珍珠镍电镀工艺优化及镀层性能分析

采用正交试验方法研究了珍珠镍电镀液配方与工艺参数,获得了最佳的镀液组成和工艺条件:NiSO4_·6H_2O 400 g/L,NiCl_2·6H2O 35 g/L,H_38O_3 40 g/L,柔软剂BSI 24.0 mL/L,润湿剂MA-80 1.0 mL/L,沙剂TB 5.6 mL/L,稳定剂PVA-124 2.4 mL/L,温度55℃,pH 4.0,阴极移动速率4次/s,阴极电流密度6 Adm~2,电镀时间5 min。采用扫描电镜、x射线荧光测厚仪、显微硬度计、中性盐雾试验等方法测试了优化条件下所得镀层的性能,并与现有的HN-80工艺进行了对比。研究开发的珍珠镍电镀工艺起沙快,电流密度范围宽,所得镀层外观为银白色,沙感强,镀层凹坑直径在3~10μm之间,但其硬度和耐蚀性能低于HN-80工艺所得镀层。     

羧基配位剂对电镀镍–磷合金的影响

以羧基类物质作配位剂,在A3钢板表面电沉积制备Ni–P合金镀层。镀液基础组成和工艺参数为:NiSO4·6H2O 240 g/L,NiCl2·6H2O 45 g/L,NaH2PO2·H2O 50 g/L,H3BO3 35 g/L,NaF30 g/L,pH 2.0,温度70°C,电流密度2.5 A/dm2,时间20 min。研究了镀液中羧基配位剂含量对Ni–P镀层沉积速率和耐蚀性的影响。结果表明,随羧基配位剂含量增大,沉积速率减小,镀层耐蚀性先改善后变差。其适宜含量为20~30 g/L。羧基配位剂含量为25 g/L时,镀层外观光亮、结合力良好,耐蚀性和耐磨性优于未加配位剂的镀层。镀层的P含量为18.11%,属于高磷非晶态Ni–P镀层。羧基配位剂具有细化镀层晶粒的作用,使镀层表面更为平整、致密。     

印制线路板化学镀镍钯磷合金

在印制线路板上化学镀镍钯磷合金,研究了主盐、配位剂和工艺参数对沉积速率及镀层中钯含量的影响,获得了较优镀液配方和工艺条件:Ni Cl2·6H2O 24 g/L,Pd Cl2 0.1 g/L,Na H2PO2·H2O 0.15 mol/L,三羟甲基氨基甲烷(Tris)0.05 mol/L,乙二胺20 m L/L,温度65~70°C,p H 8.5~9.0,时间20 min。采用扫描电子显微镜和能谱仪对镀层的形貌和组成进行了表征,通过结合力测试、中性盐雾试验和可焊性试验测试了镀层性能。所得镍钯磷合金镀层光亮、孔隙率低,具有良好的结合力和耐蚀性,能满足PCB制作中的可焊性要求。     

镍–二氧化锆复合电沉积工艺优化及其对钢表面的毛化效果

在钢试片上复合电沉积Ni–ZrO_2,使微米级的ZrO_2颗粒镶嵌在镍镀层中而形成具有一定粗糙度的表面。通过正交试验研究了NiSO_4·6H_2O、ZrO_2和十二烷基硫酸钠(SDS)添加量,电流密度和温度对Ni–ZrO_2复合镀层耐蚀性、显微硬度和粗糙度的影响。结果表明,电流密度对镀层耐蚀性的影响最大,温度对镀层粗糙度的影响最大。综合考虑Ni–ZrO_2复合镀层的显微硬度、耐蚀性和粗糙度3个指标,得到复合电沉积Ni–ZrO_2的最优工艺为:NiSO_4·6H_2O 280 g/L,NiC_(12)·6H_2O 30~60 g/L,H_3BO_3 30~40 g/L,ZrO_2 30 g/L,SDS 120 mg/L,1,4-丁炔二醇和糖精适量,电流密度3 A/dm2,温度45°C。在最优工艺条件下,Ni–ZrO_2复合镀层的耐蚀性最好,显微硬度为587.3 HV,粗糙度为14.327 4μm,比钢试片高一个数量级左右。     

无氰铜锡合金仿金电镀添加剂的研究

通过赫尔槽试验和方槽试验研究了添加剂H-3、DDS和JZ-1对焦磷酸盐溶液体系电镀仿金铜锡合金性能的影响。基础镀液组成为:K4P2O7·3H2O 240 g/L,Sn2P2O7 2.0 g/L,Cu2P2O7·3H2O 24 g/L,p H 8.7。结果表明,采用焦磷酸盐溶液体系电镀铜锡合金时,只有用到添加剂方可得到仿金镀层。添加剂H-3具有一定的整平、细化晶粒和提高光亮度的作用。H-3的用量为2.8 m L/L时,在黄铜基体上获得仿金镀层的阴极电流密度范围为0.29~2.25 A/cm2。焦磷酸盐溶液体系使用添加剂H-3时,在光亮酸铜、光亮镍、无氰白铜锡中间层上和直接在钢铁基体上进行仿金电镀时,均可获得光亮的仿金镀层。     

