一种新型灵敏放大器的设计

文章分析了基本锁存器型灵敏放大器结构,总结了其优缺点,在此基础上设计出一种高速低功耗的SRAM灵敏放大器,在输入差分信号建立之后,读出放大时间在最坏情况下需0.5ns。利用两级敏感放大器的层次式结构,一方面使第一级放大的信号成为真正的数字信号,另一方面增加了电路的驱动能力。     

SOI SRAM灵敏放大器中动态体放电技术研究

在SOI SRAM锁存器型灵敏放大器中,设计了一对小的下拉管,用来动态地释放交叉耦合反相器中N管上的体电荷。这种动态体放电的方法有效地解决了部分耗尽SOI CMOS器件体电位不匹配的问题,得到了可重复性低阈值电压,提高了SRAM的读取速度。     

高速低功耗电流型灵敏放大器的设计

提出了一款适合在低电压、大容量SRAM中应用的高速低功耗电流型灵敏放大器。该电路在交叉耦合反相器之间添加了一对隔离管,有效消除了大量位线寄生电容所带来的负面影响,从而极大提高了灵敏放大器的速度。同时,通过对时序控制电路的优化,有效降低了放大器的功耗。采用SMIC0．13μm数字工艺在HSpice下进行仿真,结果表明：在室温,1．2V工作电压下,灵敏放大器的放大延迟仅为0．344ns,功耗为102μw。相比文献中提出的电流型灵敏放大器,速度分别提高了9．47％和31．2％,功耗则降低了64．8％与63％。     

SRAM灵敏放大器的设计改进及其Hspice仿真分析

静态随机存取存储器（SRAM）由于其自身的低功耗和高速的优势而成为半导体存储器中不可或缺的重要产品。提高和改善静态存储器的性能依然是集成电路设计领域的重要课题。从降低静态存储器功耗的角度出发，重点研究了静态存储器的关键模块——灵敏放大器的工作机理和结构，设计了一种改进型的锁存型灵敏放大器，Hspice的仿真表明，该放大器的功耗大大低于传统的静态存储器的灵敏放大器模块的功耗。     

一款异步256kB SRAM的设计

在集成电路设计制造水平不断提高的今天,SRAM存储器不断朝着大容量、高速度、低功耗的方向发展。文章提出了一款异步256kB(256k×1)SRAM的设计,该存储器采用了六管CMOS存储单元、锁存器型灵敏放大器、ATD电路,采用0.5μm体硅CMOS工艺,数据存取时间为12ns。     

具有低失调电压的新型灵敏放大器设计

由于器件尺寸越来越小,器件之间的失配越来越严重,由器件失配引起的失调电压对灵敏放大器性能的影响越来越大。针对此情况,根据灵敏放大器的工作原理,提出了一种具有失调电压自调整的灵敏放大器,通过增加校准支路来平衡灵敏放大器两边的放电速度,从而降低失调电压,减小其对灵敏放大器性能的影响。基于SMIC 65 nm CMOS工艺的后仿真结果显示,在电源电压1.2 V、TT工艺角、室温条件下,相比于传统的灵敏放大器,该新型灵敏放大器的失调电压的标准偏差降低了61.9%,SRAM的读关键路径延迟降低了25%。     

基于SRAM高速灵敏放大器的分析与设计

在SOC系统级芯片中,存储器占有很重要的地位。随着电路频率的提高,存储器的读写操作速度也要求相应的加快。SRAM中的灵敏放大器通过检测位线上的微小变化并放大到较大的信号摆幅以减少延时,降低功耗。本文提出了一种两级串联结构的SRAM高性能灵敏放大器的设计方法,降低了对信号的反应时间,提高了抗干扰能力,适应高频电路的读写操作。     

一种优化低电压SRAM灵敏放大器时序的4T双复制位线延迟技术

提出一种减少SRAM存取时间的4T双复制位线延迟技术.该技术主要降低灵敏放大器使能信号的时序变化.该设计通过增加另外一根复制位线并提出一种新的4T复制单元,以优化低电压SRAM灵敏放大器的时序.TSMC 65nm工艺仿真结果表明,在0.6V电源电压下,与传统复制位线设计相比,该技术的灵敏放大器使能信号时序的标准偏差降低30.8%,其读周期减少12.3%.除此之外,由于4T复制单元的MOS管数与传统复制单元相比降低1/3,减小了整体面积开销.     

一种新型的SOI灵敏放大器

本文利用"灵巧的体接触(Smart-Body-Contact)"技术设计出一种新型的SOI灵敏放大器.采用Hspice软件对体硅的和新型的交叉耦合灵敏放大器进行模拟和比较,发现新型的交叉耦合灵敏放大器比体硅的交叉耦合灵敏放大器延迟时间缩短30%,最小电压分辨可达0.05V.最后,我们成功地将该电路应用于CMOS/SOI 64Kb SRAM电路,电路存取时间仅40ns.     

