following: (1) more material was removed, i.e., greater spotdepths, and better surfaces were obtained in the regions that were near the edges of the magnet; (2) the modified MCF wheelperformed much better than the unmodified wheel in terms of material removal and surface roughness, e.g., 3.1 μm vs. 1.7μm for the maximum spot depth, 0.04 mm3 vs. 0.0088 mm3 for the volume of material removed and Ra = 5.624 nm vs.14.67 nm for the surface roughness; (3) a better work surface and greater material removal were obtained with smallerworking clearances and higher wheel rotational speeds.     

单晶蓝宝石衬底晶片的化学机械抛光工艺研究

目的设计单晶蓝宝石衬底化学机械抛光的合理方案,探究主要抛光工艺参数对抛光衬底的表面质量和材料去除率的影响,并得到一组材料去除率高且表面质量满足要求的抛光工艺参数。方法借助原子力显微镜和精密天平分别对衬底表面形貌和材料去除率进行分析,采用单因素实验法探究了抛光粒子、抛光时间、抛光压力和抛光盘转速对蓝宝石衬底化学机械抛光的表面质量和材料去除率的影响,并设计合理的交互正交优化实验寻求一组较优的抛光工艺参数。结果在蓝宝石衬底化学机械精抛过程中,在抛光时间为0.5 h、抛光压力为45.09 k Pa、抛光盘转速为50 r/min、SiO_2抛光液粒子质量分数为15%、抛光液流量为60 m L/min的条件下,蓝宝石衬底材料的去除率达41.89 nm/min,表面粗糙度降低至0.342 nm,衬底表面台阶结构清晰,满足后续外延工序的要求。结论采用化学机械抛光技术和优化的工艺参数,可同时获得较高的材料去除率和高质量的蓝宝石衬底表面。     

偏置量对固结磨料小工具头抛光面形收敛效率的影响

目的 解决自由曲面磨抛面形收敛困难的问题,提高抛光小工具头的抛光效率.方法 提出一种偏置式固结磨料小工具头,基于固结磨料小工具头的结构特征参数,建立抛光小工具头的去除函数理论模型,并进行仿真分析,应用定点抛光法建立抛光小工具头去除函数实验模型,并验证抛光小工具头理论去除函数合理性,基于CCOS技术原理建立工件表面定量去除模型,通过虚拟加工实验探索偏置量对固结磨料小工具头抛光钛合金后的面形收敛效率的影响.结果 归一化理论去除函数曲线与实验曲线吻合度较高,定点抛光去除函数仿真模型能够很好地预测定点抛光斑的去除轮廓形状.抛光小工具头抛光钛合金的面形误差随偏置量增加,呈现先减小、后增大的趋势,无偏置的抛光小工具头抛光后,面形数据均方根(RMS)收敛效率为54.56％,波峰值与谷峰值之差(PV)的收敛效率为60.21％,当抛光小工具头偏置量为1.5 mm时,抛光后的RMS收敛效率达到最高,为73.83％,PV收敛效率为69.68％.结论 固结磨料小工具头去除函数理论模型可指导确定性材料去除,偏置量为1.5 mm时的抛光小工具头具有最强的修正误差能力,可以显著提高固结磨料小工具头抛光工艺的面形收敛效率.     

刀片表面粗糙度对工件表面残余应力分布影响的分析

目的探究硬质合金刀片表面粗糙度对加工工件表面残余应力分布的影响。方法首先通过Advant Edge FEM软件建立斜角三维切削模型,得出刀-屑间的摩擦模型。然后采用化学机械抛光方法对硬质合金刀片表面进行预处理,制备不同表面粗糙度的硬质合金刀片,通过对不同表面粗糙度的刀片进行四因素四水平的正交切削实验获得切削力,结合切削力的实验结果及刀-屑之间的摩擦模型,获得刀-屑间的摩擦系数,基于Advant Edge FEM对切削残余应力进行模拟仿真。最后,结合实验对仿真模型的合理性进行验证。结果采用表面粗糙度为0.02、0.04、0.08、0.2μm的硬质合金刀片切削45钢时,工件表面的最大残余应力分别为621.51、655.46、654.69、687.29 MPa。采用表面粗糙度为0.02μm的硬质合金刀片切削与采用表面粗糙度为0.2μm的硬质合金刀片切削相比,工件表面的最大残余应力减小了10.58%。结论硬质合金刀片的表面粗糙度越小,切削工件表面的残余应力越小。     

