高介电常数玻璃纤维

据讯,日本开发了高介电常数玻璃纤维.这种玻璃纤维有利于使面向高频设备的印刷线路板实现小型化.对于这些便携式器件来说,印刷线路板的小型化是必要前提,因此需要采用介电常数高的覆铜层压板.用于这种覆铜板的树脂自然应是高介电常数树脂,同时作为基材的玻璃布也必须具有高介电常数.为此开发了介电常数高达11.6的非铅类钛硅酸盐玻璃纤维.     

氰酸酯树脂在高性能印刷电路板中的应用概况

综述了氰酸酯树脂及氰酸酯改性环氧树脂在高性能印刷电路板中的应用。论述了氰酸酯改性环氧树脂的机理与性能。以改性树脂基体制备的覆铜板介电性能明显得到提高，能满足高频使用的条件。     

高频传输用环氧基印刷电路基板的研究

以乙酰丙酮镧系过渡金属络合物为促进剂，用氰酸酯改性环氧树脂，得到一种高性能树脂。以该树脂为基体，E玻璃布为增强材料，通过层压成型制得一种高频传输用印刷电路板基板。本文对氰酸酯改性环氧树脂的反应机理及层压成型工艺进行了研究，并制得了一种具有优异力学性能、介电性能和阻燃性能的印刷电路板基板。     

阻燃树脂的研制

研究用于木材和印刷线路板防火的阻燃树脂，用三溴苯酚改性醛酚树脂，三聚氰胺改性酚醛树脂及松香改性树脂，将三者按一定的比例混合形成具有良好物理性能的阻燃树脂，同时也讨论了树脂各组分之间比例及其对混合树脂性能的影响。     

高频印刷电路基板用树脂及其改性研究进展

介绍了高频电路对印刷电路基板材料的特性参数(如介电常数、介质损耗因数、特性阻抗和玻璃转变温度等)的要求;综述了应用于高频电路基板的树脂基体及其改性体系的研究现状,指出了它们各自的特点和不足;展望了高频印刷电路基板用树脂及其改性的可能发展方向.     

国外塑料专利

<正>专利名称:热固树脂组合物及层间绝缘用树脂膜、复合膜、印刷线路板和半导体封装申请公布号:WO2019146797(A1)申请公布日:2019.08.01本发明提供了一种热固性树脂组合物,其可用作电子器件的复合膜,具有高玻璃化转变温度,对不均匀的电路具有优异的嵌入性,优异的介电特性以及低热膨胀,并且还具有良好的热处理性能。该热固性树脂组合物可用于层间绝缘的树脂膜、复合膜、印刷线路板和半导体封装。另外,该热固性树脂组合物包含     

5528氰酸酯树脂性能研究

对新型的5528改性氰酸酯树脂的介电性能、耐热性能、粘温特性和吸湿性能进行了研究,结果表明:5528氰酸酯树脂具有良好工艺性能,适合于湿法预浸和热熔预浸,介电性能优异,介电损耗正切值为0.005 26,远远低于纯氰酸酯固化物,而且对于频率的稳定性更好,适合宽频应用5。528氰酸酯树脂体系是适合高性能透波材料或高频印刷电路板应用的树脂基体。     

电子与胶粘剂工业高稳定专用松香树脂

利用我国丰富的松脂资源优势,将松香化学改性制成四类创新产品助焊剂用树脂、热熔断器用树脂、印刷线路板预涂剂用树脂和热熔胶粘剂用树脂,可以代替石油产品,适应我国电子和胶粘剂工业需要。     

高性能覆铜板用热固性树脂

介绍了高频高性能覆铜板对基材的性能要求,详细讨论了聚苯醚树脂、氰酸酯树脂及聚酰亚胺树脂的特性,并简要介绍了各种树脂基覆铜板的应用情况。通过分析认为:烯丙基化聚苯醚树脂(A PPE)是高频应用的理想材料,为高频高性能电路基板材料首选的树脂基体。     

离子交换法处理线路板生产废水的设计和工业应用

以工程实用为准则，报导了利用国产００１×７阳离子交换树脂吸附分离印刷线路板生产废水中的Ｃｕ＾２＋离子、Ｈ＾＋离子及铜氨络合阳离子的原理，设计和工业应用。     

Enhanced Particle Removal in Fluorinated Liquids—An Application in Nuclear Decontamination

An experimental cleaning system has been developed to demonstrate the decontamination of model electronic circuit boards by this cleaning process. The media used in this process are a wash solution of a high molecular weight fluorocarbon surfactant in a perfluorinated carrier liquid which results in enhanced particle removal, followed by a perfluorinated carrier liquid rinse. The perfluorinated liquids of interest, which are recycled in the process, are inert, nonflammable, generally safe to use, and do not present a hazard to the atmospheric ozone layer. The cleaning experiments were performed at the MIT Nuclear Reactor Laboratory. The radioactive particles removed from the circuit boards were captured by 0.22 μm filters with a filtration efficiency of 99.5% per stage. Compatibility tests were performed on these model electronic circuit boards. The results obtained show that neither the process fluids used nor the maximum level of the ultrasonic agitation applied harmed the circuit boards or the circuit components. All the circuit boards used in these tests were still functional after the cleaning experiments. A three log reduction in contamination was obtained in 1 hour. These data indicate that this process, once implemented on a large scale, will offer users in the nuclear industry a practical and cost effective means of decontaminating and recovering a wide variety of tools and instruments.     