一种应用于DSP嵌入式存储器的灵敏放大器设计

提出了一种新型灵敏放大器,电路由单位增益电流传输器、电荷转移放大器及锁存器三部分组成。基于0.18μm标准CMOS单元库的仿真结果表明,与现有几种灵敏放大器相比,新型灵敏放大器具有更低的延时和功耗,在1.8 V工作电压、500 MHz工作频率、80μA输入差动电流以及DSP嵌入式SRAM6T存储单元测试结构下,每个读周期的延迟为728 ps,功耗为10.5fJ。与电压灵敏放大器相比,延迟减少约41%,功耗降低约50%;与常规电荷转移灵敏放大器相比,延迟减少约22%,功耗降低约37%;与WTA电流灵敏放大器相比,延迟减少11%,功耗降低31.8%。     

A 1.8-ns access, 550-MHz, 4.5-Mb CMOS SRAM

An ultrahigh-speed 4.5-Mb CMOS SRAM with 1.8-ns clock-access time, 1.8-ns cycle time, and 9.84-μm² memory cells has been developed using 0.25-μm CMOS technology. Three key circuit techniques for achieving this high speed are a decoder using source-coupled-logic (SCL) circuits combined with reset circuits, a sense amplifier with nMOS source followers, and a sense-amplifier activation-pulse generator that uses a duplicate memory-cell array. The proposed decoder can reduce the delay time between the address input and the word-line signal of the 4.5-Mb SRAM to 68% of that of an SRAM with conventional circuits. The sense amplifier with nMOS source followers can reduce not only the delay time of the sense amplifier but also the power dissipation. In the SRAM, the sense-amplifier activation pulse must be input into the sense amplifier after the signal from the memory cell is input into the sense amplifier. A large timing margin required between these signals results in a large access time in the conventional SRAM. The sense-amplifier activation pulse generator that uses a duplicate memory-cell array can reduce the required timing margin to less than half of the conventional margin. These three techniques are especially useful for realizing ultrahigh-speed SRAM's, which will be used as on-chip or off-chip cache memories in processor systems     

一种高速CMOS SRAM读出灵敏放大器的设计

提出了一种ＣＭＯＳ ＳＲＡＭ读出灵敏放大器的新结构。该放大器同传统的ＰＭＯＳ电流镜放大器和ＰＭＯＳ交叉耦合放大器相比，具有速度快、增益大、功耗小等特点，可广泛应用于ＳＲＡＭ的设计中。最后，用ＨＳＰＩＣＥ的仿真结果证明了该设计的正确性及其优点。     

Impact and mitigation of SRAM read path aging

This paper proposes an appropriate method to estimate and mitigate the impact of aging on the read path of a high performance SRAM design; it analyzes the impact of the memory cell, and sense amplifier (SA), and their interaction. The method considers different workloads, technology nodes, and inspects both the bit-line swing (BLS) (which reflect the degradation of the cell) and the sensing delay (SD) (which reflects the degradation of the sense amplifier); the voltage swing on the bit lines has a direct impact on the proper functionality of the sense amplifier. The results with respect to the quantification of the aging, show for the considered SRAM read-path design that the cell degradation is marginal as compared to the sense amplifier, while the SD degradation strongly depends on the workload, supply voltage, temperature, and technology nodes (up to 41% degradation). The mitigation schemes, one targeting the cell and one the sense amplifier, confirm the same and show that sense amplifier mitigation (up to 15.2% improvement) is more effective for the SRAM read path than cell mitigation (up to 11.4% improvement).     

A 150 ns 16-Mb CMOS SRAM with interdigitated bit-line architecture

Circuit techniques for a reduced-voltage-amplitude data bus, fast access 16-Mb CMOS SRAM are described. An interdigitated bit-line architecture reduces data bus line length, thus minimizing bus capacitance. A hierarchical sense amplifier consists of 32 local sense amplifiers and a current sense amplifier. The current sense amplifier is used to reduce the data bus voltage amplitude and the sensing of the 16-b data bus signals in parallel. Access time of 15 ns and an active power of 165 mW were achieved in a 16-Mb CMOS SRAM. A split-word-line layout memory cell with double-gate pMOS thin-film transistors (TFTs) keeps the transistor width stable while providing high-stability memory cell characteristics. The double-gate pMOS TFT also increases cell-storage node capacitance and soft-error immunity     

A Resilient and Power-Efficient Automatic-Power-Down Sense Amplifier for SRAM Design

A conventional latch-type sense amplifier in a static random access memory (SRAM) could trigger sensing failure under severe process variation. On the other hand, a traditional current-mirror sense amplifier could consume too much power. To strike a good balance, this paper presents an automatic-power-down (APD) sense amplifier, which can avoid sensing failure while keeping the power dissipation low. In this scheme, the operation window of the sense amplifier is adaptive to the real silicon speed of its associated column through Schmitt–Trigger-based dual-$V _{rm HL}$ APD circuitry. A 64-kb SRAM design using the proposed technique in a 22-nm predictive technology model demonstrates that a power savings of 28%–87% over the traditional current-mirror sense amplifier is achievable.      

A current-controlled latch sense amplifier and a staticpower-saving input buffer for low-power architecture

Two new power-saving schemes for high-performance VLSIs with a large-scale memory and many interface signals are described. One is a current-controlled latch sense amplifier that reduces the power dissipation by stopping sense current automatically. This sense amplifier reduces power without degrading access time compared with the conventional current-mirror sense amplifier. The other is a static power-saving input buffer (SPSIB) that reduces DC current in interface circuits receiving TTL high input level. The effectiveness of these new circuits is demonstrated with a 512-kb high-speed SRAM     

A 9-ns 1-Mbit CMOS SRAM

A 1-Mbit CMOS static RAM (SRAM) with a typical address access time of 9 ns has been developed. A high-speed sense amplifier circuit, consisting of a three-stage PMOS cross-coupled sense amplifier with a CMOS preamplifier, is the key to the fast access time. A parallel-word-access redundancy architecture, which causes no access time penalty, was also incorporated. A polysilicon PMOS load memory cell, which had a large on-current-to-off-current ratio, gave a much lower soft-error rate than a conventional high-resistance polysilicon load cell. The 1-Mbit SRAM, fabricated using a half-micrometer, triple-poly, and double-metal CMOS technology, operated at a single supply voltage of 5 V. An on-chip power supply converter was incorporated in the SRAM to supply a partial internal supply voltage of 4 V to the high-performance half-micrometer MOS transistors.<>