蓝宝石光学曲面柱形宽缎带磁流变抛光仿真分析及实验研究

目的 针对目前光滑无损伤光学曲面蓝宝石加工成本高、效率低的问题,对加工过程中磁流变抛光缎带进行流体仿真,进而优化抛光轮表面结构。方法 设计并提出3种表面结构柱形宽缎带磁流变抛光轮,介绍了磁流变抛光轮加工的基本原理,建立了磁流变抛光垫Bingham流体特性加工仿真模型,分析了3种抛光轮表面结构对工件表面磁通密度模、流场流速、流场压力分布的影响。同时对3种抛光轮的抛光效果进行了实验探究,探究了抛光轮表面结构对材料去除率和抛光后表面粗糙度的影响规律。结果 仿真结果表明,抛光轮表面槽型结构具有能增强磁通密度模、增大流体流速和流体压力的特性。实验结果表明,螺旋槽抛光轮的抛光效果最好,在螺旋抛光轮作用下,材料去除率为0.22 mg/h,抛光后蓝宝石表面粗糙度为1.08 nm。最终抛光轮近壁区总压力和速度的乘积结果与抛光轮实验去除率结果具有较好的一致性。结论 槽型结构可以提高抛光液在抛光轮表面的固着效果,影响工件表面流场运动状态,增强工件表面受到抛光垫的作用力。相较于光滑和横条槽抛光轮,螺旋槽抛光轮的抛光效率最高,表面粗糙度最低,可有效提高抛光效果。     

游离和固结金刚石磨料抛光手机面板玻璃的试验研究

选取不同粒径的金刚石微粉,采用游离磨料和固结磨料两种抛光方法加工手机面板玻璃,比较其材料去除率和抛光后工件表面粗糙度。结果表明：在相同的抛光工艺参数下,磨粒粒径在游离磨料抛光中对材料去除率和抛光后表面质量作用显著,而在固结磨料抛光中作用不显著;采用金刚石固结磨料抛光垫抛光能获得表面粗糙度约为Ra1.5 nm的良好表面质量,并在抛光过程中较好地实现了自修整功能。     

Investigation into electrorheological fluid-assisted polishing

Electrorheological fluid (ER fluid) is a functional fluid with the property that its viscosity can vary with the applied electric field strength. This paper investigates a polishing method using the electrorheological fluid, known as ER fluid-assisted polishing, for the finishing of micro dies of tungsten carbide alloy, which are used for the mass production of micro aspheric glass lens. The machining principle of the ER fluid-assisted polishing is introduced. By proper design of experiments based on a Taguchi orthogonal array and by multi-variable linear regression, empirical models are developed for evaluation of the effect of the process parameters on the material removal depth and surface roughness obtained in the ER fluid-assisted polishing. Further experiments are conducted to confirm the validity of the developed statistical model by comparing the model predictions with the experimental results and meanwhile the influences of the process parameters on the polishing performance are revealed.     

Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad

This paper addresses the problem of material removal in free abrasive polishing (FAP) with the sub-aperture pad both theoretically and experimentally. The effects of some polishing conditions upon the material removal are analyzed, including not only the process parameters, which refer to the normal force, angular spindle velocity and angular feed rate, but also the abrasive grain size, polishing slurry properties, topographical parameters of the sub-aperture pad, as well as tool path curvature. Based on the analysis, a model of material removal profile is proposed to facilitate more accurate polishing. First, by analyzing the contact among polishing pad, abrasive grain and workpiece surface in the micro level, the removal depth per unit length of the polishing path is derived, which is defined as the material removal index. Then, the distribution of this removal index can be obtained via modeling the pressure and relative sliding velocity in the contact region of polishing pad and workpiece. After that, the material removal profile can be calculated by integrating the material removal index along the tool path in the tool-workpiece contact region. To verify the effectiveness of the proposed model, a series of polishing experiments have been conducted. Experimental results well demonstrate that our model can accurately predict the material removal depth during the FAP.     