Enhanced Particle Removal in Fluorinated Liquids—An Application in Nuclear Decontamination

An experimental cleaning system has been developed to demonstrate the decontamination of model electronic circuit boards by this cleaning process. The media used in this process are a wash solution of a high molecular weight fluorocarbon surfactant in a perfluorinated carrier liquid which results in enhanced particle removal, followed by a perfluorinated carrier liquid rinse. The perfluorinated liquids of interest, which are recycled in the process, are inert, nonflammable, generally safe to use, and do not present a hazard to the atmospheric ozone layer. The cleaning experiments were performed at the MIT Nuclear Reactor Laboratory. The radioactive particles removed from the circuit boards were captured by 0.22 μm filters with a filtration efficiency of 99.5% per stage. Compatibility tests were performed on these model electronic circuit boards. The results obtained show that neither the process fluids used nor the maximum level of the ultrasonic agitation applied harmed the circuit boards or the circuit components. All the circuit boards used in these tests were still functional after the cleaning experiments. A three log reduction in contamination was obtained in 1 hour. These data indicate that this process, once implemented on a large scale, will offer users in the nuclear industry a practical and cost effective means of decontaminating and recovering a wide variety of tools and instruments.     

热固性聚苯醚树脂在高频印制电路板上的应用

介绍了高频印制电路板基材的介电性能要求和热固性聚苯醚树脂基材的制备 ,详细讨论了制备热固性聚苯醚树脂的两条技术路线及其树脂体系的特性 ,以及热固性聚苯醚树脂基覆铜板的特性 ,并简要介绍了热固性聚苯醚树脂基覆铜板的应用情况。     

Amine functionalized SBA-15/terpolyimide composites with low dielectric constant

Journal of Porous Materials - Polyimides with low dielectric constants are important raw materials for the fabrication of flexible printed circuit boards and other microelectronic applications. As...     

晶须改性聚合物的研究概况

综述了晶须的种类以及晶须对不同聚合物的改性。晶须改性可以使材料的力学性能、加工性能、电性能、耐磨损性、耐热性等得到提高。晶须改性聚合物已经在印刷电路板、宇航结构部件、光学传感件、声学零件、耐磨材料、家用产品等方面得到应用。     

纳米铜导电墨水在电子印刷线路板制备中的应用进展

近年来,随着电子行业的发展,人们更多开始关注纳米材料在电子印刷电路板（printed circuit board,PCB）中的应用,新型、高效、经济、环保的技术方法逐渐替代传统制造工艺。本文综述了不同种纳米材料导电墨水的制备方法和新型印制电路板制备技术的发展,通过对比不同反应物、添加剂以及不同方法对最终生成的纳米铜导电墨水性能的影响,针对性介绍了适应于不同要求的纳米材料制备工艺技术。此外,介绍了不同的烧结工艺和打印工艺对最终生成PCB线路的影响。相对于传统的覆铜板刻蚀电路技术污染大、材料浪费、工艺复杂等缺点,新工艺结合纳米材料性能,利用高精度设备,着重向低成本、少污染、时间短、能耗低的方向进行一系列研究,文章还讨论了未来PCB行业在5G的应用发展方向和可能遇到的机遇和挑战。     

Dielectric properties of highly filled thermoplastics for printed circuit boards

In this study, highly filled high‐temperature thermoplastics (polyethersulfone [PES], polyphenylensulfide, polyetherimide [PEI], and polyetheretherketone [PEEK]) are used as insulating substrate for printed circuit boards (PCBs). Talc has been added to the thermoplastics to adjust their coefficient of thermal expansion (CTE) to the CTE of the copper circuits, thus reducing the possibility of failure of the PCB owing to thermal stress. The dielectric properties of the substrates were analyzed between 10 MHz and 1 GHz, depending on filler fraction and water absorption. An increase of filler fraction resulted in an increase of dielectric constant ε′. As expected, the absorption of water molecules led to an increase of both tan δ and ε′. Moreover, the combination of filler and absorbed water resulted in a strong increase of the dielectric loss factor at low frequencies. Finally, theoretical approaches with fitting parameters could be employed to precisely describe the measured properties between 0.8 and 1 GHz. This study shows that most of the materials investigated here, namely highly filled PPS, PEI, and PEEK, are suitable for high‐frequency PCB applications. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Via-filling using electroplating for build-up PCBs

The requirement of miniaturization of printed circuit boards has been increased with downsizing of electronic devices. However, the conventional multi-layered printed circuit boards are now facing the limitation for high mounting densities. Therefore, a newly developed build-up process has emerged as a new multi-layered printed circuit board manufacturing process. This new technology has adopted the micro-vias for connection between each conductive layer. If the micro-vias can be filled with copper metal, signal propagation is enhanced by via-on-via connection. Therefore, effective circuitry can be achieved. However, filling the conductive layer with the micro-vias is becoming difficult using the conventional plating process or the electrical conductive paste. Filling of the micro-vias by electroplating is studied. It was confirmed that copper sulfate concentration in copper sulfate plating bath is one of the key factors to fill the micro-vias, and the vias can be filled using a high copper concentration bath.     

废印刷线路板回收处理技术研究

全面详实的介绍了废印刷线路板的污染现状、对人体及环境的危害。总结了废印刷线路板脱漆、拆解、破碎及各种传统和新型的回收处理技术。文章为回收利用废印刷线路板提供了广阔的思路。需要利用各种技术,互相结合,才能最终实现废印刷线路板的资源化处理。