电流密度对电镀铜-镍合金微观结构和耐蚀性的影响

采用直流电沉积法在高锰铝青铜基体上制得Cu-Ni合金镀层,镀液组成和工艺条件为:CuSO4·5H2O 20 g/L,NiSO4·6H2O 84 g/L,C6H5O7Na3·2H2O 75 g/L,十二烷基硫酸钠0.5 g/L,H3BO320 g/L,电流密度15~30 mA/cm^2,pH 7,温度55℃,搅拌速率300 r/min,时间60 min。研究了电流密度对Cu-Ni合金镀层元素成分、微观形貌和耐蚀性的影响。结果表明,在电流密度30 mA/cm^2下所得到的Cu-Ni合金镀层最厚,为25μm,耐蚀性最好,经乙酸盐雾试验168 h后表面仅有几个微小的腐蚀坑。     

pH对脉冲电镀锌–镍–锰合金的影响

在Q235钢表面脉冲电镀Zn–Ni–Mn合金,镀液组成和工艺条件为:ZnSO_4·7H_2O 43.1 g/L,MnSO_4·H2_O 59.2 g/L,NiSO_4·6H_2O26.3 g/L,Na_3C_6H_5O_7·2H_2O 176.5 g/L,NH_4Cl 30 g/L,H_3BO_3 30 g/L,十二烷基硫酸钠(SDS)0.1 g/L,p H 4.5~6.0,温度30°C,平均电流密度30 m A/cm~2,脉冲占空比20%,脉冲周期1 ms,时间20 min。研究了pH对合金镀层元素组成、沉积速率、表面形貌和耐蚀性的影响。结果表明,随p H增大,沉积速率减小;镀层中锰含量升高,锌、镍含量降低;耐蚀性先增强后减弱。p H为5.0时,所得Zn–Ni–Mn合金镀层平整致密,Zn、Ni和Mn的质量分数分别为85.71%、5.03%和9.26%,中性盐雾试验96 h的保护等级为5级。与Zn–Ni合金镀层(Ni质量分数为12.88%)相比,Zn–Ni–Mn合金镀层的腐蚀电位正移了85 mV,腐蚀电流密度低了约2个数量级,耐蚀性更优。     

三价铬硫酸盐溶液快速镀装饰铬

采用赫尔槽试验和直流电解方法研究了三价铬硫酸盐溶液镀铬工艺.研究结果表明,三价铬硫酸盐溶液快速镀装饰铬的最佳镀液组成和工艺条件为:Cr3+15g/L,主配位剂(甲酸)10 mL/L,辅助配位剂15 g/L,Na2SO4 144g/L,K2SO4 50g/L,硼酸60g/L,润湿剂1 g/L,镀液温度35℃,pH 2.5,电流密度12A/dm2.采用这种镀液组成和工艺条件在光亮镍镀层上镀装饰铬,电镀2 min和3min获得的光亮铬镀层厚度分别为0.32 μm和0.49μm,平均镀速可达0.16 μm/min.镀液中的辅助配位剂使镀液的覆盖能力增加,但电镀一定时间后,镀层厚度和平均镀速减小.     

无氰电镀白铜锡工艺与镀层性能

通过赫尔槽试验与方槽试验研究了镀液组成和工艺条件对白铜锡电镀层外观与组成的影响。最佳镀液组成与工艺条件为:Cu2P2O7·3H2O16～19g/L,Sn2P2O712～15g/L,K4P2O7·3H2O200～250g/L,K2HPO460～80g/L,有机胺类添加剂JZ-11.2～1.8mL/L,pH=8.5～8.7,温度20～25°C,阴极电流密度1.0A/dm2。采用该工艺对基体施镀20min可得到厚度为5.09μm、锡的质量分数为40%～50%的均匀白亮的Cu-Sn合金镀层。Cu-Sn合金镀层的晶体结构以CuSn和Cu41Sn11为主,结晶细致、无微裂纹,显微硬度为372HV,耐蚀性能比相同厚度的光亮镍镀层好。     

6063铝合金化学镀镍–磷合金镀层的性能

以6063铝合金为基体进行化学镀Ni–P合金镀层,镀液组成和工艺条件为:NiSO4·6H2O 25~28 g/L,NaH2PO2·H2O 20~25 g/L,NH4HF2 20~23 g/L,CH3COONa·3H2O 15~20 g/L,C6H8O7 8 g/L,KIO3 0.1 g/L,温度(80±2)°C,pH 5.5~6.0,时间2 h。表征了Ni–P镀层的形貌、结构、结合力、孔隙率以及耐蚀性等性能。结果表明,Ni–P镀层表面致密,呈非晶态,厚度为15μm,显微硬度为476 HV,结合力良好,耐蚀性明显优于基体。     