基于响应面法的单晶硅CMP抛光工艺参数优化

为提高单晶硅化学机械抛光(chemical mechanical polishing,CMP)的表面质量和抛光速度,通过响应面法优化CMP抛光压力、抛光盘转速和抛光液流量3个工艺参数,结果表明抛光压力、抛光盘转速、抛光液流量对材料去除率和抛光后表面粗糙度的影响依次减小。通过数学模型和试验验证获得最优的工艺参数为:抛光压力,48.3 kPa;抛光盘转速,70 r/min;抛光液流量,65 mL/min。在此工艺下,单晶硅CMP的材料去除率为1 058.2 nm/min,表面粗糙度为0.771 nm,其抛光速度和表面质量得到显著提高。      

应用弹性砂轮对铝合金镜面磨削工艺研究

目的解决铝合金手机外壳传统抛光工艺中存在的抛光效率低等问题。方法采用聚氨酯弹性砂轮对6061铝合金进行了磨削加工,使用正交试验研究了磨料粒度、进给速度、切削深度、砂轮线速度对加工表面粗糙度及材料去除率的影响。试验中使用折线走刀方式进行加工,可减轻磨料分布不均带来的影响。使用白光干涉仪测量了加工后表面的粗糙度,通过计算单位时间内工件的质量变化得出了去除率,并通过对结果的综合优化得出了最优工艺参数。结果在选取的16组磨削工艺参数中,可获得的最低表面粗糙度为44.87 nm,最大去除率为0.329 g/min。对表面粗糙度影响最大的因素为磨料粒度,影响最小的因素为进给速度;对材料去除率影响最大的因素为切削深度,影响最小的为进给速度。经过综合优化,最佳工艺参数组合为:砂轮600#,转速2000 r/min,切削深度0.04 mm,进给速度20 mm/min。结论弹性聚氨酯砂轮应用于铝合金磨削可提高加工表面质量,可简化工艺流程,节省备料和安装调整时间,从而提高效率。     

An integrated tool for five-axis electrorheological fluid-assisted polishing

A five-axis electrorheological fluid-assisted polishing equipment is presented for the finishing of curved surfaces in this paper. An integrated electrode tool is specially designed to make the abrasive particles in the electrorheological fluid concentrate around the tool end when the electric field is applied and it is suitable to polish not only the conductive material such as tungsten carbide but also the non-conductive material such as optical glass. The polishing experiments for curved surfaces of tungsten carbide and optical glass are conducted to confirm the validity and suitability of the developed five-axis equipment with the designed integrated electrode tool and to reveal the influence of the process parameters on the workpiece surface roughness in electrorheological fluid-assisted polishing.     

电解质等离子抛光在高碳微合金钢上的应用研究

目的提高金属针布产品(高碳微合金钢)的表面质量,降低针布产品的表面粗糙度值,有效提升产品的使用效果。方法采用电解质等离子抛光工艺在针布产品上展开工艺研究,探索了不同电解质浓度(无机盐质量分数)、不同生产速度和不同电解质等离子抛光单元组数对针布表面粗糙度的影响。利用非接触式粗糙度扫描仪测试粗糙度Ra,以此对针布表面的抛光质量进行表征。结果采用电解质等离子抛光工艺可以实现钢铁材料的表面抛光,抛光后不仅有效地去除了针布表面的氧化皮,并且表面平整且达到镜面效果。最佳工艺参数(电解质无机盐质量分数2.75%,走线速度40 m/min,电解质等离子抛光单元4组)下,表面粗糙度Ra值达到了0.11μm。结论电解质等离子抛光工艺成功地应用于钢铁材料上,且实现了非接触式连续抛光工艺,既不损伤工件,又实现了表面的光亮平整,还具有环境友好、节能和生产效率高等特点。     

圆光栅玻璃的游离磨料研磨抛光加工工艺

用游离磨料对圆光栅玻璃表面进行了研磨抛光实验,讨论了磨粒尺寸、磨料质量分数、加工时间、研磨盘转速、加载压力、抛光垫材料对试件表面粗糙度和材料去除率的影响。研究表明,硬质抛光垫能更好地保持试件的平面度。获得的优化工艺参数组合为:研磨盘转速75r/min;磨料质量分数10%;研磨液流量10mL/min;5μm的Al2O3加载压力0.019MPa,粗研20min;1μm的Al2O3加载压力0.015MPa,精研20min;30nm的CeO2加载压力0.012MPa,精抛10min。在该工艺组合下,获得了表面粗糙度值Ra为3.3nm、平面度为5μm的圆光栅玻璃。