乙苯,苯乙烯的生产及合成乙苯,苯乙烯催化剂的研究进展

苯乙烯是重要的石油化工原料。本文介绍了国内外苯乙烯生产的发展概况，合成乙苯，苯乙烯所用的催化剂种类，并就苯乙烯生产及催化剂的发展趋势提出了自己的观点。     

Synthesis and characterization of homopolymers and copolymers of various acrylates and acrylonitrile

Various homopolymers and copolymers of methyl acrylate, ethyl acrylate, butyl acrylate, and acrylonitrile in different feed ratios were synthesized. These were characterized by IR, ¹³C-NMR, DSC, DTA, and TGA. Spectroscopic characterization helped in differentiating copolymers of different mol ratios. Thermal analysis revealed different degradation patterns for homopolymers and copolymers. The temperature and energy changes associated with various phase transitions were dependent on the chemical composition of homo- and copolymers, as expected. © 1993 John Wiley & Sons, Inc.     

生物质气化及生物质与煤共气化技术的研发与应用

总结了生物质原料的特点及生物质单独气化的缺点;介绍了国内外生物质气化技术及生物质与煤共气化技术的研发与应用现状;分析了在此领域国内外的发展趋势与前景;概括了开展生物质与煤共气化技术研发的意义。     

责任和责任心的涵义与结构

责任是人应主动承担的角色义务和对其因过失所造成后果应承担的责罚.有两层涵义:一是义务;二是后果.责任心是个体自觉做好分内事务和履行道德义务的心理倾向,是个性心理品质成分中自我特征维度上的重要内容.责任心具有两个方面的涵义:一是角色分内职责;二是角色道德义务.责任心是一种通过责任认知、责任个性和责任适应的动态形式表现出来的静态品质,责任心是责任心过程结构与责任心关系结构相互制约、相互影响的统一体.     

二甲基二烯丙基氯化铵和丙烯酰胺的合成及应用

用复合引发体系(过硫酸盐-偶氮类引发剂)和脂肪胺类氧化还原体系引发,在实验室获得了单体转化率≥98%,特性粘数高于13.6 dL/g的阳离子共聚物PDA,探讨了控制聚合物分子量的影响因素.     

Comparison of the Adhesion and Cohesion of Triblock and Random Copolymers of Styrene and Butadiene

A substantially greater detachment energy is required to strip a polyethylene tereph-thalate (Mylar) film from a styrene-butadiene-styrene (SBS) triblock copolymer compared to that for peeling from a random styrene-butadiene (SBR) copolymer. This is true even though the intrinsic interaction between the Mylar and each elastomer is expected to be similar because of their virtually identical chemical composition. It is proposed that this difference in peel strength (between the SBS and SBR) is a consequence of the much higher dissipative capacity of the former elastomer. Another manifestation of this is the higher cohesive tear strength of the SBS compared to the SBR. Extents of energy dissipation within each elastomer during detachment of the Mylar adherend are consistent with the hypothesis that the average maximum stress experience before detachment is some similar fraction of each elastomer's tensile strength.     

钾盐资源及钾肥供需情况分析及预测

阐述了国内外钾盐资源及钾肥生产现状,对国内外钾盐的供需形势进行了分析及预测,从资源、原材料、国际市场三方面提出了解决我国钾盐短缺的措施。     

Electronic structures and reactivities of monometallic and bimetallic clusters of Au and Cu

The variation of the Au 4f binding energy of Au clusters with the cluster size has been established by measuring the binding energies of clusters whose size distributions were independently determined by HREM and STM. The binding energy increases significantly when the cluster size is less than 2 nm. Au-Cu bimetallic clusters of the composition Cu₃Au have been deposited for the first time on carbon substrates. The shifts in the core level binding energies of the bimetallic clusters show the effect of alloying in the case of large clusters, but show effects of both alloying and cluster size in the case of the small clusters. The interaction of CO with Cu₃Au clusters is stronger than with a bulk Cu metal. The interaction of CO with small Cu clusters also seems to be stronger than with bulk Cu or with large Cu clusters.     

Wetting properties of homopolymers and copolymers of pentafluorostyrene and methylacrylate and homopolymer blends

Polypentafluorostyrene (PPFS), polymethylacrylate (PMA), and poly(pentafluorostyrene-co-methylacrylate), poly(PFS-co-MA) were prepared and the wetting characteristics of polymer blends of PPFS and PMA were compared with that of poly(PFS-co-MA) via contact angle measurements. The critical surface tension of polypentafluorostyrene was found to be 22.6 dyne/cm, which is comparable to the value reported for polytrifluoroethylene (22 dyne/cm). The critical surface tension of poly(PFS-co-MA) is not linearly related to its composition. The polymer blends of PPFS and PMA exhibit significant surface enrichment of the fluoropolymer. The harmonic-mean method¹ was employed to determine surface tensions of these polymers and many known polymers. It is found that the method produces useful surface tension data provided the contact angle values are derived from testing liquids of dissimilar polarity.